---
type: "product_component"
title: "Aluminum Extruded Heat Sink"
industry: "Aluminum Product Manufacturing"
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attributes:
  base_thickness:
    status: "config-dependent"
    typical_range: "0-150°C"
    unit: "mm"
  thermal_resistance:
    status: "config-dependent"
    typical_range: "0-150°C"
    unit: "°C/W"
engineering_limits:
  max_safe_operating_point:
    value: 660.3
    unit: "°C"
    consequence: "Thermal conductivity degradation due to recrystallization and grain growth above 300°C, reducing heat transfer efficiency by 40-60%"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal interface material degradation with thermal conductivity dropping below 1.5 W/m·K"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Phase change material interface with thermal conductivity maintained at 3.5 W/m·K across -40°C to 150°C"
  - node_2:
      trigger: "Fin deformation due to compressive stress exceeding aluminum's yield strength of 40 MPa"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "6063-T5 aluminum alloy with yield strength of 145 MPa and fin thickness minimum of 1.2 mm"
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manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/aluminum-product-manufacturing/product/aluminum-extruded-heat-sink.md"
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    - "custom aluminum extruded heat sink"
    - "6063 alloy heat sink for electronics"
    - "anodized aluminum cooling fins"
    - "extruded heat sink with mounting holes"
    - "thermal management aluminum component"
    - "Aluminum Extruded Heat Sink in "
    - "China Aluminum Extruded Heat Sink manufacturer"
    - "Aluminum Extruded Heat Sink supplier China"
    - "Aluminum Extruded Heat Sink base_thickness"
    - "Aluminum Extruded Heat Sink thermal_resistance"

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version: "3.3.5-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Aluminum Extruded Heat Sink

## 1. Technical Definition
Aluminum extruded component for thermal management in electronic devices

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-150°C**. Failure boundary: **Aluminum melting point at 660.3°C**, Mechanism: **Thermal conductivity degradation due to recrystallization and grain growth above 300°C, reducing heat transfer efficiency by 40-60%**.

### 2.1 Analytical Physics Model
Governed by the **LMTD Logarithmic Mean Temperature Difference**:

> **Primary Equation**: $Q = U \cdot A \cdot \Delta T_{lm}$  
> **Engineering Impact**: Sizing validation for pasteurization and cooling tunnels.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| U | Heat Transfer Coeff | Engineering Constant |
| A | Area | Engineering Constant |
| \Delta T_{lm} | LMTD | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal interface material degradation with thermal conductivity dropping below 1.5 W/m·K | 8 | Thermal resistance increase exceeding 0.5°C/W, causing junction temperature rise above 125°C | Phase change material interface with thermal conductivity maintained at 3.5 W/m·K across -40°C to 150°C |
| Fin deformation due to compressive stress exceeding aluminum's yield strength of 40 MPa | 8 | Airflow reduction below 2.0 m/s, increasing thermal resistance by 25% | 6063-T5 aluminum alloy with yield strength of 145 MPa and fin thickness minimum of 1.2 mm |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| base_thickness | Config-dependent | mm | Verified |
| thermal_resistance | Config-dependent | °C/W | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Extrusion Press**, **CNC Machining Center**, **Anodizing Line**  
**Downstream Applications**: LED Lighting Fixtures, Computer CPU Coolers, Power Supply Units  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the advantages of aluminum extruded heat sinks over other types?
**A**: Aluminum extruded heat sinks offer excellent thermal conductivity, lightweight construction, corrosion resistance with anodized coating, and cost-effective mass production capabilities for consistent thermal management.

### Q: Can you customize the base dimensions and fin count for specific applications?
**A**: Yes, we provide fully customizable aluminum extruded heat sinks with adjustable base length/width, fin count, fin height, and material grade (6061 or 6063) to meet precise thermal requirements.

### Q: What industries commonly use aluminum extruded heat sinks?
**A**: These heat sinks are widely used in electronics manufacturing, LED lighting, power supplies, automotive electronics, telecommunications equipment, and computing devices for efficient thermal dissipation.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Aluminum Extruded Heat Sink](https://cnfx.com/industry/aluminum-product-manufacturing/product/aluminum-extruded-heat-sink)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ALUMINUM_EXTRUDED_HEAT_SINK | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 45381725