---
title: "3-Axis Gyroscope"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:3_AXIS_GYROSCOPE"
  data_integrity_hash: "c9160aab719fcc3afdb152d11891bf28"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:3_AXIS_GYROSCOPE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/3-axis-gyroscope.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/3-axis-gyroscope"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "±2000°/s angular velocity, -40°C to +85°C temperature, 3.3V ±5% supply voltage"
    unit: "°/s"
engineering_limits:
  max_safe_operating_point:
    value: 3000
    unit: "°"
    consequence: "Coriolis effect principle failure due to MEMS resonator amplitude collapse at excessive angular rates, silicon thermal expansion coefficient mismatch (2.6×10⁻⁶/°C) causing capacitive plate misalignment beyond temperature limits, CMOS transistor threshold voltage shift (0.7V) disrupting signal conditioning circuitry"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Mechanical shock exceeding 10,000g for 0.1ms"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Dual-stage mechanical isolation with silicone gel damping (Shore A 30) and titanium constraint stops"
  - node_2:
      trigger: "Electrostatic discharge of 8kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated TVS diodes with 5pF capacitance and 1Ω series resistors on all I/O lines"
bom_nodes:
  proof-mass:
    type: "component"
    urn: "URN:CNFX:ME:PROOF_MASS"
    interface_type: "physical-logic-coupled"
  drive-mechanism:
    type: "part"
    urn: "URN:CNFX:ME:DRIVE_MECHANISM"
    interface_type: "physical-logic-coupled"
  sense-electrodescombs:
    type: "component"
    urn: "URN:CNFX:ME:SENSE_ELECTRODESCOMBS"
    interface_type: "physical-logic-coupled"
  asic-application-specific-integrated-circuit:
    type: "part"
    urn: "URN:CNFX:ME:ASIC_APPLICATION_SPECIFIC_INTEGRATED_CIRCUIT"
    interface_type: "physical-logic-coupled"
  package:
    type: "part"
    urn: "URN:CNFX:ME:PACKAGE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 8727:2017 - GYROSCOPIC INSTRUMENTS"
    scope: "Verified Engineering Specification"
  - standard: "IEC 60529:1989 - DEGREES OF PROTECTION PROVIDED BY ENCLOSURES (IP CODE)"
    scope: "Verified Engineering Specification"
  - standard: "EN 61340-5-1:2007 - ELECTROSTATIC PROTECTION"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/3-axis-gyroscope.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "49d68d193beb039d1635508f725b96de6066b7b96a7085570626f39f7daf12b0"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: 3-Axis Gyroscope

## 1. Technical Definition
A sensor that measures angular velocity around three orthogonal axes (X, Y, Z).

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **±2000°/s angular velocity, -40°C to +85°C temperature, 3.3V ±5% supply voltage**. Failure boundary: **Angular velocity exceeding ±3000°/s causes sensor saturation, temperature beyond -55°C/+125°C induces MEMS structural deformation, supply voltage outside 2.97V-3.47V triggers analog-to-digital converter malfunction**, Mechanism: **Coriolis effect principle failure due to MEMS resonator amplitude collapse at excessive angular rates, silicon thermal expansion coefficient mismatch (2.6×10⁻⁶/°C) causing capacitive plate misalignment beyond temperature limits, CMOS transistor threshold voltage shift (0.7V) disrupting signal conditioning circuitry**.

### 2.1 Analytical Physics Model
Governed by the **L10 Bearing Life & Fatigue Model**:

> **Primary Equation**: $L_{10} = (\frac{C}{P})^p$  
> **Engineering Impact**: Predicts mechanical lifecycle before component fatigue.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| C | Dynamic Load Rating | Engineering Constant |
| P | Equivalent Dynamic Load | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Mechanical shock exceeding 10,000g for 0.1ms | 8 | MEMS proof mass fracture at anchor points | Dual-stage mechanical isolation with silicone gel damping (Shore A 30) and titanium constraint stops |
| Electrostatic discharge of 8kV human body model | 8 | Gate oxide breakdown in ASIC readout circuitry | Integrated TVS diodes with 5pF capacitance and 1Ω series resistors on all I/O lines |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | °/s | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Drive Mechanism](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/drive-mechanism.md) `(Standalone System)`
- [ASIC (Application-Specific Integrated Circuit)](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/asic-application-specific-integrated-circuit.md) `(Standalone System)`
- [Package](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/package.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wafer Prober**, **Wire Bonder**, **Clean Room Environment**  
**Downstream Applications**: Smartphones, Drones, Virtual Reality Headsets  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the main applications for a 3-axis gyroscope in computer and optical product manufacturing?
**A**: 3-axis gyroscopes are essential for motion sensing in robotics, camera stabilization systems, virtual reality headsets, drones, and industrial automation equipment where precise angular velocity measurement is required.

### Q: How does the MEMS silicon construction affect gyroscope performance?
**A**: MEMS silicon construction enables miniaturization, lower power consumption, and high reliability while maintaining precision. The silicon proof mass and sense electrodes provide accurate angular velocity detection with excellent thermal stability.

### Q: What role does the ASIC play in a 3-axis gyroscope system?
**A**: The ASIC (Application-Specific Integrated Circuit) processes raw sensor data from the MEMS element, providing signal conditioning, temperature compensation, digital output, and communication interfaces for integration with host systems.

## 6. Manufacturing Compliance
- ISO 8727:2017 - GYROSCOPIC INSTRUMENTS
- IEC 60529:1989 - DEGREES OF PROTECTION PROVIDED BY ENCLOSURES (IP CODE)
- EN 61340-5-1:2007 - ELECTROSTATIC PROTECTION

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: 3-Axis Gyroscope](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/3-axis-gyroscope)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: 3_AXIS_GYROSCOPE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: ed9f7d4f
