---
title: "Active Device"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ACTIVE_DEVICE"
  data_integrity_hash: "d115cfbc43af364a48f8c29f8ba9ef75"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ACTIVE_DEVICE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/active-device.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/active-device"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "3.3-24 VDC, -40 to +85 °C, 0-95% relative humidity non-condensing"
    unit: "dB"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Thermal runaway due to positive temperature coefficient in semiconductor materials, dielectric breakdown in gate oxide layers at 5-10 MV/cm electric field strength, electromigration in aluminum interconnects at current densities &gt; 1×10⁶ A/cm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Transient voltage spike exceeding 35 VDC for &gt; 100 μs"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diode clamping at 30 VDC with response time &lt; 1 ns, ferrite bead filtering with impedance &gt; 100 Ω at 100 MHz"
  - node_2:
      trigger: "Sustained operation at ambient temperature &gt; 85°C with inadequate heat sinking"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper heat spreader with thermal conductivity &gt; 400 W/m·K, thermal interface material with thermal resistance &lt; 0.5 °C/W"
bom_nodes:
  semiconductor-substrate:
    type: "component"
    urn: "URN:CNFX:ME:SEMICONDUCTOR_SUBSTRATE"
    interface_type: "physical-logic-coupled"
  junction-region:
    type: "component"
    urn: "URN:CNFX:ME:JUNCTION_REGION"
    interface_type: "physical-logic-coupled"
  terminal-contacts:
    type: "component"
    urn: "URN:CNFX:ME:TERMINAL_CONTACTS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 13485:2016 - MEDICAL DEVICES"
    scope: "Verified Engineering Specification"
  - standard: "IEC 60601-1:2005 - MEDICAL ELECTRICAL EQUIPMENT"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/active-device.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "aaaccdb37e6cab169f7d781df439dc93a3832c6f2bd4a5d6e33359694007b779"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Active Device

## 1. Technical Definition
Electronic component that requires external power to operate and can amplify, switch, or process signals

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **3.3-24 VDC, -40 to +85 °C, 0-95% relative humidity non-condensing**. Failure boundary: **Semiconductor junction temperature exceeding 150°C, supply voltage exceeding absolute maximum rating by 20% (28.8 VDC for 24V nominal), electrostatic discharge &gt; 2000 V HBM**, Mechanism: **Thermal runaway due to positive temperature coefficient in semiconductor materials, dielectric breakdown in gate oxide layers at 5-10 MV/cm electric field strength, electromigration in aluminum interconnects at current densities &gt; 1×10⁶ A/cm²**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Transient voltage spike exceeding 35 VDC for &gt; 100 μs | 8 | Gate oxide breakdown causing permanent short circuit between source and drain terminals | TVS diode clamping at 30 VDC with response time &lt; 1 ns, ferrite bead filtering with impedance &gt; 100 Ω at 100 MHz |
| Sustained operation at ambient temperature &gt; 85°C with inadequate heat sinking | 8 | Thermal stress-induced delamination of wire bonds, increasing contact resistance from 50 mΩ to &gt; 500 mΩ | Copper heat spreader with thermal conductivity &gt; 400 W/m·K, thermal interface material with thermal resistance &lt; 0.5 °C/W |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | dB | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Power Supply Unit**, **Signal Generator**, **Oscilloscope**  
**Downstream Applications**: Smartphones, Medical Diagnostic Equipment, Automotive Control Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is an active device in electronics?
**A**: An active device is an electronic component that requires external power to operate and can amplify, switch, or process electrical signals, unlike passive components like resistors or capacitors.

### Q: What materials are used in active devices?
**A**: Active devices typically use semiconductor silicon as the substrate, doped semiconductor materials to create junction regions, and metal contacts for terminal connections.

### Q: How are active devices used in computer and optical manufacturing?
**A**: In computer and optical product manufacturing, active devices are crucial for processing signals in circuits, enabling functions like data amplification in computers and signal switching in optical systems.

## 6. Manufacturing Compliance
- ISO 13485:2016 - MEDICAL DEVICES
- IEC 60601-1:2005 - MEDICAL ELECTRICAL EQUIPMENT

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Active Device](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/active-device)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ACTIVE_DEVICE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: b830cad6
