---
title: "Aggregation Logic Unit"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:AGGREGATION_LOGIC_UNIT"
  data_integrity_hash: "f4efa08eed306301bb21a2e87f87ac7a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:AGGREGATION_LOGIC_UNIT"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/aggregation-logic-unit.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/aggregation-logic-unit"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-5 VDC input voltage, 0-100 mA current draw, -40°C to +85°C ambient temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 5.5
    unit: "VDC"
    consequence: "Electromigration in 7 nm FinFET transistors at current densities &gt; 10^6 A/cm², dielectric breakdown at electric fields &gt; 10 MV/cm, dopant diffusion acceleration at Arrhenius activation energy of 1.1 eV"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Clock signal jitter exceeding 50 ps RMS"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Phase-locked loop with 0.1 ppm stability and jitter attenuation filter at 100 kHz cutoff"
  - node_2:
      trigger: "Alpha particle strike with linear energy transfer &gt; 1.5 MeV·cm²/mg"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Triple modular redundancy with 2-out-of-3 voting logic and error-correcting code memory"
bom_nodes:
  memory-module:
    type: "part"
    urn: "URN:CNFX:ME:MEMORY_MODULE"
    interface_type: "physical-logic-coupled"
  output-driver:
    type: "part"
    urn: "URN:CNFX:ME:OUTPUT_DRIVER"
    interface_type: "physical-logic-coupled"
  input-interface-circuit:
    type: "component"
    urn: "URN:CNFX:ME:INPUT_INTERFACE_CIRCUIT"
    interface_type: "physical-logic-coupled"
  processing-core:
    type: "part"
    urn: "URN:CNFX:ME:PROCESSING_CORE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU CONFORMITY FOR MACHINERY DIRECTIVE 2006/42/EC)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/aggregation-logic-unit.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8d67cabb4e6c9e7134537ee54f3114494642413bb7b4b82166e4286281e80bbc"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Aggregation Logic Unit

## 1. Technical Definition
A computational component within a Score Aggregator that processes and combines multiple input scores according to predefined algorithms.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-5 VDC input voltage, 0-100 mA current draw, -40°C to +85°C ambient temperature**. Failure boundary: **Input voltage exceeding 5.5 VDC causes CMOS gate oxide breakdown, current draw exceeding 120 mA induces thermal runaway, ambient temperature exceeding 90°C triggers silicon junction failure**, Mechanism: **Electromigration in 7 nm FinFET transistors at current densities &gt; 10^6 A/cm², dielectric breakdown at electric fields &gt; 10 MV/cm, dopant diffusion acceleration at Arrhenius activation energy of 1.1 eV**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Clock signal jitter exceeding 50 ps RMS | 8 | Pipeline synchronization failure causing arithmetic overflow in accumulation registers | Phase-locked loop with 0.1 ppm stability and jitter attenuation filter at 100 kHz cutoff |
| Alpha particle strike with linear energy transfer &gt; 1.5 MeV·cm²/mg | 8 | Single-event upset flipping critical configuration bits in SRAM-based lookup tables | Triple modular redundancy with 2-out-of-3 voting logic and error-correcting code memory |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Memory Module](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/memory-module.md) `(Standalone System)`
- [Output Driver](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/output-driver.md) `(Standalone System)`
- [Processing Core](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/processing-core.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Power Supply Unit**, **Cooling System**, **Signal Conditioning Module**  
**Downstream Applications**: Integrated Scoring Systems, Automated Quality Control Units, Multi-Sensor Fusion Processors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of the Aggregation Logic Unit?
**A**: The Aggregation Logic Unit processes and combines multiple input scores according to predefined algorithms within a Score Aggregator system, enabling efficient computational analysis in electronic manufacturing applications.

### Q: What materials are used in the construction of the Aggregation Logic Unit?
**A**: The unit is constructed using silicon for semiconductor components, copper for electrical conductivity in circuits, and plastic for housing and insulation, ensuring durability and optimal performance in computer and optical product manufacturing.

### Q: What are the key components in the Aggregation Logic Unit's Bill of Materials (BOM)?
**A**: The BOM includes an Input Interface Circuit for receiving scores, a Processing Core for executing algorithms, a Memory Module for data storage, and an Output Driver for transmitting processed results to downstream systems.

## 6. Manufacturing Compliance
- ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)
- CE MARKING (EU CONFORMITY FOR MACHINERY DIRECTIVE 2006/42/EC)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Aggregation Logic Unit](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/aggregation-logic-unit)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: AGGREGATION_LOGIC_UNIT | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: d3597e8e
