---
title: "ANC Microphone Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ANC_MICROPHONE_ARRAY"
  data_integrity_hash: "653908cc68ca6823949c61a31dbc2997"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ANC_MICROPHONE_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/anc-microphone-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/anc-microphone-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "20-120 dB SPL (sound pressure level)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 140
    unit: "dB"
    consequence: "Microphone diaphragm mechanical deformation exceeding 0.5 mm displacement or piezoelectric element depolarization at 150°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diode array with 5 ns response time and 15 kV clamping voltage integrated at each microphone input"
  - node_2:
      trigger: "Condensation accumulation exceeding 0.1 mL within microphone housing"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Hydrophobic membrane with 0.5 μm pore size and 95% water repellency rating"
bom_nodes:
  mems-microphone-elements:
    type: "component"
    urn: "URN:CNFX:ME:MEMS_MICROPHONE_ELEMENTS"
    interface_type: "physical-logic-coupled"
  signal-processing-circuit:
    type: "part"
    urn: "URN:CNFX:ME:SIGNAL_PROCESSING_CIRCUIT"
    interface_type: "physical-logic-coupled"
  array-housing:
    type: "part"
    urn: "URN:CNFX:ME:ARRAY_HOUSING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 3744:2010 (ACOUSTICS - DETERMINATION OF SOUND POWER LEVELS AND SOUND ENERGY LEVELS OF NOISE SOURCES USING SOUND PRESSURE)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASA S12.10-2010 (ACOUSTICS - MEASUREMENT OF AIRBORNE NOISE EMITTED BY INFORMATION TECHNOLOGY AND TELECOMMUNICATIONS EQUIPMENT)"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU - LOW VOLTAGE DIRECTIVE FOR ELECTRICAL SAFETY)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/anc-microphone-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "e227921766af5f47ccf227fb563a7ae2ef4fce3d0a202cd40ef1a6f50dc9c1a3"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: ANC Microphone Array

## 1. Technical Definition
A multi-microphone system integrated into headphones that captures ambient sound for active noise cancellation processing.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **20-120 dB SPL (sound pressure level)**. Failure boundary: **140 dB SPL continuous exposure or 160 dB SPL transient exposure**, Mechanism: **Microphone diaphragm mechanical deformation exceeding 0.5 mm displacement or piezoelectric element depolarization at 150°C**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV | 8 | Pre-amplifier integrated circuit latch-up and permanent damage | TVS diode array with 5 ns response time and 15 kV clamping voltage integrated at each microphone input |
| Condensation accumulation exceeding 0.1 mL within microphone housing | 8 | Acoustic port blockage and diaphragm damping coefficient increase by 300% | Hydrophobic membrane with 0.5 μm pore size and 95% water repellency rating |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Signal Processing Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-processing-circuit.md) `(Standalone System)`
- [Array Housing](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/array-housing.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Acoustic Testing Chamber**  
**Downstream Applications**: Noise-Cancelling Headphones, Gaming Headsets, Professional Audio Headsets  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of an ANC microphone array in headphones?
**A**: The ANC microphone array captures ambient environmental sounds, which are then processed by the active noise cancellation system to generate anti-noise signals that cancel out unwanted background noise for the listener.

### Q: What materials are used in manufacturing ANC microphone arrays?
**A**: Typical materials include MEMS microphone elements for sound capture, PCB substrate for circuit mounting, copper wiring for electrical connections, and plastic housing for protection and integration into headphone designs.

### Q: How does the signal processing circuit work in an ANC microphone array?
**A**: The signal processing circuit analyzes audio signals from multiple MEMS microphones, applies algorithms to identify noise patterns, and generates inverse sound waves that cancel out ambient noise through the headphone speakers.

## 6. Manufacturing Compliance
- ISO 3744:2010 (ACOUSTICS - DETERMINATION OF SOUND POWER LEVELS AND SOUND ENERGY LEVELS OF NOISE SOURCES USING SOUND PRESSURE)
- ANSI/ASA S12.10-2010 (ACOUSTICS - MEASUREMENT OF AIRBORNE NOISE EMITTED BY INFORMATION TECHNOLOGY AND TELECOMMUNICATIONS EQUIPMENT)
- CE MARKING (EU DIRECTIVE 2014/35/EU - LOW VOLTAGE DIRECTIVE FOR ELECTRICAL SAFETY)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: ANC Microphone Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/anc-microphone-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ANC_MICROPHONE_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: cb946eaa
