---
title: "Anode Disc/Target"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ANODE_DISCTARGET"
  data_integrity_hash: "b9ea1f20c630818d8f7178c5596a53ca"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ANODE_DISCTARGET"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/anode-disctarget.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/anode-disctarget"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "200-400 kV electron bombardment energy, 100-3000 RPM rotational speed, 800-1200°C operating temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 3422
    unit: "°C"
    consequence: "Thermal fatigue from cyclic heating/cooling during tube operation, electron-induced sputtering causing surface erosion, centrifugal stress exceeding yield strength at high RPM"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Insufficient cooling flow (&lt;5 L/min water flow) causing localized overheating"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated temperature sensors with automatic power reduction at 1000°C, redundant cooling channels with 10 mm minimum wall thickness"
  - node_2:
      trigger: "Electron beam misalignment (&gt;2 mm deviation from focal spot center)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Electrostatic beam steering with 0.1 mm positional accuracy, real-time focal spot monitoring using infrared thermography"
bom_nodes:
  target-layer:
    type: "component"
    urn: "URN:CNFX:ME:TARGET_LAYER"
    interface_type: "physical-logic-coupled"
  substratedisc-body:
    type: "component"
    urn: "URN:CNFX:ME:SUBSTRATEDISC_BODY"
    interface_type: "physical-logic-coupled"
  focal-track:
    type: "part"
    urn: "URN:CNFX:ME:FOCAL_TRACK"
    interface_type: "physical-logic-coupled"
  mounting-hub:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_HUB"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - CONFORMITY WITH EU DIRECTIVES (E.G., MACHINERY DIRECTIVE 2006/42/EC)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/anode-disctarget.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "71fd8f4dfecb9edb6ed730ad652b0487a1e91c4c082d2056a7c2e7bcb93db86b"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Anode Disc/Target

## 1. Technical Definition
The rotating disc-shaped target material in X-ray tubes that emits X-rays when bombarded by electrons.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **200-400 kV electron bombardment energy, 100-3000 RPM rotational speed, 800-1200°C operating temperature**. Failure boundary: **Melting point of tungsten (3422°C) for thermal failure, 500 MPa tensile stress for mechanical fracture, 0.5 mm erosion depth for X-ray intensity degradation**, Mechanism: **Thermal fatigue from cyclic heating/cooling during tube operation, electron-induced sputtering causing surface erosion, centrifugal stress exceeding yield strength at high RPM**.

### 2.1 Analytical Physics Model
Governed by the **Heat Sterilization F0 Lethality Model**:

> **Primary Equation**: $F_0 = \int_{0}^{t} 10^{(T-121.1)/z} dt$  
> **Engineering Impact**: Validates microbial reduction integrity for aseptic packaging.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| T | Process Temp (°C) | **$T \in [800-1200°C]$ °C** (Per `temperature_range`) |
| t | Exposure Time (min) | Engineering Constant |
| z | Z-value | **10 °C** (Standard for *C. botulinum*) |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Insufficient cooling flow (&lt;5 L/min water flow) causing localized overheating | 8 | Thermal stress cracking propagating from focal spot region | Integrated temperature sensors with automatic power reduction at 1000°C, redundant cooling channels with 10 mm minimum wall thickness |
| Electron beam misalignment (&gt;2 mm deviation from focal spot center) | 8 | Non-uniform target erosion creating hot spots and reduced X-ray output | Electrostatic beam steering with 0.1 mm positional accuracy, real-time focal spot monitoring using infrared thermography |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Focal Track](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/focal-track.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **High-Vacuum Pump System**, **Electron Beam Gun Assembly**, **Cooling Water Circulation System**  
**Downstream Applications**: Medical X-ray Imaging Systems, Industrial CT Scanners, Security Screening Equipment  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications of anode discs/targets in computer and optical product manufacturing?
**A**: Anode discs/targets are critical components in X-ray tubes used for quality control, material analysis, and non-destructive testing during the manufacturing of semiconductors, circuit boards, and optical components.

### Q: Why are tungsten and tungsten-rhenium alloys preferred for anode target layers?
**A**: Tungsten and W-Re alloys offer high melting points, excellent thermal conductivity, and efficient X-ray emission properties, making them ideal for withstanding electron bombardment while maintaining precise X-ray output in demanding industrial applications.

### Q: How does the molybdenum substrate enhance anode disc performance?
**A**: Molybdenum substrates provide superior heat dissipation, structural stability, and thermal expansion compatibility with tungsten layers, preventing warping and extending the operational lifespan of X-ray tubes in continuous manufacturing environments.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - CONFORMITY WITH EU DIRECTIVES (E.G., MACHINERY DIRECTIVE 2006/42/EC)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Anode Disc/Target](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/anode-disctarget)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ANODE_DISCTARGET | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 38249f1a
