---
title: "Antenna Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ANTENNA_ARRAY"
  data_integrity_hash: "aab61eba5d7dd3cdfb339eb3af721542"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ANTENNA_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/antenna-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/antenna-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1.8-6.0 GHz frequency range, -40°C to +85°C operating temperature, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "°"
    consequence: "Thermal expansion mismatch between silicon substrate (CTE 2.6 ppm/°C) and FR-4 PCB (CTE 14-18 ppm/°C) causing solder joint fatigue, dielectric breakdown at &gt;3 kV/mm in substrate material"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Corrosion of aluminum radiating elements due to chloride ion concentration &gt;100 ppm in coastal environments"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with parylene-C (25-75 μm thickness), hermetic sealing with IP67 rating, cathodic protection system"
  - node_2:
      trigger: "Phase shifter IC thermal runaway at &gt;150°C junction temperature due to inadequate heat sinking"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Thermal vias with 0.3 mm pitch, copper heat spreader with 35 W/m·K conductivity, active cooling with 12 VDC fans at 15 CFM minimum"
bom_nodes:
  antenna-element:
    type: "component"
    urn: "URN:CNFX:ME:ANTENNA_ELEMENT"
    interface_type: "physical-logic-coupled"
  feed-network:
    type: "part"
    urn: "URN:CNFX:ME:FEED_NETWORK"
    interface_type: "physical-logic-coupled"
  ground-plane:
    type: "component"
    urn: "URN:CNFX:ME:GROUND_PLANE"
    interface_type: "physical-logic-coupled"
  mounting-structure:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_STRUCTURE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE DIRECTIVE 2014/53/EU RADIO EQUIPMENT DIRECTIVE"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/antenna-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "356f39370fc8d69a10a967feb93dcf95df015dca5463e3b91191d7f63b3cfd6a"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Antenna Array

## 1. Technical Definition
A group of multiple antenna elements arranged in a specific pattern to enhance signal reception and transmission capabilities.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1.8-6.0 GHz frequency range, -40°C to +85°C operating temperature, 0-100% relative humidity (non-condensing)**. Failure boundary: **Element phase shift &gt;15° from design specification, VSWR &gt;2.0:1, element coupling &gt;-20 dB, temperature &gt;125°C junction temperature**, Mechanism: **Thermal expansion mismatch between silicon substrate (CTE 2.6 ppm/°C) and FR-4 PCB (CTE 14-18 ppm/°C) causing solder joint fatigue, dielectric breakdown at &gt;3 kV/mm in substrate material**.

### 2.1 Analytical Physics Model
Governed by the **EMI Shielding Effectiveness (SE)**:

> **Primary Equation**: $SE = 20 \log(\frac{E_{in}}{E_{out}})$  
> **Engineering Impact**: Ensures control stability in high-frequency inverter zones.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| E_{in} | Incident Field | Engineering Constant |
| E_{out} | Transmitted Field | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Corrosion of aluminum radiating elements due to chloride ion concentration &gt;100 ppm in coastal environments | 8 | Increased insertion loss &gt;3 dB, pattern distortion &gt;5° beamwidth deviation | Conformal coating with parylene-C (25-75 μm thickness), hermetic sealing with IP67 rating, cathodic protection system |
| Phase shifter IC thermal runaway at &gt;150°C junction temperature due to inadequate heat sinking | 8 | Beam steering failure &gt;2° pointing error, array gain reduction &gt;6 dB | Thermal vias with 0.3 mm pitch, copper heat spreader with 35 W/m·K conductivity, active cooling with 12 VDC fans at 15 CFM minimum |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Feed Network](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/feed-network.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **RF Signal Generator**, **Network Analyzer**, **Automated Test Equipment (ATE)**  
**Downstream Applications**: 5G Base Stations, Satellite Communication Systems, Radar Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the main advantages of using an antenna array in electronic products?
**A**: Antenna arrays provide superior signal directionality, increased gain, and improved signal-to-noise ratio compared to single antennas, making them ideal for applications requiring reliable wireless communication in electronic devices.

### Q: How does the material selection affect antenna array performance?
**A**: Copper offers excellent conductivity for signal efficiency, aluminum provides lightweight durability, FR-4 ensures stable dielectric properties, and polymer composites enhance environmental resistance—optimizing both performance and longevity.

### Q: What factors should be considered when integrating an antenna array into optical product manufacturing?
**A**: Key considerations include spatial constraints, electromagnetic compatibility with optical components, mounting structure stability, and alignment with regulatory standards for signal emissions and interference.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE DIRECTIVE 2014/53/EU RADIO EQUIPMENT DIRECTIVE

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Antenna Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/antenna-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ANTENNA_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 103d2ce6
