---
title: "Antenna/Scanner Head"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ANTENNASCANNER_HEAD"
  data_integrity_hash: "07615770877f0dc1d7b8aa0cc4af0b86"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ANTENNASCANNER_HEAD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/antennascanner-head.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/antennascanner-head"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.4-5.8 GHz frequency, -40 to +85°C temperature, 0-95% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 500
    unit: "V"
    consequence: "Dielectric breakdown in RF substrate materials (FR4, Rogers 4003C) at high electric fields, thermal expansion mismatch between silicon die (2.6 ppm/°C CTE) and PCB substrate (14-17 ppm/°C CTE) causing solder joint fatigue"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) exceeding 8 kV Human Body Model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with &lt;1 ns response time and 15 kV IEC 61000-4-2 rating"
  - node_2:
      trigger: "Cyclic thermal stress from 1000+ daily power cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 lead-free solder with copper pillar bump technology and underfill encapsulation"
bom_nodes:
  antenna-coil:
    type: "component"
    urn: "URN:CNFX:ME:ANTENNA_COIL"
    interface_type: "physical-logic-coupled"
  ferrite-core:
    type: "component"
    urn: "URN:CNFX:ME:FERRITE_CORE"
    interface_type: "physical-logic-coupled"
  housing:
    type: "component"
    urn: "URN:CNFX:ME:HOUSING"
    interface_type: "physical-logic-coupled"
  connector:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - ELECTROMAGNETIC COMPATIBILITY DIRECTIVE 2014/30/EU"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/antennascanner-head.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "58cafa5884045c8dfb866b522fa8611519260ddc69cad64c76bd3ddec83ea645"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Antenna/Scanner Head

## 1. Technical Definition
The electromagnetic signal transmission/reception and scanning component of an identification reader

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.4-5.8 GHz frequency, -40 to +85°C temperature, 0-95% relative humidity (non-condensing)**. Failure boundary: **Dielectric breakdown at &gt;500 V/m electric field strength, permanent damage at &gt;125°C junction temperature, signal degradation at &gt;3 dB insertion loss**, Mechanism: **Dielectric breakdown in RF substrate materials (FR4, Rogers 4003C) at high electric fields, thermal expansion mismatch between silicon die (2.6 ppm/°C CTE) and PCB substrate (14-17 ppm/°C CTE) causing solder joint fatigue**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) exceeding 8 kV Human Body Model | 8 | RF amplifier transistor gate oxide breakdown with permanent 15 dB gain reduction | Integrated ESD protection diodes with &lt;1 ns response time and 15 kV IEC 61000-4-2 rating |
| Cyclic thermal stress from 1000+ daily power cycles | 8 | Solder joint fatigue cracking at BGA connections causing intermittent signal loss | SAC305 lead-free solder with copper pillar bump technology and underfill encapsulation |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **RF Signal Generator**, **Network Analyzer**, **Antenna Positioner**  
**Downstream Applications**: RFID Readers, Barcode Scanners, Wireless Communication Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this antenna/scanner head?
**A**: This component serves as the electromagnetic signal transmission and reception unit in identification readers, enabling reliable data scanning and communication through its copper coil and ferrite core design.

### Q: What materials ensure durability and performance?
**A**: Constructed with a copper coil for optimal conductivity, ferrite core for magnetic efficiency, plastic housing for protection, and PCB substrate for stable mounting, ensuring long-term reliability in industrial environments.

### Q: How does this scanner head integrate with identification systems?
**A**: It connects via standard connectors to reader electronics, with the antenna coil and ferrite core working together to transmit/receive signals, making it compatible with various RFID and scanning applications in electronic manufacturing.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - ELECTROMAGNETIC COMPATIBILITY DIRECTIVE 2014/30/EU

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Antenna/Scanner Head](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/antennascanner-head)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ANTENNASCANNER_HEAD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 5adc3a79
