---
title: "Bluetooth IC/Chipset"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:BLUETOOTH_ICCHIPSET"
  data_integrity_hash: "06472865d99b9f0725363c5e0131ad91"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:BLUETOOTH_ICCHIPSET"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-icchipset.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-icchipset"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.402-2.480 GHz (ISM band), -20 to +85°C ambient temperature, 1.8-3.6V supply voltage"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 40
    unit: "ppm"
    consequence: "Electromigration in sub-40nm CMOS transistors at current densities &gt; 1×10⁶ A/cm², dielectric breakdown at electric fields &gt; 10 MV/cm, phase noise degradation from oscillator Q-factor &lt; 10,000"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 2 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 5 Ω series resistance and 50 pF shunt capacitance at all I/O pins"
  - node_2:
      trigger: "Localized heating from adjacent power amplifier exceeding 150°C/mm² thermal flux"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "On-die thermal sensors with 0.5°C resolution triggering frequency hopping when ΔT &gt; 15°C"
bom_nodes:
  rf-transceiver:
    type: "part"
    urn: "URN:CNFX:ME:RF_TRANSCEIVER"
    interface_type: "physical-logic-coupled"
  baseband-processor:
    type: "part"
    urn: "URN:CNFX:ME:BASEBAND_PROCESSOR"
    interface_type: "physical-logic-coupled"
  protocol-stack:
    type: "component"
    urn: "URN:CNFX:ME:PROTOCOL_STACK"
    interface_type: "physical-logic-coupled"
  memory:
    type: "component"
    urn: "URN:CNFX:ME:MEMORY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO/IEC 17025:2017 - GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING UNDER RADIO EQUIPMENT DIRECTIVE (RED) 2014/53/EU"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-icchipset.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "889220d98e4e84539c25ada574acd14bb32e738a1130f5c868a4199449c657b7"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Bluetooth IC/Chipset

## 1. Technical Definition
Integrated circuit that implements Bluetooth wireless communication protocols and functions

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.402-2.480 GHz (ISM band), -20 to +85°C ambient temperature, 1.8-3.6V supply voltage**. Failure boundary: **Crystal oscillator frequency deviation &gt; ±40 ppm, junction temperature &gt; 125°C, supply voltage &lt; 1.62V or &gt; 3.8V**, Mechanism: **Electromigration in sub-40nm CMOS transistors at current densities &gt; 1×10⁶ A/cm², dielectric breakdown at electric fields &gt; 10 MV/cm, phase noise degradation from oscillator Q-factor &lt; 10,000**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 2 kV HBM | 8 | Gate oxide rupture in RF front-end transistors | Integrated ESD protection diodes with 5 Ω series resistance and 50 pF shunt capacitance at all I/O pins |
| Localized heating from adjacent power amplifier exceeding 150°C/mm² thermal flux | 8 | Thermally-induced carrier mobility reduction causing BER &gt; 10⁻³ at -70 dBm | On-die thermal sensors with 0.5°C resolution triggering frequency hopping when ΔT &gt; 15°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [RF Transceiver](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/rf-transceiver.md) `(Standalone System)`
- [Baseband Processor](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/baseband-processor.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wafer Fabrication Equipment**, **Wire Bonding Machine**, **Automated Test Equipment**  
**Downstream Applications**: Smartphones, Wireless Headphones, IoT Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key applications for this Bluetooth IC in computer and optical product manufacturing?
**A**: This Bluetooth IC is ideal for wireless peripherals (keyboards, mice), IoT devices, smart sensors, optical communication equipment, and industrial automation systems requiring reliable short-range wireless connectivity.

### Q: How does the RF transceiver component affect Bluetooth performance?
**A**: The integrated RF transceiver enables stable 2.4GHz signal transmission with adaptive frequency hopping, providing reliable connections up to 100 meters (depending on environment) while minimizing interference in crowded wireless environments.

### Q: What protocol stacks are supported by this Bluetooth chipset?
**A**: The IC supports Bluetooth 5.2 protocol stack including Classic Bluetooth for audio/data transfer and Bluetooth Low Energy (BLE) for power-efficient applications, with backward compatibility to earlier Bluetooth versions.

## 6. Manufacturing Compliance
- ISO/IEC 17025:2017 - GENERAL REQUIREMENTS FOR THE COMPETENCE OF TESTING AND CALIBRATION LABORATORIES
- CE MARKING UNDER RADIO EQUIPMENT DIRECTIVE (RED) 2014/53/EU

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Bluetooth IC/Chipset](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-icchipset)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: BLUETOOTH_ICCHIPSET | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 7589568c
