---
title: "Bluetooth Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:BLUETOOTH_MODULE"
  data_integrity_hash: "4f7bffcea1f400c706274e0f336f9129"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:BLUETOOTH_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.402-2.480 GHz (ISM band), -20 to +85°C, 1.8-3.6V DC"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 30
    unit: "dBm"
    consequence: "Dielectric breakdown in RF power amplifier (exceeding 3.5 MV/m), electromigration in IC interconnects (current density &gt; 1×10^6 A/cm²), thermal runaway in power management IC"
fmea_matrix_quantitative:
  - node_1:
      trigger: "ESD discharge exceeding 8 kV (Human Body Model)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with &lt;1 ns response time at all I/O ports, Faraday cage shielding"
  - node_2:
      trigger: "Crystal oscillator frequency drift beyond ±20 ppm due to thermal stress"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Temperature-compensated crystal oscillator (TCXO) with ±2.5 ppm stability, thermal isolation from heat sources"
bom_nodes:
  bluetooth-icchipset:
    type: "part"
    urn: "URN:CNFX:ME:BLUETOOTH_ICCHIPSET"
    interface_type: "physical-logic-coupled"
  rf-antenna:
    type: "component"
    urn: "URN:CNFX:ME:RF_ANTENNA"
    interface_type: "physical-logic-coupled"
  crystal-oscillator:
    type: "part"
    urn: "URN:CNFX:ME:CRYSTAL_OSCILLATOR"
    interface_type: "physical-logic-coupled"
  flash-memory:
    type: "component"
    urn: "URN:CNFX:ME:FLASH_MEMORY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO/IEC 17025:2017 (TESTING AND CALIBRATION LABORATORIES)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI C63.10-2020 (AMERICAN NATIONAL STANDARD FOR UNLICENSED PERSONAL COMMUNICATIONS SERVICES DEVICES)"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (DIRECTIVE 2014/53/EU - RADIO EQUIPMENT DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "d8cee7e5612d6e8ed5cd212aa2812c2b699fae0092850bc5ea1a413e57641374"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Bluetooth Module

## 1. Technical Definition
A compact electronic component that enables wireless Bluetooth connectivity and audio transmission.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.402-2.480 GHz (ISM band), -20 to +85°C, 1.8-3.6V DC**. Failure boundary: **RF output power drops below -30 dBm, BER exceeds 0.1%, thermal junction temperature exceeds 125°C**, Mechanism: **Dielectric breakdown in RF power amplifier (exceeding 3.5 MV/m), electromigration in IC interconnects (current density &gt; 1×10^6 A/cm²), thermal runaway in power management IC**.

### 2.1 Analytical Physics Model
Governed by the **EMI Shielding Effectiveness (SE)**:

> **Primary Equation**: $SE = 20 \log(\frac{E_{in}}{E_{out}})$  
> **Engineering Impact**: Ensures control stability in high-frequency inverter zones.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| E_{in} | Incident Field | Engineering Constant |
| E_{out} | Transmitted Field | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| ESD discharge exceeding 8 kV (Human Body Model) | 8 | RF front-end IC permanent damage | TVS diodes with &lt;1 ns response time at all I/O ports, Faraday cage shielding |
| Crystal oscillator frequency drift beyond ±20 ppm due to thermal stress | 8 | Bluetooth synchronization loss and protocol violation | Temperature-compensated crystal oscillator (TCXO) with ±2.5 ppm stability, thermal isolation from heat sources |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Bluetooth IC/Chipset](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-icchipset.md) `(Standalone System)`
- [Crystal Oscillator](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/crystal-oscillator.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Wireless Headphones, Smart Home Devices, Industrial IoT Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key components in this Bluetooth module?
**A**: The module includes a Bluetooth IC/chipset, crystal oscillator, flash memory, RF antenna, and SMD components on a PCB for reliable wireless connectivity.

### Q: How does this Bluetooth module support audio transmission?
**A**: It enables wireless audio streaming through its integrated Bluetooth IC and RF antenna, designed for clear transmission in electronic and optical products.

### Q: What industries commonly use this type of Bluetooth module?
**A**: It's ideal for computer, electronic, and optical product manufacturing, such as in wireless devices, audio systems, and IoT applications.

## 6. Manufacturing Compliance
- ISO/IEC 17025:2017 (TESTING AND CALIBRATION LABORATORIES)
- ANSI C63.10-2020 (AMERICAN NATIONAL STANDARD FOR UNLICENSED PERSONAL COMMUNICATIONS SERVICES DEVICES)
- CE MARKING (DIRECTIVE 2014/53/EU - RADIO EQUIPMENT DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Bluetooth Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/bluetooth-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: BLUETOOTH_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 82f0ee87
