---
title: "Camera module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:CAMERA_MODULE"
  data_integrity_hash: "1f2f2fd81d379be871b1e5dc8145571a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:CAMERA_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/camera-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/camera-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-70°C ambient temperature, 3.0-3.6V DC supply voltage, 0-95% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 85
    unit: "°C"
    consequence: "Silicon bandgap narrowing at elevated temperatures causing dark current doubling every 7-10°C (Arrhenius equation), differential thermal expansion between glass (α=8.5×10⁻⁶/K) and aluminum housing (α=23×10⁻⁶/K) exceeding epoxy adhesive yield strength of 25 MPa"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 2kV HBM (Human Body Model) at image sensor input pins"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 1.5kV clamping voltage and 5Ω series resistors on all signal lines"
  - node_2:
      trigger: "Cyclic thermal stress from 20°C to 70°C ambient at 2 cycles/hour (16,000 cycles/year)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 solder alloy with 0.5mm diameter solder balls and underfill epoxy with CTE of 28×10⁻⁶/K"
bom_nodes:
  image-sensor:
    type: "part"
    urn: "URN:CNFX:ME:IMAGE_SENSOR"
    interface_type: "physical-logic-coupled"
  lens-assembly:
    type: "part"
    urn: "URN:CNFX:ME:LENS_ASSEMBLY"
    interface_type: "physical-logic-coupled"
  pcb:
    type: "part"
    urn: "URN:CNFX:ME:PCB"
    interface_type: "physical-logic-coupled"
  housing:
    type: "component"
    urn: "URN:CNFX:ME:HOUSING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 12233:2017 (PHOTOGRAPHY - ELECTRONIC STILL PICTURE IMAGING - RESOLUTION AND SPATIAL FREQUENCY RESPONSES)"
    scope: "Verified Engineering Specification"
  - standard: "IEC 60529:1989+AMD1:1999+AMD2:2013 CSV (DEGREES OF PROTECTION PROVIDED BY ENCLOSURES - IP CODE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/camera-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "fe93809524d0cbfe5424cf44afc4bef9d17bffa40c2ebed689c76814f4796790"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Camera module

## 1. Technical Definition
A self-contained imaging unit that captures visual data for processing within a stereo camera system.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-70°C ambient temperature, 3.0-3.6V DC supply voltage, 0-95% relative humidity (non-condensing)**. Failure boundary: **Image sensor thermal runaway at 85°C junction temperature, lens delamination at 120°C, CMOS circuit latch-up at 4.2V supply voltage**, Mechanism: **Silicon bandgap narrowing at elevated temperatures causing dark current doubling every 7-10°C (Arrhenius equation), differential thermal expansion between glass (α=8.5×10⁻⁶/K) and aluminum housing (α=23×10⁻⁶/K) exceeding epoxy adhesive yield strength of 25 MPa**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 2kV HBM (Human Body Model) at image sensor input pins | 8 | Gate oxide breakdown in CMOS pixels causing permanent white spots at fixed coordinates | Integrated ESD protection diodes with 1.5kV clamping voltage and 5Ω series resistors on all signal lines |
| Cyclic thermal stress from 20°C to 70°C ambient at 2 cycles/hour (16,000 cycles/year) | 8 | Solder joint fatigue cracking at BGA connections (Coffin-Manson exponent n=1.9) | SAC305 solder alloy with 0.5mm diameter solder balls and underfill epoxy with CTE of 28×10⁻⁶/K |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Image sensor](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/image-sensor.md) `(Standalone System)`
- [Lens assembly](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/lens-assembly.md) `(Standalone System)`
- [PCB](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pcb.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Optical Inspection System**, **Clean Room Assembly Station**, **Precision Soldering Station**  
**Downstream Applications**: Smartphone Camera Systems, Automotive Driver Assistance Systems, Medical Imaging Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key applications for this camera module in optical product manufacturing?
**A**: This camera module is designed for stereo vision systems used in quality inspection, 3D scanning, robotics guidance, and automated optical measurement in computer and electronic manufacturing environments.

### Q: How does the CMOS image sensor enhance performance in this camera module?
**A**: The CMOS image sensor provides high sensitivity, low power consumption, and fast data readout, making it ideal for real-time imaging applications in industrial stereo camera systems where precision and speed are critical.

### Q: What makes the optical glass lens assembly suitable for industrial environments?
**A**: The optical glass lens offers superior clarity, thermal stability, and durability compared to plastic alternatives, ensuring consistent image quality and longevity in demanding manufacturing settings with variable conditions.

## 6. Manufacturing Compliance
- ISO 12233:2017 (PHOTOGRAPHY - ELECTRONIC STILL PICTURE IMAGING - RESOLUTION AND SPATIAL FREQUENCY RESPONSES)
- IEC 60529:1989+AMD1:1999+AMD2:2013 CSV (DEGREES OF PROTECTION PROVIDED BY ENCLOSURES - IP CODE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Camera module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/camera-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: CAMERA_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: f350990a
