---
title: "Clock Distribution Buffer"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:CLOCK_DISTRIBUTION_BUFFER"
  data_integrity_hash: "346f1b72af3532333db0b93265ebe015"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:CLOCK_DISTRIBUTION_BUFFER"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/clock-distribution-buffer.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/clock-distribution-buffer"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1.8-3.3 V, 10 MHz-2.5 GHz, -40°C to +85°C"
    unit: "ps"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "ps"
    consequence: "Thermal noise (Johnson-Nyquist noise) in semiconductor junctions causing timing uncertainty, power supply noise coupling through substrate and package parasitics, transmission line reflections due to impedance mismatches at distribution nodes"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Power supply ripple exceeding 50 mVpp at switching frequency harmonics"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated low-dropout regulator with 60 dB PSRR at 1 MHz, on-die decoupling capacitors totaling 100 nF, separate analog and digital power domains"
  - node_2:
      trigger: "Thermal gradient of 15°C/mm across die due to uneven power dissipation"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Symmetrical H-tree distribution network with matched trace lengths within 100 μm, temperature-compensated delay elements using PTAT current sources, copper pillar flip-chip packaging for uniform thermal dissipation"
bom_nodes:
  input-bufferreceiver:
    type: "component"
    urn: "URN:CNFX:ME:INPUT_BUFFERRECEIVER"
    interface_type: "physical-logic-coupled"
  clock-distribution-tree:
    type: "component"
    urn: "URN:CNFX:ME:CLOCK_DISTRIBUTION_TREE"
    interface_type: "physical-logic-coupled"
  output-driver:
    type: "part"
    urn: "URN:CNFX:ME:OUTPUT_DRIVER"
    interface_type: "physical-logic-coupled"
  power-supply-decoupling-capacitors:
    type: "component"
    urn: "URN:CNFX:ME:POWER_SUPPLY_DECOUPLING_CAPACITORS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASQ Z1.4-2003 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 60747-5-5:2011 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/clock-distribution-buffer.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "ca1070e88121a23553d9de2100b3c4361c04dd6c5eaf1273f8185ec8b5b54ff9"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Clock Distribution Buffer

## 1. Technical Definition
A specialized electronic component within a Master Clock Generator that receives, conditions, and distributes the master clock signal to multiple destinations with minimal skew and jitter.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1.8-3.3 V, 10 MHz-2.5 GHz, -40°C to +85°C**. Failure boundary: **Clock skew exceeding 50 ps RMS, jitter exceeding 100 fs RMS, supply voltage deviation beyond ±5% of nominal**, Mechanism: **Thermal noise (Johnson-Nyquist noise) in semiconductor junctions causing timing uncertainty, power supply noise coupling through substrate and package parasitics, transmission line reflections due to impedance mismatches at distribution nodes**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Power supply ripple exceeding 50 mVpp at switching frequency harmonics | 8 | Deterministic jitter accumulation exceeding 500 ps peak-to-peak | Integrated low-dropout regulator with 60 dB PSRR at 1 MHz, on-die decoupling capacitors totaling 100 nF, separate analog and digital power domains |
| Thermal gradient of 15°C/mm across die due to uneven power dissipation | 8 | Clock skew variation of 200 ps between output channels | Symmetrical H-tree distribution network with matched trace lengths within 100 μm, temperature-compensated delay elements using PTAT current sources, copper pillar flip-chip packaging for uniform thermal dissipation |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | ps | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Output Driver](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/output-driver.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Precision Signal Generator**, **High-Frequency Oscilloscope**, **Automated Test Handler**  
**Downstream Applications**: High-Performance Servers, Telecommunications Equipment, Advanced Medical Imaging Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of a clock distribution buffer in electronic systems?
**A**: A clock distribution buffer receives a master clock signal, conditions it to maintain signal integrity, and distributes it to multiple destinations (like processors or memory modules) while minimizing timing errors such as skew and jitter.

### Q: Why is minimizing skew and jitter important in clock distribution?
**A**: Minimizing skew (timing differences between signals) and jitter (timing variations) ensures synchronous operation of electronic components. This is critical for data integrity, system stability, and performance in computers, optical devices, and high-speed digital systems.

### Q: What materials are typically used in manufacturing clock distribution buffers?
**A**: Clock distribution buffers are primarily made from silicon as the semiconductor substrate, copper for interconnects to ensure low resistance and high conductivity, and ceramic or plastic packaging for protection and thermal management.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- ANSI/ASQ Z1.4-2003 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
- DIN EN 60747-5-5:2011 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-5: OPTOELECTRONIC DEVICES - PHOTOCOUPLERS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Clock Distribution Buffer](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/clock-distribution-buffer)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: CLOCK_DISTRIBUTION_BUFFER | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 3c1c49df
