---
title: "Communication Interface"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:COMMUNICATION_INTERFACE"
  data_integrity_hash: "d68ef66e3ca89e1a9c6909240fde4b6e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:COMMUNICATION_INTERFACE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 4.75-5.25V DC supply voltage, 0-100% relative humidity (non-condensing)"
    unit: "bps"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch between silicon die (2.6 ppm/°C) and FR-4 substrate (13-18 ppm/°C) causing solder joint fatigue, dielectric breakdown at &gt;5.5V exceeding FR-4 breakdown strength (20 kV/mm), electrochemical migration at &gt;95% RH with ionic contamination"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5 ns response time, 15 kV ESD protection, 1.5 pF capacitance"
  - node_2:
      trigger: "Sustained data rate &gt;115.2 kbps on RS-485 interface with 120Ω termination"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Heat sink with 15°C/W thermal resistance, copper pour area &gt;100 mm², derating to 57.6 kbps maximum"
bom_nodes:
  protocol-chip:
    type: "part"
    urn: "URN:CNFX:ME:PROTOCOL_CHIP"
    interface_type: "physical-logic-coupled"
  connector-port:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_PORT"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "d83b0851ec873b0adcfbcb227eef4604cef66e567074920007a4f7e35ab74e04"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Communication Interface

## 1. Technical Definition
Hardware and software component enabling data exchange between the Data Logging Module and external systems or devices.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 4.75-5.25V DC supply voltage, 0-100% relative humidity (non-condensing)**. Failure boundary: **Ambient temperature &gt;125°C sustained for &gt;60 seconds, supply voltage &gt;5.5V DC or &lt;4.5V DC, relative humidity &gt;95% with condensation present**, Mechanism: **Thermal expansion coefficient mismatch between silicon die (2.6 ppm/°C) and FR-4 substrate (13-18 ppm/°C) causing solder joint fatigue, dielectric breakdown at &gt;5.5V exceeding FR-4 breakdown strength (20 kV/mm), electrochemical migration at &gt;95% RH with ionic contamination**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV human body model | 8 | Gate oxide breakdown in transceiver IC, immediate communication failure | TVS diodes with 5 ns response time, 15 kV ESD protection, 1.5 pF capacitance |
| Sustained data rate &gt;115.2 kbps on RS-485 interface with 120Ω termination | 8 | Joule heating in transceiver exceeding 125°C junction temperature, thermal shutdown | Heat sink with 15°C/W thermal resistance, copper pour area &gt;100 mm², derating to 57.6 kbps maximum |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | bps | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Protocol Chip](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/protocol-chip.md) `(Standalone System)`
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Data Logging Module**, **External System Interface Device**, **Power Supply Unit**  
**Downstream Applications**: Industrial Control Systems, Automated Manufacturing Equipment, Smart Sensor Networks  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What protocols does this communication interface support?
**A**: The interface supports industry-standard protocols including RS-232, RS-485, Ethernet, and USB, with protocol chips configurable for specific manufacturing system requirements.

### Q: How does the signal conditioning circuit improve data reliability?
**A**: The signal conditioning circuit filters noise, amplifies weak signals, and converts signal levels to ensure accurate data transmission between the Data Logging Module and external devices in industrial environments.

### Q: What environmental specifications make this suitable for manufacturing settings?
**A**: Built with industrial-grade PCB and copper connectors in durable plastic housing, it operates in temperatures from -20°C to 70°C with EMI/RFI shielding for reliable performance in electronic manufacturing facilities.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Communication Interface](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: COMMUNICATION_INTERFACE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 54b0c61c
