---
title: "Connector Assembly"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:CONNECTOR_ASSEMBLY"
  data_integrity_hash: "29d6abaf459ec5193d1c6b2818d25193"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:CONNECTOR_ASSEMBLY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/connector-assembly.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/connector-assembly"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-600 V DC, -40°C to +125°C, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "m"
    consequence: "Electromigration at current densities above 10⁶ A/cm² causing contact degradation, dielectric breakdown at electric field strengths exceeding 30 kV/mm, thermoplastic creep under sustained mechanical stress at temperatures above glass transition point"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrochemical migration due to chloride ion contamination exceeding 10 ppm"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with 50 μm minimum thickness of silicone-based dielectric material"
  - node_2:
      trigger: "Vibration-induced fretting at amplitudes exceeding 0.5 mm displacement at frequencies between 10-2000 Hz"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gold-over-nickel plating with minimum 0.8 μm thickness on contact surfaces, spring-loaded contact design with 2.5 N minimum normal force"
bom_nodes:
  connector-housing:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_HOUSING"
    interface_type: "physical-logic-coupled"
  contacts-pinssockets:
    type: "component"
    urn: "URN:CNFX:ME:CONTACTS_PINSSOCKETS"
    interface_type: "physical-logic-coupled"
  locking-mechanism:
    type: "part"
    urn: "URN:CNFX:ME:LOCKING_MECHANISM"
    interface_type: "physical-logic-coupled"
  strain-relief:
    type: "component"
    urn: "URN:CNFX:ME:STRAIN_RELIEF"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/connector-assembly.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "97d2d24db46c647a4b48ff9ee1d4d9bcc43be096cab17ad0741b97de67d2b96f"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Connector Assembly

## 1. Technical Definition
A modular assembly of electrical connectors and supporting hardware designed for secure signal and power transmission within an interface module.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-600 V DC, -40°C to +125°C, 0-100% relative humidity (non-condensing)**. Failure boundary: **Contact resistance exceeding 15 mΩ, insulation breakdown at 1500 V AC for 60 seconds, plastic deformation of housing at 85°C continuous load**, Mechanism: **Electromigration at current densities above 10⁶ A/cm² causing contact degradation, dielectric breakdown at electric field strengths exceeding 30 kV/mm, thermoplastic creep under sustained mechanical stress at temperatures above glass transition point**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrochemical migration due to chloride ion contamination exceeding 10 ppm | 8 | Short circuit between adjacent pins with resistance dropping below 1 kΩ | Conformal coating with 50 μm minimum thickness of silicone-based dielectric material |
| Vibration-induced fretting at amplitudes exceeding 0.5 mm displacement at frequencies between 10-2000 Hz | 8 | Intermittent signal loss with contact resistance fluctuations exceeding ±5 mΩ | Gold-over-nickel plating with minimum 0.8 μm thickness on contact surfaces, spring-loaded contact design with 2.5 N minimum normal force |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Locking Mechanism](https://cnfx.com/llms/industry/fabricated-metal-product-manufacturing/product/locking-mechanism.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Crimping Machine**, **Precision Insertion Press**, **Automated Optical Inspection System**  
**Downstream Applications**: Server Backplane Assemblies, Telecommunications Interface Modules, Medical Imaging Equipment Control Panels  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key materials used in this connector assembly?
**A**: This connector assembly uses copper alloy for contacts (ensuring optimal conductivity), high-temperature plastic for the housing (providing thermal resistance), and stainless steel for the shell and latches (ensuring durability and secure locking).

### Q: How does the modular design benefit installation and maintenance?
**A**: The modular design allows for easy assembly, disassembly, and replacement of individual components like contacts or the locking mechanism, reducing downtime and simplifying maintenance within interface modules.

### Q: What applications is this connector assembly suitable for?
**A**: Ideal for computer, electronic, and optical product manufacturing, it's designed for secure signal and power transmission in interface modules where reliable connectivity and resistance to environmental factors are critical.

## 6. Manufacturing Compliance
- ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Connector Assembly](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/connector-assembly)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: CONNECTOR_ASSEMBLY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 098fec28
