---
title: "Contact Probe Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:CONTACT_PROBE_ARRAY"
  data_integrity_hash: "404baa4ba5c093e2c69703d377f40ca1"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:CONTACT_PROBE_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/contact-probe-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/contact-probe-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-2.5 mm probe deflection, 0.1-1.0 N contact force per probe, 10-1000 cycles/minute actuation rate"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 0.05
    unit: "mm"
    consequence: "Wear-induced tip geometry change reduces contact area, increasing current density beyond 100 A/mm² causing localized Joule heating &gt;200°C; cyclic spring compression exceeding yield strength at 1500 MPa stress amplitude"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Oxidation layer formation on probe tips exceeding 10 nm thickness"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gold plating (≥2.5 μm thickness) with nickel underplate (≥5 μm) to prevent copper diffusion"
  - node_2:
      trigger: "Misalignment exceeding 0.1 mm between probe array and PCB test points"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Six-axis robotic positioning with 0.01 mm repeatability and optical alignment verification"
bom_nodes:
  probe-tip:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_TIP"
    interface_type: "physical-logic-coupled"
  probe-barrel-body:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_BARREL_BODY"
    interface_type: "physical-logic-coupled"
  plunger:
    type: "component"
    urn: "URN:CNFX:ME:PLUNGER"
    interface_type: "physical-logic-coupled"
  spring:
    type: "component"
    urn: "URN:CNFX:ME:SPRING"
    interface_type: "physical-logic-coupled"
  retention-mechanism-e-g-clamp-plate:
    type: "component"
    urn: "URN:CNFX:ME:RETENTION_MECHANISM_E_G_CLAMP_PLATE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING FOR ELECTROMAGNETIC COMPATIBILITY (EMC) DIRECTIVE 2014/30/EU"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/contact-probe-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "35dccf2eed11e8570cae321543ade070a38031bfb86ae295c53e7698ca53f2e3"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Contact Probe Array

## 1. Technical Definition
A precisely arranged set of spring-loaded electrical probes used to establish temporary electrical connections with test points on electronic devices or printed circuit boards (PCBs) during automated testing.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-2.5 mm probe deflection, 0.1-1.0 N contact force per probe, 10-1000 cycles/minute actuation rate**. Failure boundary: **Probe tip wear exceeding 0.05 mm radius increase, spring fatigue at &gt;10^6 compression cycles, contact resistance &gt;100 mΩ**, Mechanism: **Wear-induced tip geometry change reduces contact area, increasing current density beyond 100 A/mm² causing localized Joule heating &gt;200°C; cyclic spring compression exceeding yield strength at 1500 MPa stress amplitude**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Oxidation layer formation on probe tips exceeding 10 nm thickness | 8 | Intermittent high contact resistance causing false test failures | Gold plating (≥2.5 μm thickness) with nickel underplate (≥5 μm) to prevent copper diffusion |
| Misalignment exceeding 0.1 mm between probe array and PCB test points | 8 | Scratching of PCB solder mask and probe tip deformation | Six-axis robotic positioning with 0.01 mm repeatability and optical alignment verification |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Test Handler**, **Test Fixture Plate**, **Precision Alignment System**  
**Downstream Applications**: Semiconductor Integrated Circuits, Printed Circuit Board Assemblies, Electronic Module Subassemblies  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the main components of a contact probe array?
**A**: A contact probe array consists of five key components: plunger, probe barrel (body), probe tip, spring, and retention mechanism (clamp or plate). These work together to create temporary electrical connections during automated testing.

### Q: Why is beryllium copper used for the spring and body?
**A**: Beryllium copper (BeCu) is used because it offers excellent spring properties, high conductivity, and good corrosion resistance. This ensures consistent contact force and reliable electrical performance over thousands of test cycles.

### Q: What are the benefits of gold or nickel plating on contact probes?
**A**: Gold or nickel plating enhances conductivity and provides superior corrosion resistance. This maintains stable electrical connections, reduces contact resistance, and extends the probe array's lifespan in demanding testing environments.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
- CE MARKING FOR ELECTROMAGNETIC COMPATIBILITY (EMC) DIRECTIVE 2014/30/EU

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Contact Probe Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/contact-probe-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: CONTACT_PROBE_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: d4690d5b
