---
title: "Current source cell"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:CURRENT_SOURCE_CELL"
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  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:CURRENT_SOURCE_CELL"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/current-source-cell.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/current-source-cell"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1 μA to 100 mA output current, -40°C to 125°C ambient temperature, 1.8V to 36V supply voltage"
    unit: "A"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Thermal runaway due to power dissipation exceeding 250 mW, electromigration in metal interconnects at current densities &gt;1 MA/cm², oxide breakdown at electric fields &gt;10 MV/cm"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 2 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 5 kV clamping voltage, input/output pin isolation using guard rings"
  - node_2:
      trigger: "Thermal stress cycling between -55°C and 150°C at 100 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper pillar bump interconnects with underfill material, thermal vias to substrate with 10 W/m·K conductivity"
bom_nodes:
  reference-resistor:
    type: "component"
    urn: "URN:CNFX:ME:REFERENCE_RESISTOR"
    interface_type: "physical-logic-coupled"
  current-mirror-transistors:
    type: "component"
    urn: "URN:CNFX:ME:CURRENT_MIRROR_TRANSISTORS"
    interface_type: "physical-logic-coupled"
  feedback-amplifier:
    type: "part"
    urn: "URN:CNFX:ME:FEEDBACK_AMPLIFIER"
    interface_type: "physical-logic-coupled"
  output-transistor:
    type: "component"
    urn: "URN:CNFX:ME:OUTPUT_TRANSISTOR"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING FOR MACHINERY DIRECTIVE 2006/42/EC"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/current-source-cell.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "bcd9436854ae3809ba73992bb3731f942cf88365c3e99e3007c4494d60db235b"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Current source cell

## 1. Technical Definition
A fundamental electronic component that generates and regulates a constant current output within a resistor network or current source array.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1 μA to 100 mA output current, -40°C to 125°C ambient temperature, 1.8V to 36V supply voltage**. Failure boundary: **Junction temperature exceeding 150°C, output current deviation &gt;±5% from setpoint, supply voltage below 1.5V or above 40V**, Mechanism: **Thermal runaway due to power dissipation exceeding 250 mW, electromigration in metal interconnects at current densities &gt;1 MA/cm², oxide breakdown at electric fields &gt;10 MV/cm**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 2 kV HBM | 8 | Gate oxide rupture in current mirror transistors | Integrated ESD protection diodes with 5 kV clamping voltage, input/output pin isolation using guard rings |
| Thermal stress cycling between -55°C and 150°C at 100 cycles/hour | 8 | Solder joint fatigue causing open circuit at bond wires | Copper pillar bump interconnects with underfill material, thermal vias to substrate with 10 W/m·K conductivity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | A | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Feedback amplifier](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/feedback-amplifier.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Precision Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Voltage Regulator Modules, LED Driver Circuits, Precision Measurement Instruments  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of a current source cell in electronic manufacturing?
**A**: A current source cell generates and regulates a constant current output within resistor networks or current source arrays, ensuring stable operation in electronic circuits.

### Q: What materials are used in manufacturing current source cells?
**A**: Current source cells are typically constructed using semiconductor silicon, copper for connections, epoxy resin for encapsulation, and gold bonding wire for reliable electrical contacts.

### Q: What are the key components in a current source cell's bill of materials (BOM)?
**A**: The essential BOM components include a reference resistor, current mirror transistors, a feedback amplifier, and an output transistor, which work together to maintain precise current regulation.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING FOR MACHINERY DIRECTIVE 2006/42/EC

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Current source cell](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/current-source-cell)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: CURRENT_SOURCE_CELL | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 8c1fe8b6
