---
title: "Data Storage Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DATA_STORAGE_MODULE"
  data_integrity_hash: "464f8efb692ec49227f42ab41396d373"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DATA_STORAGE_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/data-storage-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/data-storage-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 20-80% relative humidity non-condensing, 0-2.0g vibration (5-500Hz)"
    unit: "GB"
engineering_limits:
  max_safe_operating_point:
    value: 3000
    unit: "program"
    consequence: "NAND flash oxide layer breakdown at 10MV/cm electric field during program/erase cycles; electromigration in copper interconnects at current density &gt;1MA/cm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Power loss during NAND flash write operation at 3.3V±5%"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Capacitor-based power hold-up circuit providing 50ms backup at 500mA load"
  - node_2:
      trigger: "Thermal cycling between -40°C and 85°C at 10°C/minute rate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Underfill epoxy with 8GPa modulus and 25ppm/°C CTE between BGA and PCB"
bom_nodes:
  flash-memory-array:
    type: "component"
    urn: "URN:CNFX:ME:FLASH_MEMORY_ARRAY"
    interface_type: "physical-logic-coupled"
  storage-controller:
    type: "part"
    urn: "URN:CNFX:ME:STORAGE_CONTROLLER"
    interface_type: "physical-logic-coupled"
  interface-connector:
    type: "component"
    urn: "URN:CNFX:ME:INTERFACE_CONNECTOR"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/data-storage-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "6228493aadddb3b15a76a49e87398a4af3fa2612e687d281d629b70cc13f3e52"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Data Storage Module

## 1. Technical Definition
A hardware component within the Checkpoint Record Manager system responsible for persistent data storage and retrieval.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 20-80% relative humidity non-condensing, 0-2.0g vibration (5-500Hz)**. Failure boundary: **NAND flash cell endurance: 3000 program/erase cycles at 25°C, 1500 cycles at 85°C; thermal shutdown at 125°C junction temperature**, Mechanism: **NAND flash oxide layer breakdown at 10MV/cm electric field during program/erase cycles; electromigration in copper interconnects at current density &gt;1MA/cm²**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Power loss during NAND flash write operation at 3.3V±5% | 8 | Partial page programming causing corrupted logical-to-physical mapping | Capacitor-based power hold-up circuit providing 50ms backup at 500mA load |
| Thermal cycling between -40°C and 85°C at 10°C/minute rate | 8 | Solder joint fatigue failure due to CTE mismatch (17ppm/°C vs 23ppm/°C) | Underfill epoxy with 8GPa modulus and 25ppm/°C CTE between BGA and PCB |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | GB | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Storage Controller](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/storage-controller.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Power Supply Unit**, **Cooling System**, **Data Interface Controller**  
**Downstream Applications**: Enterprise Servers, Data Center Storage Arrays, Industrial Control Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this Data Storage Module?
**A**: This Data Storage Module serves as the persistent storage component within the Checkpoint Record Manager system, reliably storing and retrieving critical data using NAND flash memory technology.

### Q: What materials are used in the construction of this storage module?
**A**: The module is constructed using NAND Flash Memory for data storage, a Printed Circuit Board (PCB) for structural support and electrical connections, and a Controller IC to manage data operations and interface communication.

### Q: What are the main components in the Bill of Materials (BOM)?
**A**: The BOM includes three key components: Flash Memory Array for data storage, Storage Controller for managing read/write operations, and Interface Connector for system integration and data transfer.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Data Storage Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/data-storage-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DATA_STORAGE_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 853379c5
