---
title: "DICOM Interface Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DICOM_INTERFACE_MODULE"
  data_integrity_hash: "cca57d8a2e53a8559c982682fec50730"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DICOM_INTERFACE_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/dicom-interface-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/dicom-interface-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "5-40°C ambient temperature, 0.5-1.5 V signal voltage, 100-240 VAC ±10% power input"
    unit: "Mbps"
engineering_limits:
  max_safe_operating_point:
    value: 45
    unit: "°C"
    consequence: "Semiconductor junction thermal runaway at &gt;125°C die temperature, dielectric breakdown at &gt;3.3 kV/mm in isolation transformers, electromigration in copper traces at &gt;10^6 A/cm² current density"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 8 kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5 ns response time on all external interfaces, Faraday cage shielding with 40 dB attenuation at 1 GHz"
  - node_2:
      trigger: "Sustained 85% relative humidity with NaCl contamination &gt;5 μg/cm³"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating with 25 μm thickness IPC-CC-830B Class 3 compliance, hermetic sealing with 1.0×10⁻³ atm·cm³/s helium leak rate"
bom_nodes:
  network-interface-card:
    type: "part"
    urn: "URN:CNFX:ME:NETWORK_INTERFACE_CARD"
    interface_type: "physical-logic-coupled"
  dicom-protocol-processor:
    type: "part"
    urn: "URN:CNFX:ME:DICOM_PROTOCOL_PROCESSOR"
    interface_type: "physical-logic-coupled"
  data-buffer-memory:
    type: "component"
    urn: "URN:CNFX:ME:DATA_BUFFER_MEMORY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 12052:2017 (DICOM STANDARD)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ISO 12052:2017 (DICOM STANDARD)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/dicom-interface-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "98c584a28e56c27784a62e80160cab090dc0529d986da3b172750ec64fe777f2"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: DICOM Interface Module

## 1. Technical Definition
A specialized hardware/software component that enables communication between a Treatment Planning Station and medical imaging devices using the DICOM standard.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **5-40°C ambient temperature, 0.5-1.5 V signal voltage, 100-240 VAC ±10% power input**. Failure boundary: **Ambient temperature &gt;45°C sustained for &gt;30 minutes, signal voltage &lt;0.3 V or &gt;2.0 V, power input &lt;90 VAC or &gt;264 VAC**, Mechanism: **Semiconductor junction thermal runaway at &gt;125°C die temperature, dielectric breakdown at &gt;3.3 kV/mm in isolation transformers, electromigration in copper traces at &gt;10^6 A/cm² current density**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 8 kV human body model | 8 | Gate oxide breakdown in DICOM protocol processor IC | TVS diodes with 5 ns response time on all external interfaces, Faraday cage shielding with 40 dB attenuation at 1 GHz |
| Sustained 85% relative humidity with NaCl contamination &gt;5 μg/cm³ | 8 | Conductive anodic filament growth between 0.5 mm pitch PCB traces | Conformal coating with 25 μm thickness IPC-CC-830B Class 3 compliance, hermetic sealing with 1.0×10⁻³ atm·cm³/s helium leak rate |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | Mbps | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Network Interface Card](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card.md) `(Standalone System)`
- [DICOM Protocol Processor](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/dicom-protocol-processor.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Treatment Planning Station**, **Medical Imaging Device**, **DICOM Network Server**  
**Downstream Applications**: Radiation Therapy Plans, Surgical Navigation Data, Diagnostic Imaging Reports  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this DICOM Interface Module?
**A**: This module facilitates standardized communication between Treatment Planning Stations and medical imaging devices using the DICOM protocol, ensuring accurate and reliable data transfer for medical applications.

### Q: What components are included in the DICOM Interface Module?
**A**: The module includes a Data Buffer Memory for temporary data storage, a DICOM Protocol Processor for handling DICOM standards, and a Network Interface Card for connectivity, all mounted on a Printed Circuit Board within a Plastic Housing.

### Q: How does this module benefit medical equipment manufacturers?
**A**: It provides a ready-to-integrate solution that ensures compliance with DICOM standards, reduces development time for medical imaging systems, and enhances interoperability between treatment planning software and imaging hardware.

## 6. Manufacturing Compliance
- ISO 12052:2017 (DICOM STANDARD)
- ANSI/ISO 12052:2017 (DICOM STANDARD)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: DICOM Interface Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/dicom-interface-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DICOM_INTERFACE_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: f356e2e0
