---
title: "Driver/Receiver IC"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DRIVERRECEIVER_IC"
  data_integrity_hash: "680b8ffedf3d47cb75f284a63be8e19b"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DRIVERRECEIVER_IC"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driverreceiver-ic.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/driverreceiver-ic"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.8-5.5 V input voltage, -40 to 125 °C junction temperature, 50 Ω impedance matching"
    unit: "V"
engineering_limits:
  max_safe_operating_point:
    value: 6.0
    unit: "V"
    consequence: "Electromigration in aluminum interconnects at current densities &gt; 1×10⁶ A/cm², hot carrier injection at electric fields &gt; 5×10⁵ V/cm"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 2 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated silicon-controlled rectifier (SCR) clamps with 1.5 kV protection rating"
  - node_2:
      trigger: "Simultaneous switching noise generating 200 mV ground bounce"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Differential signaling with 100 Ω termination and 50 ps skew matching"
bom_nodes:
  input-protection-circuit:
    type: "component"
    urn: "URN:CNFX:ME:INPUT_PROTECTION_CIRCUIT"
    interface_type: "physical-logic-coupled"
  driver-stage:
    type: "part"
    urn: "URN:CNFX:ME:DRIVER_STAGE"
    interface_type: "physical-logic-coupled"
  receiver-stage:
    type: "component"
    urn: "URN:CNFX:ME:RECEIVER_STAGE"
    interface_type: "physical-logic-coupled"
  output-stage:
    type: "component"
    urn: "URN:CNFX:ME:OUTPUT_STAGE"
    interface_type: "physical-logic-coupled"
  package:
    type: "component"
    urn: "URN:CNFX:ME:PACKAGE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driverreceiver-ic.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "27c56cbd8314ed19b478fe1bd7c58d8cbb75a064a789e2f6c2d9a955d76247e4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Driver/Receiver IC

## 1. Technical Definition
An integrated circuit that amplifies and conditions signals for transmission and reception in electronic systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.8-5.5 V input voltage, -40 to 125 °C junction temperature, 50 Ω impedance matching**. Failure boundary: **Input voltage exceeding 6.0 V causes gate oxide breakdown, junction temperature above 150 °C initiates thermal runaway**, Mechanism: **Electromigration in aluminum interconnects at current densities &gt; 1×10⁶ A/cm², hot carrier injection at electric fields &gt; 5×10⁵ V/cm**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 2 kV HBM | 8 | Gate oxide rupture in input protection diodes | Integrated silicon-controlled rectifier (SCR) clamps with 1.5 kV protection rating |
| Simultaneous switching noise generating 200 mV ground bounce | 8 | Timing violation causing data corruption at 1 Gbps | Differential signaling with 100 Ω termination and 50 ps skew matching |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | V | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Driver Stage](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driver-stage.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wafer Prober**, **Wire Bonder**, **Burn-in Test System**  
**Downstream Applications**: Motherboards, Network Interface Cards, Industrial Control Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key applications of this Driver/Receiver IC?
**A**: This IC is designed for signal transmission and reception in computer peripherals, optical communication systems, industrial automation equipment, and electronic measurement devices where reliable signal conditioning is required.

### Q: What input protection features does this Driver/Receiver IC include?
**A**: The IC incorporates ESD protection, overvoltage protection, and current limiting circuits to safeguard against electrostatic discharge, voltage spikes, and short-circuit conditions in the input stage.

### Q: What packaging options are available for this Driver/Receiver IC?
**A**: Available in standard surface-mount packages including SOIC, QFN, and TSSOP with plastic/epoxy encapsulation, featuring copper/aluminum leadframes for optimal thermal and electrical performance.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- CE MARKING (EU DIRECTIVE 2014/35/EU LOW VOLTAGE DIRECTIVE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Driver/Receiver IC](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/driverreceiver-ic)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DRIVERRECEIVER_IC | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 27512de7
