---
title: "Duplexer/Diplexer"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:DUPLEXERDIPLEXER"
  data_integrity_hash: "a4d204c9a2ac4956461c180586003f3d"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:DUPLEXERDIPLEXER"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/duplexerdiplexer.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/duplexerdiplexer"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-6.0 GHz with 20 dB isolation minimum, -40°C to +85°C ambient temperature, 50 Ω impedance"
    unit: "MHz"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "dB"
    consequence: "Dielectric breakdown in ceramic substrates at &gt;200 V/m electric field, thermal expansion mismatch between alumina (6.5 ppm/°C) and copper (17 ppm/°C) causing solder joint fatigue, or ferrite core saturation at &gt;0.3 T magnetic flux density"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Dielectric heating from RF power dissipation exceeding 2.5 W/cm² in substrate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement alumina (Al₂O₃) substrates with 24 W/m·K thermal conductivity and silver-filled epoxy bonding with 8 W/m·K thermal interface material"
  - node_2:
      trigger: "Corona discharge at &gt;2000 V peak in high-power applications with 85% relative humidity"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply parylene-C conformal coating with 2.5 kV/mm dielectric strength and hermetic sealing with 1×10⁻⁸ cc/sec helium leak rate"
bom_nodes:
  transmit-filter:
    type: "part"
    urn: "URN:CNFX:ME:TRANSMIT_FILTER"
    interface_type: "physical-logic-coupled"
  receive-filter:
    type: "component"
    urn: "URN:CNFX:ME:RECEIVE_FILTER"
    interface_type: "physical-logic-coupled"
  matching-network:
    type: "part"
    urn: "URN:CNFX:ME:MATCHING_NETWORK"
    interface_type: "physical-logic-coupled"
  housingenclosure:
    type: "component"
    urn: "URN:CNFX:ME:HOUSINGENCLOSURE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/duplexerdiplexer.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "082985a4360b9a9ec0b4c5e712eacc524bdafc3147f7686a4021bad06bd1ddc4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Duplexer/Diplexer

## 1. Technical Definition
A passive RF component that allows simultaneous transmission and reception of signals on different frequencies through a single antenna

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-6.0 GHz with 20 dB isolation minimum, -40°C to +85°C ambient temperature, 50 Ω impedance**. Failure boundary: **Isolation drops below 15 dB, insertion loss exceeds 3.0 dB, VSWR exceeds 2.0:1, or power handling exceeds 50 W continuous**, Mechanism: **Dielectric breakdown in ceramic substrates at &gt;200 V/m electric field, thermal expansion mismatch between alumina (6.5 ppm/°C) and copper (17 ppm/°C) causing solder joint fatigue, or ferrite core saturation at &gt;0.3 T magnetic flux density**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Dielectric heating from RF power dissipation exceeding 2.5 W/cm² in substrate | 8 | Intermodulation distortion increases to -30 dBc, causing adjacent channel interference | Implement alumina (Al₂O₃) substrates with 24 W/m·K thermal conductivity and silver-filled epoxy bonding with 8 W/m·K thermal interface material |
| Corona discharge at &gt;2000 V peak in high-power applications with 85% relative humidity | 8 | Permanent insertion loss increase of 1.5 dB due to metallization erosion at λ/4 stubs | Apply parylene-C conformal coating with 2.5 kV/mm dielectric strength and hermetic sealing with 1×10⁻⁸ cc/sec helium leak rate |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | MHz | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Transmit Filter](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/transmit-filter.md) `(Standalone System)`
- [Matching Network](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vector Network Analyzer**, **RF Signal Generator**, **Spectrum Analyzer**  
**Downstream Applications**: Base Station Antenna Systems, Satellite Communication Equipment, Military Radar Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the difference between a duplexer and a diplexer?
**A**: A duplexer allows simultaneous transmission and reception on different frequencies through a single antenna, while a diplexer combines or separates two different frequency bands into one port.

### Q: What materials are used in your duplexer/diplexer construction?
**A**: Our components are constructed using high-quality ceramic, ferrite, copper, and dielectric substrate materials for optimal RF performance and durability.

### Q: How does the matching network improve performance in your duplexer?
**A**: The matching network ensures optimal impedance matching between the transmit/receive filters and the antenna, minimizing signal loss and maximizing power transfer efficiency.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Duplexer/Diplexer](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/duplexerdiplexer)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: DUPLEXERDIPLEXER | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: ca6fd65a
