---
title: "Electrical Test Fixture/Probes"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ELECTRICAL_TEST_FIXTUREPROBES"
  data_integrity_hash: "94ce32a9100e52b756da4ca36cbf4f40"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ELECTRICAL_TEST_FIXTUREPROBES"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-fixtureprobes.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-fixtureprobes"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.1-10 N contact force, 0.5-5.0 mm probe travel, 1-1000 Hz test frequency"
    unit: "count"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "m"
    consequence: "Electrochemical migration at probe-chip interface due to galvanic potential differences exceeding 0.25 V, fretting corrosion at contact points under cyclic loading above 10⁶ cycles, plastic deformation of probe tips under contact forces exceeding 12 N"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 500 V during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated spark gap protection with 200 V breakdown voltage, conductive polymer shielding with surface resistivity &lt;10⁴ Ω/sq"
  - node_2:
      trigger: "Mechanical misalignment exceeding 25 μm during cartridge insertion"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Self-aligning kinematic coupling with ±5 μm repeatability, diamond-like carbon coating with hardness &gt;20 GPa"
bom_nodes:
  probe-pin:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_PIN"
    interface_type: "physical-logic-coupled"
  spring-mechanism:
    type: "component"
    urn: "URN:CNFX:ME:SPRING_MECHANISM"
    interface_type: "physical-logic-coupled"
  guide-plate:
    type: "component"
    urn: "URN:CNFX:ME:GUIDE_PLATE"
    interface_type: "physical-logic-coupled"
  fixture-bodyhousing:
    type: "component"
    urn: "URN:CNFX:ME:FIXTURE_BODYHOUSING"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-fixtureprobes.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "a9283b88b372a851c7bcd39b7c508240d029ab2b1d192494c15f7aa61bc38c54"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Electrical Test Fixture/Probes

## 1. Technical Definition
A precision interface component used to establish electrical contact with microfluidic chips or cell sorting cartridges for signal transmission and testing.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.1-10 N contact force, 0.5-5.0 mm probe travel, 1-1000 Hz test frequency**. Failure boundary: **Contact resistance exceeding 50 mΩ, probe tip wear exceeding 50 μm, spring force degradation below 0.05 N**, Mechanism: **Electrochemical migration at probe-chip interface due to galvanic potential differences exceeding 0.25 V, fretting corrosion at contact points under cyclic loading above 10⁶ cycles, plastic deformation of probe tips under contact forces exceeding 12 N**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 500 V during handling | 8 | Dielectric breakdown of probe insulation causing short circuits | Integrated spark gap protection with 200 V breakdown voltage, conductive polymer shielding with surface resistivity &lt;10⁴ Ω/sq |
| Mechanical misalignment exceeding 25 μm during cartridge insertion | 8 | Scoring of gold-plated contact surfaces increasing resistance to &gt;100 mΩ | Self-aligning kinematic coupling with ±5 μm repeatability, diamond-like carbon coating with hardness &gt;20 GPa |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | count | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Precision Micro-Positioning System**, **Signal Conditioning and Data Acquisition Unit**, **Clean Room or Controlled Environment Chamber**  
**Downstream Applications**: Microfluidic Diagnostic Devices, Cell Sorting and Analysis Systems, Lab-on-a-Chip Testing Platforms  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in these electrical test fixtures and probes?
**A**: Our test fixtures and probes are constructed from high-performance materials including Beryllium Copper for spring mechanisms, Gold-Plated Tungsten for probe pins, PEEK (Polyether Ether Ketone) for insulation, and Stainless Steel for durable housings and guide plates.

### Q: How do these test fixtures interface with microfluidic chips and cell sorting cartridges?
**A**: The fixtures establish precise electrical contact through specialized probe pins that align with microfluidic chip or cartridge contact points, enabling accurate signal transmission for testing and validation in electronic and optical product manufacturing.

### Q: What components are included in the BOM for these electrical test fixtures?
**A**: The bill of materials includes Probe Pins for electrical contact, Spring Mechanisms for consistent pressure, Guide Plates for alignment, and Fixture Body/Housing for structural integrity and protection of internal components.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Electrical Test Fixture/Probes](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-fixtureprobes)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ELECTRICAL_TEST_FIXTUREPROBES | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 9e6f0db9
