---
title: "Electrical Test Probe Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ELECTRICAL_TEST_PROBE_ARRAY"
  data_integrity_hash: "01efd126472d05574e18508f6239af46"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ELECTRICAL_TEST_PROBE_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-probe-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-probe-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-2.5 N contact force per probe, 0.1-10.0 mm probe travel, 0.1-100.0 Ω contact resistance"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 0.05
    unit: "mm"
    consequence: "Pitting corrosion at probe tip due to galvanic potential difference &gt;0.25 V between probe material (beryllium copper) and test pad (gold/nickel), causing increased contact resistance via oxide layer formation"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM (Human Body Model) during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement Faraday cage shielding around probe array with &lt;10 Ω ground path resistance"
  - node_2:
      trigger: "Cyclic mechanical stress from &gt;100,000 actuation cycles at maximum travel"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Design probe springs with shot peening surface treatment to achieve &gt;10^7 cycle fatigue life at 2.5 N load"
bom_nodes:
  probe-tip:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_TIP"
    interface_type: "physical-logic-coupled"
  spring-mechanism:
    type: "component"
    urn: "URN:CNFX:ME:SPRING_MECHANISM"
    interface_type: "physical-logic-coupled"
  probe-bodyhousing:
    type: "component"
    urn: "URN:CNFX:ME:PROBE_BODYHOUSING"
    interface_type: "physical-logic-coupled"
  mounting-plateguide-plate:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_PLATEGUIDE_PLATE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-probe-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "574504fb6b8ce67a353b46a01d05594409fb1b04e2731b253c1496a2563ec32c"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Electrical Test Probe Array

## 1. Technical Definition
A precisely arranged collection of electrical contact probes used for automated testing of electronic circuits and components.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-2.5 N contact force per probe, 0.1-10.0 mm probe travel, 0.1-100.0 Ω contact resistance**. Failure boundary: **Contact resistance exceeding 100.0 Ω, probe tip wear exceeding 0.05 mm, spring force degradation below 0.3 N**, Mechanism: **Pitting corrosion at probe tip due to galvanic potential difference &gt;0.25 V between probe material (beryllium copper) and test pad (gold/nickel), causing increased contact resistance via oxide layer formation**.

### 2.1 Analytical Physics Model
Governed by the **Combined Measurement Uncertainty**:

> **Primary Equation**: $u_c = \sqrt{\sum u_i^2}$  
> **Engineering Impact**: Defines the precision confidence interval for inspection.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| u_i | Standard Uncertainty components | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM (Human Body Model) during handling | 8 | Dielectric breakdown of probe insulation, creating short circuit paths between adjacent probes | Implement Faraday cage shielding around probe array with &lt;10 Ω ground path resistance |
| Cyclic mechanical stress from &gt;100,000 actuation cycles at maximum travel | 8 | Spring fatigue failure in probe plunger mechanism, causing inconsistent contact force | Design probe springs with shot peening surface treatment to achieve &gt;10^7 cycle fatigue life at 2.5 N load |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Test Handler**, **Precision Positioning System**, **Signal Conditioning Unit**  
**Downstream Applications**: Printed Circuit Boards, Semiconductor Devices, Electronic Assemblies  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this electrical test probe array?
**A**: This probe array uses beryllium copper alloy and phosphor bronze for probe bodies, gold-plated contacts for optimal conductivity, and stainless steel springs for consistent performance.

### Q: What applications is this test probe array designed for?
**A**: It's designed for automated testing of electronic circuits and components in computer, electronic, and optical product manufacturing, including PCB testing, component verification, and quality control processes.

### Q: What are the key components in the probe array's BOM?
**A**: The bill of materials includes a mounting/guide plate, probe body/housing, probe tip, and spring mechanism, all engineered for precise alignment and reliable electrical contact during testing.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Electrical Test Probe Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electrical-test-probe-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ELECTRICAL_TEST_PROBE_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 98c290b1
