---
title: "Electronic Circuit Board"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ELECTRONIC_CIRCUIT_BOARD"
  data_integrity_hash: "bd9f098872cf3e9e8544ecf59859578b"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ELECTRONIC_CIRCUIT_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electronic-circuit-board.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electronic-circuit-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-125°C ambient temperature, 3.3-5.0V DC supply voltage, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 4
    unit: "substrate"
    consequence: "Thermal expansion coefficient mismatch between copper (17 ppm/°C) and FR-4 epoxy (14-18 ppm/°C in XY plane, 50-70 ppm/°C in Z-axis) causing mechanical stress and via barrel cracking at temperature cycling"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrochemical migration due to ionic contamination exceeding 1.56 μg/cm² NaCl equivalent under 85°C/85% RH bias"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating application with 25-75 μm thickness of acrylic or silicone resin achieving IPC-CC-830B Class 3 qualification"
  - node_2:
      trigger: "Thermomechanical fatigue from 1000+ thermal cycles between -40°C and +125°C at 10°C/minute ramp rate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 lead-free solder alloy with 0.5% bismuth addition reducing CTE mismatch from 22 ppm/°C to 18 ppm/°C"
bom_nodes:
  microcontroller:
    type: "part"
    urn: "URN:CNFX:ME:MICROCONTROLLER"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
  communication-interface:
    type: "part"
    urn: "URN:CNFX:ME:COMMUNICATION_INTERFACE"
    interface_type: "physical-logic-coupled"
  power-regulation-circuit:
    type: "part"
    urn: "URN:CNFX:ME:POWER_REGULATION_CIRCUIT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electronic-circuit-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "749f7e89e7085ddca936e46fd45c91f463d89380fda9ec3a8849acc9de55de19"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Electronic Circuit Board

## 1. Technical Definition
A printed circuit board (PCB) that provides electrical connections and mechanical support for electronic components in positioning sensor systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-125°C ambient temperature, 3.3-5.0V DC supply voltage, 0-100% relative humidity (non-condensing)**. Failure boundary: **Glass transition temperature (Tg) of FR-4 substrate at 130-140°C causing delamination, copper trace current density exceeding 35 A/mm² at 105°C ambient**, Mechanism: **Thermal expansion coefficient mismatch between copper (17 ppm/°C) and FR-4 epoxy (14-18 ppm/°C in XY plane, 50-70 ppm/°C in Z-axis) causing mechanical stress and via barrel cracking at temperature cycling**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrochemical migration due to ionic contamination exceeding 1.56 μg/cm² NaCl equivalent under 85°C/85% RH bias | 8 | Conductive anodic filament growth between adjacent traces at 0.5-5.0 μm/hour rate causing short circuit | Conformal coating application with 25-75 μm thickness of acrylic or silicone resin achieving IPC-CC-830B Class 3 qualification |
| Thermomechanical fatigue from 1000+ thermal cycles between -40°C and +125°C at 10°C/minute ramp rate | 8 | Intermetallic compound growth at solder joints exceeding 4 μm thickness causing brittle fracture at 25 MPa stress | SAC305 lead-free solder alloy with 0.5% bismuth addition reducing CTE mismatch from 22 ppm/°C to 18 ppm/°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Microcontroller](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/microcontroller.md) `(Standalone System)`
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`
- [Communication Interface](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/communication-interface.md) `(Standalone System)`
- [Power Regulation Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-regulation-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Industrial Positioning Sensors, Robotic Arm Control Systems, Precision Measurement Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this positioning sensor PCB?
**A**: This PCB uses FR-4 epoxy laminate for the substrate, copper foil for conductive traces, solder mask for protection, and silkscreen ink for labeling.

### Q: What components are included in the BOM for this circuit board?
**A**: The bill of materials includes a microcontroller, signal conditioning circuit, communication interface, and power regulation circuit for complete positioning sensor functionality.

### Q: What applications is this electronic circuit board designed for?
**A**: This PCB is specifically designed for positioning sensor systems in computer, electronic, and optical product manufacturing, providing both electrical connections and mechanical support.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Electronic Circuit Board](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electronic-circuit-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ELECTRONIC_CIRCUIT_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 719079f3
