---
title: "Electronics Housing"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ELECTRONICS_HOUSING"
  data_integrity_hash: "5fb96a53ac5464dce7cfe1af19241a12"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ELECTRONICS_HOUSING"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electronics-housing.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electronics-housing"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "-40°C to 85°C, 0-100% relative humidity non-condensing, IP67 ingress protection rating"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch between polycarbonate housing (65×10⁻⁶/°C) and aluminum mounting brackets (23×10⁻⁶/°C) causing stress concentration at fastener interfaces exceeding yield strength of 62 MPa"
fmea_matrix_quantitative:
  - node_1:
      trigger: "UV radiation exposure at 340 nm wavelength with 0.55 W/m² intensity causing polymer chain scission"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Carbon black additive at 2.5% concentration providing UV absorption coefficient of 10⁴ cm⁻¹, surface fluorination treatment creating 50nm protective layer"
  - node_2:
      trigger: "Cyclic thermal loading with ΔT=70°C at 0.1Hz frequency inducing fatigue stress of 45 MPa"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Glass fiber reinforcement at 30% volume fraction increasing creep modulus to 2.5 GPa, thermal conductive filler (aluminum nitride) at 40 vol% reducing thermal gradient to 15°C/mm"
bom_nodes:
  main-bodyshell:
    type: "component"
    urn: "URN:CNFX:ME:MAIN_BODYSHELL"
    interface_type: "physical-logic-coupled"
  coverlid:
    type: "component"
    urn: "URN:CNFX:ME:COVERLID"
    interface_type: "physical-logic-coupled"
  sealing-gasketo-ring:
    type: "component"
    urn: "URN:CNFX:ME:SEALING_GASKETO_RING"
    interface_type: "physical-logic-coupled"
  cable-gland:
    type: "part"
    urn: "URN:CNFX:ME:CABLE_GLAND"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "IEC 60529:1989 - DEGREES OF PROTECTION PROVIDED BY ENCLOSURES (IP CODE)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/electronics-housing.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "919fd5a56b68c3af5c95be329f3cdde5ceb2b44205e53eef6d6a054f8981588d"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Electronics Housing

## 1. Technical Definition
Protective enclosure for electronic components within a level transmitter

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **-40°C to 85°C, 0-100% relative humidity non-condensing, IP67 ingress protection rating**. Failure boundary: **Material glass transition temperature (Tg) of 125°C for polycarbonate, 0.5mm crack propagation in sealing surfaces, 0.3% water absorption by weight**, Mechanism: **Thermal expansion coefficient mismatch between polycarbonate housing (65×10⁻⁶/°C) and aluminum mounting brackets (23×10⁻⁶/°C) causing stress concentration at fastener interfaces exceeding yield strength of 62 MPa**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| UV radiation exposure at 340 nm wavelength with 0.55 W/m² intensity causing polymer chain scission | 8 | Surface embrittlement leading to crack initiation at 0.1mm depth, compromising IP67 seal integrity | Carbon black additive at 2.5% concentration providing UV absorption coefficient of 10⁴ cm⁻¹, surface fluorination treatment creating 50nm protective layer |
| Cyclic thermal loading with ΔT=70°C at 0.1Hz frequency inducing fatigue stress of 45 MPa | 8 | Creep deformation at mounting bosses exceeding 0.2mm permanent deflection, causing PCB mounting misalignment of &gt;0.5° | Glass fiber reinforcement at 30% volume fraction increasing creep modulus to 2.5 GPa, thermal conductive filler (aluminum nitride) at 40 vol% reducing thermal gradient to 15°C/mm |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Cable Gland](https://cnfx.com/llms/industry/electrical-equipment-manufacturing/product/cable-gland.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Injection Molding Machine**, **Industrial Chiller**, **Hopper Dryer**  
**Downstream Applications**: Level Transmitters, Process Control Instruments, Industrial Automation Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are best for corrosive environments?
**A**: 316L stainless steel offers excellent corrosion resistance for harsh chemical environments, while engineering plastics like PPS provide chemical resistance at lower cost.

### Q: Does this housing provide waterproof protection?
**A**: Yes, with proper sealing gaskets and cable glands, these housings typically achieve IP67 or higher ratings, protecting against dust ingress and temporary immersion.

### Q: Can the housing withstand extreme temperatures?
**A**: Stainless steel variants handle -40°C to 200°C, aluminum alloys -20°C to 150°C, and engineering plastics -30°C to 120°C, depending on specific material grades.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- IEC 60529:1989 - DEGREES OF PROTECTION PROVIDED BY ENCLOSURES (IP CODE)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Electronics Housing](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/electronics-housing)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ELECTRONICS_HOUSING | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 62c5ccce
