---
title: "Handset Transducer"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:HANDSET_TRANSDUCER"
  data_integrity_hash: "ce773cad1cbacccb15cd43b24d40e057"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HANDSET_TRANSDUCER"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/handset-transducer.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/handset-transducer"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "20-20000 Hz, 94-126 dB SPL input, -45 to +45 dBV output"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 155
    unit: "°C"
    consequence: "Thermal degradation of enamel insulation at 155°C causing inter-turn short circuits, plastic deformation of phosphor bronze suspension at yield stress &gt;275 MPa, demagnetization of neodymium magnet at Curie temperature 310°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "AC line transient exceeding 2.5 kV with 1.2/50 μs waveform"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Gas discharge tube with DC breakdown voltage 90V ±20% across transducer terminals"
  - node_2:
      trigger: "Mechanical shock exceeding 1000 g for 0.5 ms duration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Epoxy underfill with Young's modulus 2.8 GPa filling 95% of magnetic gap volume"
bom_nodes:
  voice-coil:
    type: "component"
    urn: "URN:CNFX:ME:VOICE_COIL"
    interface_type: "physical-logic-coupled"
  diaphragm:
    type: "component"
    urn: "URN:CNFX:ME:DIAPHRAGM"
    interface_type: "physical-logic-coupled"
  magnet-assembly:
    type: "component"
    urn: "URN:CNFX:ME:MAGNET_ASSEMBLY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 5347-1:1993 - METHODS FOR THE CALIBRATION OF VIBRATION AND SHOCK PICK-UPS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASA S1.15-1/PART 1:2018 - MEASUREMENT MICROPHONES - PART 1: SPECIFICATIONS FOR LABORATORY STANDARD MICROPHONES"
    scope: "Verified Engineering Specification"
  - standard: "DIN 45635-1:1984 - MEASUREMENT OF AIRBORNE NOISE EMITTED BY MACHINES; ENVELOPING SURFACE METHOD; BASIC REQUIREMENTS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/handset-transducer.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "85ef08012cd7a424074cf83598761d2f6e4925d0935ff5fcf3ec9846645cd9ed"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Handset Transducer

## 1. Technical Definition
Acoustic-electrical conversion device in telephone handsets

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **20-20000 Hz, 94-126 dB SPL input, -45 to +45 dBV output**. Failure boundary: **Coil temperature exceeding 155°C (Class F insulation limit), diaphragm displacement exceeding ±0.5 mm from neutral position, voice coil DC resistance change &gt;10% from nominal 32Ω**, Mechanism: **Thermal degradation of enamel insulation at 155°C causing inter-turn short circuits, plastic deformation of phosphor bronze suspension at yield stress &gt;275 MPa, demagnetization of neodymium magnet at Curie temperature 310°C**.

### 2.1 Analytical Physics Model
Governed by the **Harmonic Vibration Force Generation**:

> **Primary Equation**: $F_e = m \cdot r \cdot \omega^2 \sin(\omega t)$  
> **Engineering Impact**: Calculates centrifugal force for vibratory sifters/feeders.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| m | Eccentric Mass | Engineering Constant |
| r | Radius | Engineering Constant |
| \omega | Angular Frequency | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| AC line transient exceeding 2.5 kV with 1.2/50 μs waveform | 8 | Piezoelectric crystal depolarization reducing sensitivity by &gt;6 dB | Gas discharge tube with DC breakdown voltage 90V ±20% across transducer terminals |
| Mechanical shock exceeding 1000 g for 0.5 ms duration | 8 | Aluminum voice coil former separation from polyimide diaphragm at adhesive bond strength &lt;15 MPa | Epoxy underfill with Young's modulus 2.8 GPa filling 95% of magnetic gap volume |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Acoustic Testing Chamber**, **Coil Winding Machine**, **Membrane Assembly Jig**  
**Downstream Applications**: Telephone Handsets, Headsets, Hearing Aids  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in your handset transducers?
**A**: Our transducers utilize premium materials including neodymium magnets for strong magnetic fields, copper wire coils for efficient electrical conduction, PET/Mylar diaphragms for optimal acoustic response, and durable plastic housing for protection.

### Q: What are the main components in your handset transducer BOM?
**A**: The bill of materials includes three key components: the diaphragm (typically PET/Mylar), the magnet assembly (using neodymium magnets), and the voice coil (copper wire wound assembly) - all working together for precise acoustic-electrical conversion.

### Q: How do handset transducers integrate with telephone manufacturing?
**A**: Handset transducers are essential components in telephone handset assembly, converting acoustic voice signals into electrical signals for transmission and vice versa for reception. They're designed to meet industry standards for computer, electronic and optical product manufacturing.

## 6. Manufacturing Compliance
- ISO 5347-1:1993 - METHODS FOR THE CALIBRATION OF VIBRATION AND SHOCK PICK-UPS
- ANSI/ASA S1.15-1/PART 1:2018 - MEASUREMENT MICROPHONES - PART 1: SPECIFICATIONS FOR LABORATORY STANDARD MICROPHONES
- DIN 45635-1:1984 - MEASUREMENT OF AIRBORNE NOISE EMITTED BY MACHINES; ENVELOPING SURFACE METHOD; BASIC REQUIREMENTS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Handset Transducer](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/handset-transducer)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HANDSET_TRANSDUCER | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2f1ab6c1
