---
title: "Headband Assembly"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:HEADBAND_ASSEMBLY"
  data_integrity_hash: "6b28304a9a46d4a0224de66c8bbf5154"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:HEADBAND_ASSEMBLY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/headband-assembly.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/headband-assembly"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-15 N tensile load, 0-5 N·m bending moment, -10°C to 45°C temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 18
    unit: "N"
    consequence: "Stress concentration at injection molding seams exceeding 250 MPa yield strength, polymer chain scission at glass transition temperature (Tg) of 85°C for ABS plastic"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Repeated plastic deformation exceeding 0.2% strain at hinge pivot points"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Increase fillet radius to 2.0 mm and implement glass fiber reinforcement at 15% weight fraction"
  - node_2:
      trigger: "UV radiation exposure at 0.5 W/m² for 1000 hours causing polymer degradation"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply UV-stabilized polycarbonate coating at 50 μm thickness with 2% benzotriazole additives"
bom_nodes:
  headband-frame:
    type: "component"
    urn: "URN:CNFX:ME:HEADBAND_FRAME"
    interface_type: "physical-logic-coupled"
  adjustment-sliders:
    type: "component"
    urn: "URN:CNFX:ME:ADJUSTMENT_SLIDERS"
    interface_type: "physical-logic-coupled"
  headband-padding:
    type: "component"
    urn: "URN:CNFX:ME:HEADBAND_PADDING"
    interface_type: "physical-logic-coupled"
  yokehinge-assembly:
    type: "part"
    urn: "URN:CNFX:ME:YOKEHINGE_ASSEMBLY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 13485:2016 - MEDICAL DEVICES - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASQ Z1.4-2003 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES"
    scope: "Verified Engineering Specification"
  - standard: "EN 14683:2019 - MEDICAL FACE MASKS - REQUIREMENTS AND TEST METHODS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/headband-assembly.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "fc66fc5eef8a1993288f1702d2d2f76e56238cdf0cf923fb6210a0557110f97a"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Headband Assembly

## 1. Technical Definition
Structural component that connects the ear cups and provides adjustable fit for portable Bluetooth noise-cancelling headphones.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-15 N tensile load, 0-5 N·m bending moment, -10°C to 45°C temperature**. Failure boundary: **Tensile yield at 18 N (316L stainless steel), plastic deformation at 6 N·m bending moment, polymer fatigue at 10,000 cycles at 5 N load**, Mechanism: **Stress concentration at injection molding seams exceeding 250 MPa yield strength, polymer chain scission at glass transition temperature (Tg) of 85°C for ABS plastic**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Repeated plastic deformation exceeding 0.2% strain at hinge pivot points | 8 | Crack propagation from stress concentrators at 0.5 mm radius fillets | Increase fillet radius to 2.0 mm and implement glass fiber reinforcement at 15% weight fraction |
| UV radiation exposure at 0.5 W/m² for 1000 hours causing polymer degradation | 8 | Surface embrittlement leading to fracture at 2 J impact energy | Apply UV-stabilized polycarbonate coating at 50 μm thickness with 2% benzotriazole additives |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Yoke/Hinge Assembly](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/yokehinge-assembly.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Injection Molding Machine**, **Industrial Chiller**, **Hopper Dryer**  
**Downstream Applications**: Portable Bluetooth Headphones, Gaming Headsets, Professional Audio Headphones  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in this headband assembly?
**A**: This headband assembly is constructed from durable plastic polymer and stainless steel for the frame, with memory foam padding covered in synthetic leather for comfort during extended wear.

### Q: Is this headband assembly compatible with all Bluetooth headphones?
**A**: No, this headband assembly is designed specifically for portable Bluetooth noise-cancelling headphones and may not be compatible with all models. Check your headphone specifications before purchasing.

### Q: How does the adjustable fit mechanism work?
**A**: The adjustable fit is achieved through precision adjustment sliders that allow users to customize the headband length, combined with a yoke/hinge assembly that provides secure yet flexible positioning on the head.

## 6. Manufacturing Compliance
- ISO 13485:2016 - MEDICAL DEVICES - QUALITY MANAGEMENT SYSTEMS
- ANSI/ASQ Z1.4-2003 - SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES
- EN 14683:2019 - MEDICAL FACE MASKS - REQUIREMENTS AND TEST METHODS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Headband Assembly](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/headband-assembly)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: HEADBAND_ASSEMBLY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 437f0e25
