---
title: "Illumination System"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:ILLUMINATION_SYSTEM"
  data_integrity_hash: "e4e928c364285fdecaabf467ecf207f2"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:ILLUMINATION_SYSTEM"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/illumination-system.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/illumination-system"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "300-700 nm wavelength, 1000-5000 lux illuminance, 25-40°C operating temperature"
    unit: "lux"
engineering_limits:
  max_safe_operating_point:
    value: 300
    unit: "lux"
    consequence: "LED quantum efficiency degradation due to Arrhenius thermal aging (activation energy 0.43 eV), phosphor thermal quenching above 150°C, photometric decay following Lambert-Beer law with 0.02%/kh degradation coefficient"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Junction temperature exceeding 125°C due to inadequate heat sinking (thermal resistance &gt;15 K/W)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-core MCPCB with thermal vias, forced convection cooling maintaining ΔT&lt;30°C above ambient"
  - node_2:
      trigger: "PWM driver frequency instability causing 120 Hz flicker (modulation depth &gt;30%)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Constant current drivers with &gt;90% current regulation ratio, LC filtering with cutoff frequency &lt;100 Hz"
bom_nodes:
  led-array:
    type: "part"
    urn: "URN:CNFX:ME:LED_ARRAY"
    interface_type: "physical-logic-coupled"
  diffuser-panel:
    type: "component"
    urn: "URN:CNFX:ME:DIFFUSER_PANEL"
    interface_type: "physical-logic-coupled"
  heat-sink:
    type: "component"
    urn: "URN:CNFX:ME:HEAT_SINK"
    interface_type: "physical-logic-coupled"
  mounting-bracket:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BRACKET"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 8995-1:2021 (LIGHTING OF WORK PLACES)"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 12464-1:2021 (LIGHT AND LIGHTING - LIGHTING OF WORK PLACES)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/illumination-system.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "f7f8ab66e2a52c2c6ceaf5b060fdd47b3a60010790aa26de187e97067cd386e0"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Illumination System

## 1. Technical Definition
A specialized lighting subsystem that provides controlled illumination for solder paste inspection cameras to capture high-contrast images of printed circuit boards.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **300-700 nm wavelength, 1000-5000 lux illuminance, 25-40°C operating temperature**. Failure boundary: **Below 300 lux illuminance for &gt;5 seconds, above 50°C junction temperature, &gt;10% spectral shift from 550 nm center wavelength**, Mechanism: **LED quantum efficiency degradation due to Arrhenius thermal aging (activation energy 0.43 eV), phosphor thermal quenching above 150°C, photometric decay following Lambert-Beer law with 0.02%/kh degradation coefficient**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Junction temperature exceeding 125°C due to inadequate heat sinking (thermal resistance &gt;15 K/W) | 8 | LED luminous flux decay to 70% of initial value within 1000 hours | Copper-core MCPCB with thermal vias, forced convection cooling maintaining ΔT&lt;30°C above ambient |
| PWM driver frequency instability causing 120 Hz flicker (modulation depth &gt;30%) | 8 | Stroboscopic artifacts in SPI camera images with &gt;5% intensity variation | Constant current drivers with &gt;90% current regulation ratio, LC filtering with cutoff frequency &lt;100 Hz |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | lux | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [LED Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-array.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Solder Paste Inspection Camera**, **Printed Circuit Board Conveyor System**, **Machine Vision Software Platform**  
**Downstream Applications**: Smartphones, Automotive Control Units, Medical Diagnostic Equipment  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What makes this illumination system suitable for solder paste inspection?
**A**: This system uses high-brightness LEDs with optical diffusers to create uniform, high-contrast lighting that reveals solder paste details on PCBs, essential for accurate inspection camera performance.

### Q: How does the aluminum heat sink benefit the illumination system?
**A**: The aluminum heat sink efficiently dissipates heat from the high-brightness LEDs, ensuring consistent light output, preventing thermal degradation, and extending the system's operational lifespan in industrial environments.

### Q: Can this illumination system be integrated with existing SPI equipment?
**A**: Yes, the system includes a universal mounting bracket and is designed for compatibility with standard solder paste inspection cameras, allowing for straightforward integration into existing manufacturing lines.

## 6. Manufacturing Compliance
- ISO 8995-1:2021 (LIGHTING OF WORK PLACES)
- DIN EN 12464-1:2021 (LIGHT AND LIGHTING - LIGHTING OF WORK PLACES)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Illumination System](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/illumination-system)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: ILLUMINATION_SYSTEM | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 127ff84d
