---
title: "Infrared Detector"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:INFRARED_DETECTOR"
  data_integrity_hash: "f6f795a997af63447a25eee64b51f17e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:INFRARED_DETECTOR"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/infrared-detector.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/infrared-detector"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "7.5-14.0 μm wavelength, -40°C to +85°C ambient temperature, 3.3-5.0 VDC supply voltage"
    unit: "μm"
engineering_limits:
  max_safe_operating_point:
    value: 0.8
    unit: "A"
    consequence: "Quantum efficiency degradation due to lattice defects in HgCdTe semiconductor material at temperatures above 85°C, thermomechanical stress from coefficient of thermal expansion mismatch between detector chip (17×10⁻⁶/K) and substrate (6×10⁻⁶/K)"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 2 kV HBM (Human Body Model) during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrate 500 Ω series resistors and 3.3 pF shunt capacitors at all I/O pins, implement grounded wrist strap protocols during assembly"
  - node_2:
      trigger: "Condensation formation on detector window due to dew point crossing at 60% RH and 25°C ambient"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Hermetic sealing with 0.5 atm dry nitrogen purge, integrated thermoelectric cooler maintaining window at 5°C above ambient temperature"
bom_nodes:
  active-element:
    type: "component"
    urn: "URN:CNFX:ME:ACTIVE_ELEMENT"
    interface_type: "physical-logic-coupled"
  housingwindow:
    type: "part"
    urn: "URN:CNFX:ME:HOUSINGWINDOW"
    interface_type: "physical-logic-coupled"
  electrical-contacts:
    type: "component"
    urn: "URN:CNFX:ME:ELECTRICAL_CONTACTS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 18434-1:2008 (CONDITION MONITORING AND DIAGNOSTICS OF MACHINES - THERMOGRAPHY)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ISA-12.12.01-2007 (NONINCENDIVE ELECTRICAL EQUIPMENT FOR USE IN CLASS I AND II, DIVISION 2 AND CLASS III, DIVISIONS 1 AND 2 HAZARDOUS (CLASSIFIED) LOCATIONS)"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 61000-6-2:2019 (ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 6-2: GENERIC STANDARDS - IMMUNITY STANDARD FOR INDUSTRIAL ENVIRONMENTS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/infrared-detector.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "00ba7f78680e6775a082662997df5b23374cbbbde7e517029cab12fec488c6e9"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Infrared Detector

## 1. Technical Definition
A sensor component that detects infrared radiation and converts it into an electrical signal.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **7.5-14.0 μm wavelength, -40°C to +85°C ambient temperature, 3.3-5.0 VDC supply voltage**. Failure boundary: **Detector responsivity drops below 0.8 A/W at 10.6 μm wavelength, dark current exceeds 1.0 nA at 25°C, noise equivalent power exceeds 1.0×10⁻¹¹ W/√Hz**, Mechanism: **Quantum efficiency degradation due to lattice defects in HgCdTe semiconductor material at temperatures above 85°C, thermomechanical stress from coefficient of thermal expansion mismatch between detector chip (17×10⁻⁶/K) and substrate (6×10⁻⁶/K)**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 2 kV HBM (Human Body Model) during handling | 8 | Gate oxide breakdown in readout integrated circuit, creating permanent short circuit paths | Integrate 500 Ω series resistors and 3.3 pF shunt capacitors at all I/O pins, implement grounded wrist strap protocols during assembly |
| Condensation formation on detector window due to dew point crossing at 60% RH and 25°C ambient | 8 | Infrared absorption and scattering losses exceeding 30% at 10.6 μm wavelength | Hermetic sealing with 0.5 atm dry nitrogen purge, integrated thermoelectric cooler maintaining window at 5°C above ambient temperature |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | μm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Housing/Window](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/housingwindow.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vacuum Deposition System**, **Wafer Probing Station**, **Thermal Cycling Chamber**  
**Downstream Applications**: Night Vision Devices, Thermal Imaging Cameras, Motion Detection Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key materials used in infrared detectors for electronic manufacturing?
**A**: Infrared detectors primarily use semiconductor materials like Silicon, Germanium, or InGaAs, and pyroelectric crystals such as Lithium Tantalate to detect and convert infrared radiation into electrical signals.

### Q: What components are included in a typical infrared detector BOM?
**A**: A standard Bill of Materials includes the Active Element (detection material), Electrical Contacts for signal output, and Housing/Window to protect the sensor while allowing IR transmission.

### Q: How do infrared detectors integrate with computer and optical manufacturing systems?
**A**: Infrared detectors serve as critical sensor components in various applications including thermal imaging, motion detection, spectroscopy, and quality control systems within computer, electronic, and optical product manufacturing.

## 6. Manufacturing Compliance
- ISO 18434-1:2008 (CONDITION MONITORING AND DIAGNOSTICS OF MACHINES - THERMOGRAPHY)
- ANSI/ISA-12.12.01-2007 (NONINCENDIVE ELECTRICAL EQUIPMENT FOR USE IN CLASS I AND II, DIVISION 2 AND CLASS III, DIVISIONS 1 AND 2 HAZARDOUS (CLASSIFIED) LOCATIONS)
- DIN EN 61000-6-2:2019 (ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 6-2: GENERIC STANDARDS - IMMUNITY STANDARD FOR INDUSTRIAL ENVIRONMENTS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Infrared Detector](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/infrared-detector)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: INFRARED_DETECTOR | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 094eb87b
