---
title: "Interconnection matrix"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:INTERCONNECTION_MATRIX"
  data_integrity_hash: "78aaf61e1d27154765d48b774c3f8b4e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:INTERCONNECTION_MATRIX"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interconnection-matrix.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interconnection-matrix"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-5 VDC signal voltage, 1-100 mA current per channel, -40°C to +85°C ambient temperature"
    unit: "μm"
engineering_limits:
  max_safe_operating_point:
    value: 40
    unit: "dB"
    consequence: "Electromigration at current densities &gt; 10⁶ A/cm² causing open circuits, thermal expansion mismatch (CTE difference &gt; 10 ppm/°C) between copper traces (17 ppm/°C) and FR-4 substrate (13-17 ppm/°C) causing trace delamination"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge (ESD) event exceeding 2 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with &lt; 1 ns response time at each I/O pad"
  - node_2:
      trigger: "Thermal cycling between -40°C and +125°C at &gt; 1000 cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Use of SAC305 solder alloy with copper-nickel-gold pad finish and strain relief routing"
bom_nodes:
  conductive-trace:
    type: "component"
    urn: "URN:CNFX:ME:CONDUCTIVE_TRACE"
    interface_type: "physical-logic-coupled"
  dielectric-layer:
    type: "component"
    urn: "URN:CNFX:ME:DIELECTRIC_LAYER"
    interface_type: "physical-logic-coupled"
  contact-pad:
    type: "component"
    urn: "URN:CNFX:ME:CONTACT_PAD"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interconnection-matrix.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8fdecaa6c3c32d565f74d5f603945ead9c86283b402da7883d601b1e05ba8208"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Interconnection matrix

## 1. Technical Definition
A structured network of electrical connections that routes signals between individual photodetectors in an array.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-5 VDC signal voltage, 1-100 mA current per channel, -40°C to +85°C ambient temperature**. Failure boundary: **Signal crosstalk exceeding -40 dB isolation, contact resistance &gt; 100 mΩ per connection, dielectric breakdown at &gt; 500 VDC between adjacent traces**, Mechanism: **Electromigration at current densities &gt; 10⁶ A/cm² causing open circuits, thermal expansion mismatch (CTE difference &gt; 10 ppm/°C) between copper traces (17 ppm/°C) and FR-4 substrate (13-17 ppm/°C) causing trace delamination**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge (ESD) event exceeding 2 kV HBM | 8 | Dielectric breakdown between adjacent signal traces | Integrated ESD protection diodes with &lt; 1 ns response time at each I/O pad |
| Thermal cycling between -40°C and +125°C at &gt; 1000 cycles | 8 | Solder joint fatigue causing intermittent connections | Use of SAC305 solder alloy with copper-nickel-gold pad finish and strain relief routing |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | μm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Precision Wire Bonder**, **Automated Optical Inspection System**, **Clean Room Environmental Control System**  
**Downstream Applications**: Medical Imaging Sensors, Astronomical Telescopes, LIDAR Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in interconnection matrices for photodetector arrays?
**A**: Our interconnection matrices utilize copper and aluminum for conductive traces, gold for contact pads, and polyimide as the dielectric substrate material to ensure optimal signal integrity and durability.

### Q: How does an interconnection matrix improve photodetector array performance?
**A**: The structured network of electrical connections in an interconnection matrix provides precise signal routing between individual photodetectors, reducing crosstalk and latency while maintaining signal integrity across the array.

### Q: What are the key components in an interconnection matrix BOM?
**A**: The bill of materials includes conductive traces (typically copper or aluminum), contact pads (often gold-plated for corrosion resistance), and dielectric layers (usually polyimide) that provide electrical insulation between conductive elements.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Interconnection matrix](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interconnection-matrix)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: INTERCONNECTION_MATRIX | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: e7dcdddc
