---
title: "Interdigital Transducer (IDT)"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:INTERDIGITAL_TRANSDUCER_IDT"
  data_integrity_hash: "ed22226adb8698c155a50e2b114c7e4e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:INTERDIGITAL_TRANSDUCER_IDT"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interdigital-transducer-idt.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interdigital-transducer-idt"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "10-1000 MHz frequency range, 1-50 Vpp input voltage, -40°C to +85°C temperature range"
    unit: "μm"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch (Al electrode: 23×10⁻⁶/K vs. LiNbO₃ substrate: 15×10⁻⁶/K) causes interfacial stress; acoustic wave reflection at electrode edges creates standing wave stress concentrations; electron wind force exceeds atomic binding energy at high current densities"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrode corrosion from chloride ion contamination at 50 ppm concentration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Hermetic sealing with Au/Ni under-bump metallization, moisture-resistant polyimide passivation layer"
  - node_2:
      trigger: "Substrate microcrack propagation from 100 MPa cyclic thermal stress during 10⁶ power cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Stress-relief electrode design with tapered finger ends, substrate polishing to &lt;5 nm RMS surface roughness"
bom_nodes:
  interdigitated-electrodes:
    type: "component"
    urn: "URN:CNFX:ME:INTERDIGITATED_ELECTRODES"
    interface_type: "physical-logic-coupled"
  bus-bars:
    type: "component"
    urn: "URN:CNFX:ME:BUS_BARS"
    interface_type: "physical-logic-coupled"
  piezoelectric-substrate:
    type: "component"
    urn: "URN:CNFX:ME:PIEZOELECTRIC_SUBSTRATE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/IEEE 176-1987 STANDARD ON PIEZOELECTRICITY"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interdigital-transducer-idt.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "7d22e99e7526f298b53e3450cc0521bee2b704d611375f38e343af86e4eb388a"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Interdigital Transducer (IDT)

## 1. Technical Definition
A transducer that converts electrical signals to surface acoustic waves (SAWs) and vice versa through interleaved metal electrodes.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **10-1000 MHz frequency range, 1-50 Vpp input voltage, -40°C to +85°C temperature range**. Failure boundary: **Electrode delamination at 150°C substrate temperature, piezoelectric substrate fracture at 1.5 GPa mechanical stress, electrode electromigration at 2×10⁶ A/cm² current density**, Mechanism: **Thermal expansion coefficient mismatch (Al electrode: 23×10⁻⁶/K vs. LiNbO₃ substrate: 15×10⁻⁶/K) causes interfacial stress; acoustic wave reflection at electrode edges creates standing wave stress concentrations; electron wind force exceeds atomic binding energy at high current densities**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrode corrosion from chloride ion contamination at 50 ppm concentration | 8 | Increased insertion loss exceeding 3 dB specification, frequency response distortion &gt;5% | Hermetic sealing with Au/Ni under-bump metallization, moisture-resistant polyimide passivation layer |
| Substrate microcrack propagation from 100 MPa cyclic thermal stress during 10⁶ power cycles | 8 | Acoustic wave scattering causing 15% velocity variation, spurious resonance modes at ±2% frequency offset | Stress-relief electrode design with tapered finger ends, substrate polishing to &lt;5 nm RMS surface roughness |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | μm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Photolithography System**, **Thin Film Deposition System**, **Surface Acoustic Wave Analyzer**  
**Downstream Applications**: RF Filters, Wireless Communication Modules, Sensors for IoT Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications of Interdigital Transducers in electronics manufacturing?
**A**: IDTs are essential components in surface acoustic wave (SAW) devices including filters, resonators, delay lines, and sensors used in telecommunications, RF systems, and signal processing applications.

### Q: How does the choice of piezoelectric substrate material affect IDT performance?
**A**: Substrate materials like Lithium Niobate (LiNbO₃) offer high electromechanical coupling for broadband applications, while quartz provides excellent temperature stability and low loss for precision frequency control devices.

### Q: What factors determine the operating frequency range of an Interdigital Transducer?
**A**: The IDT's operating frequency is primarily determined by the electrode finger spacing (pitch) and the acoustic velocity of the piezoelectric substrate, with typical ranges from MHz to several GHz depending on design parameters.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- ANSI/IEEE 176-1987 STANDARD ON PIEZOELECTRICITY

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Interdigital Transducer (IDT)](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interdigital-transducer-idt)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: INTERDIGITAL_TRANSDUCER_IDT | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 76e22277
