---
title: "Interface Board"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:INTERFACE_BOARD"
  data_integrity_hash: "cc32662001b8cfdf4c91069cab2fc9ac"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:INTERFACE_BOARD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interface-board.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interface-board"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 3.3V ±5% supply voltage, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Coefficient of thermal expansion mismatch between FR-4 substrate (14-17 ppm/°C) and copper traces (16.6 ppm/°C) causing solder joint fatigue; electromigration at current densities exceeding 10^5 A/cm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5ns response time and 15kV IEC 61000-4-2 protection on all I/O lines"
  - node_2:
      trigger: "Thermal cycling between -40°C and 125°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 lead-free solder with 25.5 ppm/°C CTE matched to FR-4 substrate, 0.5mm pitch BGA underfill"
bom_nodes:
  pcb-substrate:
    type: "component"
    urn: "URN:CNFX:ME:PCB_SUBSTRATE"
    interface_type: "physical-logic-coupled"
  connectors-e-g-ffc-board-to-board:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTORS_E_G_FFC_BOARD_TO_BOARD"
    interface_type: "physical-logic-coupled"
  voltage-regulator-module-vrm:
    type: "part"
    urn: "URN:CNFX:ME:VOLTAGE_REGULATOR_MODULE_VRM"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuitry:
    type: "part"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUITRY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "EN 55032:2015 ELECTROMAGNETIC COMPATIBILITY OF MULTIMEDIA EQUIPMENT"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interface-board.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "d26cbb7d0d864f7eecf847493fd696713fd0d1c2d9bf6fffadba2c2ea9ad140a"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Interface Board

## 1. Technical Definition
A printed circuit board that provides electrical and data connectivity between the Vision Processing Unit and external devices or subsystems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 3.3V ±5% supply voltage, 0-100% relative humidity (non-condensing)**. Failure boundary: **Solder joint fracture at 150°C glass transition temperature, dielectric breakdown at 500V/mm for FR-4 substrate, copper trace delamination at 260°C reflow temperature**, Mechanism: **Coefficient of thermal expansion mismatch between FR-4 substrate (14-17 ppm/°C) and copper traces (16.6 ppm/°C) causing solder joint fatigue; electromigration at current densities exceeding 10^5 A/cm²**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8kV human body model | 8 | Gate oxide breakdown in CMOS components with immediate data corruption | TVS diodes with 5ns response time and 15kV IEC 61000-4-2 protection on all I/O lines |
| Thermal cycling between -40°C and 125°C at 10 cycles/hour | 8 | Solder joint crack propagation leading to intermittent connectivity loss | SAC305 lead-free solder with 25.5 ppm/°C CTE matched to FR-4 substrate, 0.5mm pitch BGA underfill |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Voltage Regulator Module (VRM)](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/voltage-regulator-module-vrm.md) `(Standalone System)`
- [Signal Conditioning Circuitry](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuitry.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Optical Inspection System**, **Solder Paste Printer**, **Reflow Oven**  
**Downstream Applications**: Autonomous Vehicle Vision System, Industrial Machine Vision Camera, Medical Imaging Device  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of this interface board?
**A**: This interface board provides electrical and data connectivity between a Vision Processing Unit (VPU) and external devices or subsystems, facilitating signal transmission and power distribution.

### Q: What materials are used in the construction of this interface board?
**A**: The board is constructed using FR-4 epoxy laminate substrate, copper traces and planes, solder mask, silkscreen labeling, and various electronic components including resistors, capacitors, ICs, and connectors.

### Q: What types of connectors are typically included on this interface board?
**A**: Common connectors include FFC (Flexible Flat Cable) connectors for flexible connections and board-to-board connectors for rigid inter-board connections, along with other industry-standard interfaces.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS
- EN 55032:2015 ELECTROMAGNETIC COMPATIBILITY OF MULTIMEDIA EQUIPMENT

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Interface Board](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interface-board)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: INTERFACE_BOARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 7a22151d
