---
title: "Interface PCB"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:INTERFACE_PCB"
  data_integrity_hash: "9d749d547f9ab73d81f7742119fe452c"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:INTERFACE_PCB"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interface-pcb.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interface-pcb"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 0-95% relative humidity non-condensing, 4.75-5.25V DC input voltage"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 130
    unit: "°C"
    consequence: "Thermal expansion coefficient mismatch between FR-4 substrate (CTE=14-18 ppm/°C) and copper traces (CTE=17 ppm/°C) causing solder joint fatigue, electromigration at current densities above 10⁶ A/cm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with clamping voltage of 9V and response time &lt;1 ns at board entry points"
  - node_2:
      trigger: "Thermal cycling between -40°C and 125°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Use of SAC305 solder with creep resistance and underfill encapsulation with CTE=28 ppm/°C"
bom_nodes:
  test-point-array:
    type: "component"
    urn: "URN:CNFX:ME:TEST_POINT_ARRAY"
    interface_type: "physical-logic-coupled"
  ate-connector:
    type: "part"
    urn: "URN:CNFX:ME:ATE_CONNECTOR"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuitry:
    type: "part"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUITRY"
    interface_type: "physical-logic-coupled"
  ground-plane:
    type: "component"
    urn: "URN:CNFX:ME:GROUND_PLANE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/interface-pcb.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "6edc83087e902952fe01025c51b750c895c150435068e2bc6ab32a63c850b14d"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Interface PCB

## 1. Technical Definition
A printed circuit board designed specifically for interfacing between test equipment and devices under test within a test fixture system.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 0-95% relative humidity non-condensing, 4.75-5.25V DC input voltage**. Failure boundary: **PCB substrate glass transition temperature Tg=130°C, copper trace current density exceeding 35 A/mm², solder joint thermal cycling exceeding 1000 cycles at ΔT=100°C**, Mechanism: **Thermal expansion coefficient mismatch between FR-4 substrate (CTE=14-18 ppm/°C) and copper traces (CTE=17 ppm/°C) causing solder joint fatigue, electromigration at current densities above 10⁶ A/cm²**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM | 8 | Gate oxide breakdown in interface ICs with dielectric strength of 10 MV/cm | TVS diodes with clamping voltage of 9V and response time &lt;1 ns at board entry points |
| Thermal cycling between -40°C and 125°C at 10 cycles/hour | 8 | Solder joint crack propagation following Coffin-Manson equation with fatigue exponent n=1.9 | Use of SAC305 solder with creep resistance and underfill encapsulation with CTE=28 ppm/°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [ATE Connector](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/ate-connector.md) `(Standalone System)`
- [Signal Conditioning Circuitry](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuitry.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Optical Inspection System**, **Solder Paste Printer**, **Reflow Oven**  
**Downstream Applications**: Automated Test Equipment Systems, Semiconductor Test Handlers, Medical Device Test Fixtures  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary application of this Interface PCB?
**A**: This Interface PCB is specifically designed for interfacing between automated test equipment (ATE) and devices under test within test fixture systems in computer, electronic, and optical product manufacturing, ensuring accurate signal transmission and conditioning during testing procedures.

### Q: What materials are used in this Interface PCB construction?
**A**: The PCB is built with an FR-4 substrate for durability, copper traces for reliable conductivity, solder mask for protection against oxidation and short circuits, and silkscreen for component identification and assembly guidance.

### Q: What key components are included in the BOM for this Interface PCB?
**A**: The bill of materials includes ATE connectors for equipment interfacing, a ground plane for noise reduction, signal conditioning circuitry for accurate test signals, and a test point array for diagnostic access during testing operations.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Interface PCB](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/interface-pcb)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: INTERFACE_PCB | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 028f7fbe
