---
title: "LED Illumination Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:LED_ILLUMINATION_ARRAY"
  data_integrity_hash: "acbbe6ddbdd622556cb902df7e869fff"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:LED_ILLUMINATION_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-illumination-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-illumination-array"
  is_verified_logic: true
attributes:
  primary_spec:
    status: "config-dependent"
    typical_range: "2.8-3.5 VDC per LED, 20-85°C ambient temperature, 0-85% relative humidity"
    unit: "lumens"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Quantum efficiency degradation due to non-radiative recombination centers forming at high temperatures (Arrhenius model with activation energy 0.3-0.5 eV), electromigration of indium tin oxide contacts at current densities above 35 A/mm², phosphor thermal quenching above 150°C reducing conversion efficiency by 15%/10°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal runaway from inadequate heat sinking (thermal resistance &gt; 15 K/W)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-core MCPCB with thermal conductivity &gt; 4 W/m·K and forced air cooling maintaining ΔT&lt;40°C"
  - node_2:
      trigger: "Current imbalance in parallel LED strings exceeding 15% due to forward voltage variance"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Constant current drivers with individual string current monitoring and balancing resistors with 1% tolerance"
bom_nodes:
  led-chips-0:
    type: "component"
    urn: "URN:CNFX:ME:LED_CHIPS_0"
    interface_type: "physical-logic-coupled"
  heat-sink-1:
    type: "component"
    urn: "URN:CNFX:ME:HEAT_SINK_1"
    interface_type: "physical-logic-coupled"
  optical-lensdiffuser-2:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_LENSDIFFUSER_2"
    interface_type: "physical-logic-coupled"
  driver-circuit-3:
    type: "part"
    urn: "URN:CNFX:ME:DRIVER_CIRCUIT"
    interface_type: "physical-logic-coupled"
  housingenclosure-4:
    type: "component"
    urn: "URN:CNFX:ME:HOUSINGENCLOSURE_4"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-illumination-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "03c8ccd0ea284fcbb8b0a9edd1a2074d72347b68241f45fd194bf1b14f101060"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: LED Illumination Array

## 1. Technical Definition
A modular assembly of multiple LED light sources arranged in a specific pattern to provide controlled illumination within an industrial system.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.8-3.5 VDC per LED, 20-85°C ambient temperature, 0-85% relative humidity**. Failure boundary: **Junction temperature exceeding 150°C, forward voltage drop below 2.5V or above 3.8V, luminous flux degradation below 70% of initial output**, Mechanism: **Quantum efficiency degradation due to non-radiative recombination centers forming at high temperatures (Arrhenius model with activation energy 0.3-0.5 eV), electromigration of indium tin oxide contacts at current densities above 35 A/mm², phosphor thermal quenching above 150°C reducing conversion efficiency by 15%/10°C**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal runaway from inadequate heat sinking (thermal resistance &gt; 15 K/W) | 8 | LED junction temperature exceeds 150°C causing catastrophic bond wire failure | Copper-core MCPCB with thermal conductivity &gt; 4 W/m·K and forced air cooling maintaining ΔT&lt;40°C |
| Current imbalance in parallel LED strings exceeding 15% due to forward voltage variance | 8 | Individual LED current exceeds maximum rating of 350 mA causing localized thermal degradation | Constant current drivers with individual string current monitoring and balancing resistors with 1% tolerance |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| primary_spec | Config-dependent | lumens | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Driver Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driver-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Power Supply Unit**, **Thermal Management System**, **Optical Measurement Equipment**  
**Downstream Applications**: Industrial Machine Vision Systems, Precision Assembly Workstations, Automated Inspection Stations  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications for this LED illumination array?
**A**: This LED array is designed for industrial systems requiring precise, controlled illumination, such as machine vision, inspection equipment, medical devices, and automated manufacturing processes where consistent lighting is critical.

### Q: How does the aluminum heat sink improve performance?
**A**: The aluminum heat sink efficiently dissipates heat from the LED chips, preventing thermal degradation, maintaining optimal light output, and extending the product's operational lifespan in demanding industrial environments.

### Q: Can the optical lens/diffuser be customized for specific applications?
**A**: Yes, the polycarbonate or glass optical components can be customized with different diffusion patterns, beam angles, and protective coatings to meet specific illumination requirements for various industrial and optical applications.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: LED Illumination Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-illumination-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: LED_ILLUMINATION_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: c8bbf444
