---
title: "LED Light Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:LED_LIGHT_MODULE"
  data_integrity_hash: "1bfc5cf423d706c4e62df53d429d49f9"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:LED_LIGHT_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-light-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-light-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.7-3.6 VDC, -40 to +85 °C, 0-100% relative humidity (non-condensing)"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 150
    unit: "°C"
    consequence: "Thermal runaway due to negative temperature coefficient of forward voltage, quantum efficiency degradation at high temperatures, electromigration in bond wires at 150°C+"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with 5 ns response time, ESD-protected MOSFETs with 15 kV rating"
  - node_2:
      trigger: "Thermal interface degradation (thermal resistance increase from 2.5 to 10 K/W)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Thermal vias with 0.5 mm pitch, phase-change materials with 3.5 W/m·K conductivity"
bom_nodes:
  led-array:
    type: "part"
    urn: "URN:CNFX:ME:LED_ARRAY"
    interface_type: "physical-logic-coupled"
  driver-circuit-board:
    type: "part"
    urn: "URN:CNFX:ME:DRIVER_CIRCUIT_BOARD"
    interface_type: "physical-logic-coupled"
  thermal-management-plate:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_MANAGEMENT_PLATE"
    interface_type: "physical-logic-coupled"
  optical-diffuser:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_DIFFUSER"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI C78.377-2017 (SPECIFICATIONS FOR THE CHROMATICITY OF SOLID STATE LIGHTING PRODUCTS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-light-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "5365d10b4fecb7bbf86221fd75339059ad39f56f82119387e98e14b348b32a03"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: LED Light Module

## 1. Technical Definition
Integrated light-emitting component containing LED chips, driver circuitry, and optical elements

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.7-3.6 VDC, -40 to +85 °C, 0-100% relative humidity (non-condensing)**. Failure boundary: **Junction temperature exceeding 150°C, forward current exceeding 350 mA, reverse voltage exceeding 5 V**, Mechanism: **Thermal runaway due to negative temperature coefficient of forward voltage, quantum efficiency degradation at high temperatures, electromigration in bond wires at 150°C+**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM | 8 | Gate oxide breakdown in driver IC, LED chip junction damage | TVS diodes with 5 ns response time, ESD-protected MOSFETs with 15 kV rating |
| Thermal interface degradation (thermal resistance increase from 2.5 to 10 K/W) | 8 | Junction temperature rise to 180°C, luminous flux decay to 70% of initial | Thermal vias with 0.5 mm pitch, phase-change materials with 3.5 W/m·K conductivity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [LED Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-array.md) `(Standalone System)`
- [Driver Circuit Board](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driver-circuit-board.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: LED Displays, Automotive Lighting Systems, Consumer Electronics Backlighting  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What thermal management features does this LED light module include?
**A**: The module incorporates a thermal management plate and thermal interface material to efficiently dissipate heat from LED chips, ensuring optimal performance and longevity in electronic applications.

### Q: How is the optical performance optimized in this LED module?
**A**: An optical diffuser is integrated to evenly distribute light output, while the LED array configuration and driver circuitry are designed to provide consistent illumination for computer and optical product applications.

### Q: What makes this LED module suitable for computer manufacturing applications?
**A**: With its compact PCB substrate design, integrated driver circuitry, and robust thermal management, this module is engineered for reliable integration into computer systems, displays, and optical devices requiring precise lighting solutions.

## 6. Manufacturing Compliance
- ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)
- ANSI C78.377-2017 (SPECIFICATIONS FOR THE CHROMATICITY OF SOLID STATE LIGHTING PRODUCTS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: LED Light Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-light-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: LED_LIGHT_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 78b9468e
