---
title: "LED Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:LED_MODULE"
  data_integrity_hash: "5300a8bcc85bc672a7076c5c66624126"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:LED_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.7-3.6 V, -40 to +85 °C, 10-100 mA forward current"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 3.8
    unit: "V"
    consequence: "Electromigration in aluminum interconnects at 125 °C, quantum efficiency degradation above 3.8 V reverse bias, thermal runaway at 150 mA due to positive temperature coefficient"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 2 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated TVS diodes with 1.5 kV clamping voltage, 5 Ω series resistors on all I/O pins"
  - node_2:
      trigger: "Thermal cycling between -40 °C and +85 °C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "SAC305 solder with 0.3 mm standoff height, conformal coating with 0.1 mm silicone layer"
bom_nodes:
  led-chip:
    type: "component"
    urn: "URN:CNFX:ME:LED_CHIP"
    interface_type: "physical-logic-coupled"
  substratepcb:
    type: "component"
    urn: "URN:CNFX:ME:SUBSTRATEPCB"
    interface_type: "physical-logic-coupled"
  driver-circuit:
    type: "part"
    urn: "URN:CNFX:ME:DRIVER_CIRCUIT"
    interface_type: "physical-logic-coupled"
  encapsulation:
    type: "component"
    urn: "URN:CNFX:ME:ENCAPSULATION"
    interface_type: "physical-logic-coupled"
  connector:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "DIN EN 60598-1:2021 - LUMINAIRES - GENERAL REQUIREMENTS AND TESTS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "ed74c78dbdea319c36ac1db87cced39695fa0bc14f6cb9728911e7417b71926f"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: LED Module

## 1. Technical Definition
A compact assembly containing one or more light-emitting diodes (LEDs) and supporting circuitry, designed as a standardized unit for integration into status indicator systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.7-3.6 V, -40 to +85 °C, 10-100 mA forward current**. Failure boundary: **3.8 V reverse voltage, 150 mA forward current, 125 °C junction temperature**, Mechanism: **Electromigration in aluminum interconnects at 125 °C, quantum efficiency degradation above 3.8 V reverse bias, thermal runaway at 150 mA due to positive temperature coefficient**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 2 kV HBM | 8 | Gate oxide breakdown in MOSFET driver IC | Integrated TVS diodes with 1.5 kV clamping voltage, 5 Ω series resistors on all I/O pins |
| Thermal cycling between -40 °C and +85 °C at 10 cycles/hour | 8 | Solder joint fatigue cracking at LED-to-PCB interface | SAC305 solder with 0.3 mm standoff height, conformal coating with 0.1 mm silicone layer |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Driver Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driver-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Computer Status Indicator Panels, Electronic Device Status Lights, Optical Equipment Display Modules  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key materials used in these LED modules?
**A**: Our LED modules utilize semiconductor materials like GaAs, GaP, and InGaN for the LED chips, with epoxy resin encapsulation, copper alloy substrates, and gold bonding wires for durability and optimal performance.

### Q: How are these LED modules integrated into electronic systems?
**A**: These are standardized units designed for seamless integration into status indicator systems. They include connectors and driver circuits, making them plug-and-play components for computer, electronic, and optical product manufacturing.

### Q: What makes these LED modules suitable for industrial applications?
**A**: The compact design, robust encapsulation, and high-quality materials ensure reliable performance in demanding environments. They provide consistent brightness and longevity for status indicators in various electronic and optical products.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- DIN EN 60598-1:2021 - LUMINAIRES - GENERAL REQUIREMENTS AND TESTS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: LED Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/led-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: LED_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2e809710
