---
title: "Light Source/Detector (for optical encoders)"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:LIGHT_SOURCEDETECTOR_FOR_OPTICAL_ENCODERS"
  data_integrity_hash: "3990da9ecb406746cf57f35eeee82e8b"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:LIGHT_SOURCEDETECTOR_FOR_OPTICAL_ENCODERS"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/light-sourcedetector-for-optical-encoders.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/light-sourcedetector-for-optical-encoders"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "400-700 nm wavelength, 5-50 mW optical power output, -40°C to +85°C operating temperature"
    unit: "nm"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Thermal degradation of semiconductor p-n junctions causing increased non-radiative recombination, quantum efficiency reduction below 15%, and lattice defect propagation at elevated temperatures"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8 kV HBM (Human Body Model) during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "ESD-protected packaging with conductive foam, wrist strap grounding protocols, and on-chip Zener diode protection circuits"
  - node_2:
      trigger: "Continuous operation at ambient temperature &gt; 85°C without adequate heat sinking"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-core PCB thermal vias, aluminum nitride substrates with 2.5 W/m·K thermal conductivity, and temperature monitoring with automatic power reduction at 100°C"
bom_nodes:
  led-chip:
    type: "component"
    urn: "URN:CNFX:ME:LED_CHIP"
    interface_type: "physical-logic-coupled"
  photodiode-array:
    type: "part"
    urn: "URN:CNFX:ME:PHOTODIODE_ARRAY"
    interface_type: "physical-logic-coupled"
  optical-lens:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_LENS"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 16063-1:1998 (VIBRATION AND SHOCK SENSOR CALIBRATION)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASME B46.1-2019 (SURFACE TEXTURE)"
    scope: "Verified Engineering Specification"
  - standard: "DIN 19245-1:1992 (OPTICAL ENCODERS - GENERAL REQUIREMENTS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/light-sourcedetector-for-optical-encoders.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "95b53935bb781c526139a132e11b9198e529338a660f7be66587d9da99e0f432"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Light Source/Detector (for optical encoders)

## 1. Technical Definition
Integrated optical component that generates and senses light signals for position detection in optical encoders.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **400-700 nm wavelength, 5-50 mW optical power output, -40°C to +85°C operating temperature**. Failure boundary: **LED/Laser diode junction temperature exceeds 125°C, photodiode dark current exceeds 100 nA at 25°C, optical output power drops below 2 mW**, Mechanism: **Thermal degradation of semiconductor p-n junctions causing increased non-radiative recombination, quantum efficiency reduction below 15%, and lattice defect propagation at elevated temperatures**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8 kV HBM (Human Body Model) during handling | 8 | Catastrophic LED/photodiode junction breakdown with leakage current &gt; 1 mA at 5V reverse bias | ESD-protected packaging with conductive foam, wrist strap grounding protocols, and on-chip Zener diode protection circuits |
| Continuous operation at ambient temperature &gt; 85°C without adequate heat sinking | 8 | Thermal runaway causing LED luminous flux degradation &gt; 50% after 1000 hours, wavelength shift &gt; 10 nm | Copper-core PCB thermal vias, aluminum nitride substrates with 2.5 W/m·K thermal conductivity, and temperature monitoring with automatic power reduction at 100°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | nm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Photodiode Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/photodiode-array.md) `(Standalone System)`
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Precision Clean Room Environment**, **Automated Pick-and-Place Machine**, **Laser Welding System**  
**Downstream Applications**: Optical Rotary Encoders, Linear Optical Encoders, Precision Motion Control Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What makes this light source/detector suitable for optical encoders?
**A**: The integrated design combines GaAs LEDs for stable light emission and silicon photodiodes for sensitive detection, providing reliable position sensing with minimal signal interference in encoder applications.

### Q: How does the epoxy resin encapsulation benefit the component?
**A**: Epoxy resin encapsulation protects the GaAs and silicon elements from environmental factors like moisture, dust, and mechanical stress, ensuring long-term reliability and consistent performance in industrial settings.

### Q: What applications is this component designed for?
**A**: This light source/detector is engineered for optical encoders used in computer, electronic, and optical product manufacturing, including robotics, CNC machines, medical devices, and precision measurement equipment requiring accurate position feedback.

## 6. Manufacturing Compliance
- ISO 16063-1:1998 (VIBRATION AND SHOCK SENSOR CALIBRATION)
- ANSI/ASME B46.1-2019 (SURFACE TEXTURE)
- DIN 19245-1:1992 (OPTICAL ENCODERS - GENERAL REQUIREMENTS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Light Source/Detector (for optical encoders)](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/light-sourcedetector-for-optical-encoders)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: LIGHT_SOURCEDETECTOR_FOR_OPTICAL_ENCODERS | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2194f7e7
