---
title: "Lighting Module"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:LIGHTING_MODULE"
  data_integrity_hash: "031578f1574d94b68714974e13817ae9"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:LIGHTING_MODULE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/lighting-module.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/lighting-module"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "2.8-3.6 VDC, 350-700 mA, 450-650 nm wavelength, 25-85°C ambient temperature"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Quantum efficiency degradation due to Auger recombination at high current densities (J &gt; 35 A/cm²), phosphor thermal quenching above 150°C, electromigration in wire bonds at current densities exceeding 10⁵ A/cm²"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal runaway from inadequate heat sinking (thermal resistance &gt; 15 K/W)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-core MCPCB with thermal vias, thermal interface material with conductivity &gt; 3 W/m·K"
  - node_2:
      trigger: "Electrostatic discharge exceeding 8 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with clamping voltage &lt; 5 V, ESD-protected driver ICs meeting IEC 61000-4-2 Level 4"
bom_nodes:
  led-array:
    type: "part"
    urn: "URN:CNFX:ME:LED_ARRAY"
    interface_type: "physical-logic-coupled"
  heat-sink:
    type: "component"
    urn: "URN:CNFX:ME:HEAT_SINK"
    interface_type: "physical-logic-coupled"
  driver-circuit:
    type: "part"
    urn: "URN:CNFX:ME:DRIVER_CIRCUIT"
    interface_type: "physical-logic-coupled"
  optical-lensdiffuser:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_LENSDIFFUSER"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - COMPLIANCE WITH EU DIRECTIVES (E.G., LOW VOLTAGE DIRECTIVE 2014/35/EU, ROHS 2011/65/EU)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/lighting-module.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "caaa87c4d96de41b1a793285aa50145b13ad2829d6bcb6c118e560b0f14f7b10"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Lighting Module

## 1. Technical Definition
A specialized lighting component designed to provide controlled illumination for vision alignment systems.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **2.8-3.6 VDC, 350-700 mA, 450-650 nm wavelength, 25-85°C ambient temperature**. Failure boundary: **LED junction temperature exceeding 125°C, forward current exceeding 750 mA, voltage drop below 2.5 VDC**, Mechanism: **Quantum efficiency degradation due to Auger recombination at high current densities (J &gt; 35 A/cm²), phosphor thermal quenching above 150°C, electromigration in wire bonds at current densities exceeding 10⁵ A/cm²**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal runaway from inadequate heat sinking (thermal resistance &gt; 15 K/W) | 8 | LED luminous flux decay exceeding 30% in 1000 hours | Copper-core MCPCB with thermal vias, thermal interface material with conductivity &gt; 3 W/m·K |
| Electrostatic discharge exceeding 8 kV HBM | 8 | LED catastrophic failure with open circuit | TVS diodes with clamping voltage &lt; 5 V, ESD-protected driver ICs meeting IEC 61000-4-2 Level 4 |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [LED Array](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/led-array.md) `(Standalone System)`
- [Driver Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/driver-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vision Alignment System**, **Precision Power Supply**, **Thermal Management System**  
**Downstream Applications**: Automated Optical Inspection Equipment, Semiconductor Manufacturing Equipment, Medical Imaging Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What applications is this lighting module designed for?
**A**: This lighting module is specifically engineered for vision alignment systems in computer, electronic, and optical product manufacturing, providing controlled illumination for precision assembly and inspection processes.

### Q: What materials are used in the construction of this lighting module?
**A**: The module features an aluminum alloy housing for durability and heat dissipation, high-quality LED chips, a polycarbonate lens/diffuser for optimal light control, and a copper PCB for reliable electrical performance.

### Q: What are the key components included in this lighting module?
**A**: The complete module includes a driver circuit for power management, a heat sink for thermal regulation, an LED array for illumination, and an optical lens/diffuser system for precise light distribution and control.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - COMPLIANCE WITH EU DIRECTIVES (E.G., LOW VOLTAGE DIRECTIVE 2014/35/EU, ROHS 2011/65/EU)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Lighting Module](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/lighting-module)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: LIGHTING_MODULE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 8f266f1c
