---
title: "Matching Network"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MATCHING_NETWORK"
  data_integrity_hash: "45034b5cde5eb4583efbffc651b9973d"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MATCHING_NETWORK"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1.5-3.0 Vrms, 50-2000 MHz, -40°C to +85°C"
    unit: "dB"
engineering_limits:
  max_safe_operating_point:
    value: 1
    unit: "VSWR"
    consequence: "Dielectric polarization loss (tan δ &gt; 0.002 at 1 GHz) causing thermal accumulation, skin effect resistance (δ = 2.3 μm at 1 GHz in copper) increasing ohmic losses, piezoelectric stress in ceramic substrates exceeding 150 MPa yield strength"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Harmonic resonance at 3rd/5th order frequencies creating standing waves"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Embedded λ/4 stub filters with 30 dB rejection at harmonic frequencies"
  - node_2:
      trigger: "Thermal expansion mismatch (CTE difference &gt; 8 ppm/°C) between alumina substrate and solder joints"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper-invar-copper composite substrates with matched CTE (5.5 ppm/°C)"
bom_nodes:
  inductor:
    type: "component"
    urn: "URN:CNFX:ME:INDUCTOR"
    interface_type: "physical-logic-coupled"
  capacitor:
    type: "component"
    urn: "URN:CNFX:ME:CAPACITOR"
    interface_type: "physical-logic-coupled"
  transmission-line:
    type: "component"
    urn: "URN:CNFX:ME:TRANSMISSION_LINE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)"
    scope: "Verified Engineering Specification"
  - standard: "ROHS DIRECTIVE 2011/65/EU (RESTRICTION OF HAZARDOUS SUBSTANCES)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "e7d0b4875aaee0cf031469996488bb543d14a4aab5907d2a60a74f36ac9132eb"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Matching Network

## 1. Technical Definition
A circuit component that ensures maximum power transfer between different impedance sections within a duplexer/diplexer.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1.5-3.0 Vrms, 50-2000 MHz, -40°C to +85°C**. Failure boundary: **Impedance mismatch exceeding 2:1 VSWR, dielectric breakdown at &gt;500 V/m, thermal runaway above 125°C junction temperature**, Mechanism: **Dielectric polarization loss (tan δ &gt; 0.002 at 1 GHz) causing thermal accumulation, skin effect resistance (δ = 2.3 μm at 1 GHz in copper) increasing ohmic losses, piezoelectric stress in ceramic substrates exceeding 150 MPa yield strength**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Harmonic resonance at 3rd/5th order frequencies creating standing waves | 8 | Localized dielectric heating exceeding 200°C causing substrate delamination | Embedded λ/4 stub filters with 30 dB rejection at harmonic frequencies |
| Thermal expansion mismatch (CTE difference &gt; 8 ppm/°C) between alumina substrate and solder joints | 8 | Solder joint fatigue cracking after 5000 thermal cycles (-40°C to +85°C) | Copper-invar-copper composite substrates with matched CTE (5.5 ppm/°C) |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | dB | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Vector Network Analyzer**, **Surface Mount Technology (SMT) Line**, **Automated Optical Inspection (AOI) System**  
**Downstream Applications**: RF Duplexers, RF Diplexers, Wireless Communication Modules  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of a matching network in duplexer/diplexer applications?
**A**: A matching network ensures maximum power transfer between different impedance sections within a duplexer or diplexer by matching their impedances, minimizing signal reflection and loss in RF systems.

### Q: What materials are commonly used in manufacturing matching networks?
**A**: Matching networks are typically constructed using copper for conductive traces, dielectric substrates like FR4 or Rogers material for the circuit board, and solder for component attachment, ensuring reliable RF performance.

### Q: What components are included in a typical matching network BOM?
**A**: A standard matching network bill of materials includes capacitors and inductors for impedance tuning, along with transmission lines for signal routing, all working together to achieve precise impedance matching in electronic systems.

## 6. Manufacturing Compliance
- ISO 9001:2015 (QUALITY MANAGEMENT SYSTEMS)
- ROHS DIRECTIVE 2011/65/EU (RESTRICTION OF HAZARDOUS SUBSTANCES)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Matching Network](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/matching-network)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MATCHING_NETWORK | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 9a2b86c1
