---
title: "Micro-lens Array"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MICRO_LENS_ARRAY"
  data_integrity_hash: "eeec2262a7cf06a2a661d6770445342c"
  source_authority: "https://cnfx.com"
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source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MICRO_LENS_ARRAY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/micro-lens-array.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/micro-lens-array"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "1.0-100.0 mW/mm² incident light intensity, 400-700 nm wavelength, -40°C to +85°C operating temperature"
    unit: "µm"
engineering_limits:
  max_safe_operating_point:
    value: 50
    unit: "nm"
    consequence: "Thermo-mechanical stress from coefficient of thermal expansion mismatch (CTE silicon: 2.6 ppm/°C vs. polymer lens: 60-80 ppm/°C) causing delamination; UV-induced photodegradation of polymer lens material at wavelengths &lt;400 nm; capillary forces during liquid lens fabrication causing surface tension-induced deformation"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal cycling stress exceeding 1000 cycles between -40°C and +85°C"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Graded CTE interlayer stack (SiO₂/SiNₓ) with thickness ratio 100:50 nm; low-stress polymer formulation with Young's modulus &lt;3 GPa"
  - node_2:
      trigger: "High-energy photon exposure at 365 nm wavelength with intensity &gt;50 mW/cm² for &gt;1000 hours"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "UV-blocking inorganic coating (HfO₂/SiO₂ multilayer) with 95% reflectance at 200-400 nm; benzotriazole-based photostabilizer additive at 0.5-1.0 wt% concentration"
bom_nodes:
  lens-body:
    type: "component"
    urn: "URN:CNFX:ME:LENS_BODY"
    interface_type: "physical-logic-coupled"
  planarization-layer:
    type: "component"
    urn: "URN:CNFX:ME:PLANARIZATION_LAYER"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 10110-5:2015 (OPTICS AND PHOTONICS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS - PART 5: SURFACE FORM TOLERANCES)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/OP 1.001-2009 (AMERICAN NATIONAL STANDARD FOR OPTICS AND OPTICAL INSTRUMENTS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS)"
    scope: "Verified Engineering Specification"
  - standard: "DIN 3140-7:2016 (DRAWING INDICATIONS FOR OPTICAL ELEMENTS AND SYSTEMS - PART 7: SURFACE FORM TOLERANCES)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/micro-lens-array.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "a968e9ee428c8e65d6565c3c5d04ec76ae96687097a3ed9001aa92fecd2d1183"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Micro-lens Array

## 1. Technical Definition
An array of microscopic lenses integrated onto the surface of an image sensor pixel array to focus incident light onto the photosensitive area of each pixel.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **1.0-100.0 mW/mm² incident light intensity, 400-700 nm wavelength, -40°C to +85°C operating temperature**. Failure boundary: **Lens sag deformation exceeding 50 nm RMS surface deviation, microlens-to-pixel misalignment &gt;0.5 μm, polymer lens material glass transition temperature (Tg) threshold at 120°C**, Mechanism: **Thermo-mechanical stress from coefficient of thermal expansion mismatch (CTE silicon: 2.6 ppm/°C vs. polymer lens: 60-80 ppm/°C) causing delamination; UV-induced photodegradation of polymer lens material at wavelengths &lt;400 nm; capillary forces during liquid lens fabrication causing surface tension-induced deformation**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal cycling stress exceeding 1000 cycles between -40°C and +85°C | 8 | Microlens array delamination from silicon substrate with adhesion strength reduction below 10 MPa | Graded CTE interlayer stack (SiO₂/SiNₓ) with thickness ratio 100:50 nm; low-stress polymer formulation with Young's modulus &lt;3 GPa |
| High-energy photon exposure at 365 nm wavelength with intensity &gt;50 mW/cm² for &gt;1000 hours | 8 | Polymer lens material refractive index change exceeding Δn &gt; 0.01, causing focal length shift &gt;5% | UV-blocking inorganic coating (HfO₂/SiO₂ multilayer) with 95% reflectance at 200-400 nm; benzotriazole-based photostabilizer additive at 0.5-1.0 wt% concentration |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | µm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Cleanroom Environment System**, **Wafer Inspection System**, **Photolithography Stepper**  
**Downstream Applications**: Smartphone Camera Modules, Medical Endoscope Imaging Systems, Automotive LiDAR Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications of micro-lens arrays in electronic manufacturing?
**A**: Micro-lens arrays are primarily used in image sensors for cameras, smartphones, and medical imaging devices to improve light sensitivity and image quality by directing more light onto each pixel's photosensitive area.

### Q: How do materials like silicon dioxide and photosensitive resin affect micro-lens array performance?
**A**: Silicon dioxide provides excellent optical clarity and durability, while photosensitive resins allow for precise, cost-effective patterning through photolithography, enabling high-resolution lens arrays with consistent optical properties.

### Q: What is the role of the planarization layer in micro-lens array construction?
**A**: The planarization layer creates a smooth, flat surface on the image sensor substrate before lens application, ensuring uniform lens alignment and optimal light focusing performance across the entire array.

## 6. Manufacturing Compliance
- ISO 10110-5:2015 (OPTICS AND PHOTONICS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS - PART 5: SURFACE FORM TOLERANCES)
- ANSI/OP 1.001-2009 (AMERICAN NATIONAL STANDARD FOR OPTICS AND OPTICAL INSTRUMENTS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS)
- DIN 3140-7:2016 (DRAWING INDICATIONS FOR OPTICAL ELEMENTS AND SYSTEMS - PART 7: SURFACE FORM TOLERANCES)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Micro-lens Array](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/micro-lens-array)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **2** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MICRO_LENS_ARRAY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 5302ffa4
