---
title: "Molded Package"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MOLDED_PACKAGE"
  data_integrity_hash: "ad9b630d94d584cc58b95ed1028e6dfa"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MOLDED_PACKAGE"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/molded-package.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/molded-package"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-150°C ambient temperature, 0-100% relative humidity (non-condensing), 0-2.5 MPa internal pressure"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Coefficient of thermal expansion (CTE) mismatch between epoxy molding compound (15-20 ppm/°C) and silicon die (2.6 ppm/°C) causing interfacial stress exceeding 50 MPa at 125°C, hydrolytic degradation of epoxy-silicon interface at &gt;85°C/85% RH"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Moisture ingress exceeding 0.3% weight absorption during storage"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Baking at 125°C for 24 hours prior to assembly, moisture barrier coating with 5μm parylene-C layer"
  - node_2:
      trigger: "Thermal cycling between -40°C and 125°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Underfill material with CTE of 25 ppm/°C and elastic modulus of 6 GPa, copper leadframe with 17 ppm/°C CTE"
bom_nodes:
  molded-body:
    type: "component"
    urn: "URN:CNFX:ME:MOLDED_BODY"
    interface_type: "physical-logic-coupled"
  lead-frame:
    type: "component"
    urn: "URN:CNFX:ME:LEAD_FRAME"
    interface_type: "physical-logic-coupled"
  optical-window:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_WINDOW"
    interface_type: "physical-logic-coupled"
  internal-cavity:
    type: "component"
    urn: "URN:CNFX:ME:INTERNAL_CAVITY"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
  - standard: "CE MARKING - EU DIRECTIVE 2001/95/EC ON GENERAL PRODUCT SAFETY"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/molded-package.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8cc0da2ff2d3f5f18962985cd42d092553bfd8d7720dcdbd20e93f7d66934ca8"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Molded Package

## 1. Technical Definition
A protective housing for photocoupler components formed through injection molding processes.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-150°C ambient temperature, 0-100% relative humidity (non-condensing), 0-2.5 MPa internal pressure**. Failure boundary: **Glass transition temperature (Tg) of 125°C for epoxy molding compound, 3.0 MPa internal pressure causing delamination, 0.5% moisture absorption by weight leading to popcorning**, Mechanism: **Coefficient of thermal expansion (CTE) mismatch between epoxy molding compound (15-20 ppm/°C) and silicon die (2.6 ppm/°C) causing interfacial stress exceeding 50 MPa at 125°C, hydrolytic degradation of epoxy-silicon interface at &gt;85°C/85% RH**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Moisture ingress exceeding 0.3% weight absorption during storage | 8 | Vapor pressure buildup during reflow at 260°C causing package cracking (popcorning) | Baking at 125°C for 24 hours prior to assembly, moisture barrier coating with 5μm parylene-C layer |
| Thermal cycling between -40°C and 125°C at 10 cycles/hour | 8 | Interfacial delamination at die-attach interface due to CTE mismatch stress accumulation | Underfill material with CTE of 25 ppm/°C and elastic modulus of 6 GPa, copper leadframe with 17 ppm/°C CTE |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Industrial Chiller**, **Hopper Dryer**, **Robotic Part Removal System**  
**Downstream Applications**: Photocoupler Modules, Optical Isolation Components, Electronic Control Boards  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in molded packages for photocouplers?
**A**: Common materials include epoxy resin for durability, silicone for flexibility and thermal stability, and polycarbonate for impact resistance and optical clarity in electronic applications.

### Q: How does the injection molding process benefit photocoupler packaging?
**A**: Injection molding ensures precise, repeatable production of molded bodies with integrated features like internal cavities and optical windows, providing consistent protection and alignment for sensitive photocoupler components.

### Q: What are the key components in a molded package BOM for photocouplers?
**A**: The bill of materials typically includes the molded body (housing), lead frame (for electrical connections), optical window (for light transmission), and internal cavity (to protect the photocoupler chip).

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS
- CE MARKING - EU DIRECTIVE 2001/95/EC ON GENERAL PRODUCT SAFETY

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Molded Package](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/molded-package)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MOLDED_PACKAGE | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 79f0c0ad
