---
title: "Mounting Frame/Housing"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MOUNTING_FRAMEHOUSING"
  data_integrity_hash: "c51bcc23b2c7b2f4c57fdbb3bd82b88e"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MOUNTING_FRAMEHOUSING"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-framehousing.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-framehousing"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-150°C ambient temperature, 0-15G vibration amplitude at 5-2000Hz, 0-98% relative humidity non-condensing"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 250
    unit: "MPa"
    consequence: "Thermal stress-induced fatigue from coefficient of thermal expansion mismatch (CTE=23×10⁻⁶/K for aluminum vs 3×10⁻⁶/K for ceramic), harmonic resonance amplification at natural frequency, galvanic corrosion at dissimilar metal interfaces"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal cycling between -40°C and 150°C at 10°C/min rate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement Invar alloy (CTE=1.2×10⁻⁶/K) mounting interface, add thermal expansion compensation slots"
  - node_2:
      trigger: "Vibration excitation at 1250Hz matching natural frequency"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply constrained layer damping treatment with 0.5mm viscoelastic polymer, redesign with ribbed structure to shift natural frequency to 1800Hz"
bom_nodes:
  mounting-plate:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_PLATE"
    interface_type: "physical-logic-coupled"
  side-walls:
    type: "component"
    urn: "URN:CNFX:ME:SIDE_WALLS"
    interface_type: "physical-logic-coupled"
  mounting-brackets:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BRACKETS"
    interface_type: "physical-logic-coupled"
  thermal-interface:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_INTERFACE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-framehousing.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "47e0c79e97ea424cbe421a21df5ae6885396fbaa7651e40de216c17a051b4db4"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Mounting Frame/Housing

## 1. Technical Definition
Structural component that provides mechanical support, protection, and alignment for infrared emitter elements within an array assembly.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-150°C ambient temperature, 0-15G vibration amplitude at 5-2000Hz, 0-98% relative humidity non-condensing**. Failure boundary: **Material yield strength exceeded at 250MPa stress, thermal expansion mismatch exceeding 0.5mm differential displacement, resonant frequency excitation at 1250±50Hz**, Mechanism: **Thermal stress-induced fatigue from coefficient of thermal expansion mismatch (CTE=23×10⁻⁶/K for aluminum vs 3×10⁻⁶/K for ceramic), harmonic resonance amplification at natural frequency, galvanic corrosion at dissimilar metal interfaces**.

### 2.1 Analytical Physics Model
Governed by the **Frame Structural Deflection Analysis**:

> **Primary Equation**: $\delta = \frac{5 q L^4}{384 E I}$  
> **Engineering Impact**: Ensures structural stability for multi-stage machines.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| q | Uniform Load | Engineering Constant |
| E | Elastic Modulus | Engineering Constant |
| I | Moment of Inertia | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal cycling between -40°C and 150°C at 10°C/min rate | 8 | Frame warpage exceeding 0.2mm flatness tolerance causing optical misalignment | Implement Invar alloy (CTE=1.2×10⁻⁶/K) mounting interface, add thermal expansion compensation slots |
| Vibration excitation at 1250Hz matching natural frequency | 8 | Resonant fatigue cracking at stress concentration points (notch factor Kt=3.2) | Apply constrained layer damping treatment with 0.5mm viscoelastic polymer, redesign with ribbed structure to shift natural frequency to 1800Hz |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **CNC Machining Center**, **Coordinate Measuring Machine**, **Industrial Ultrasonic Cleaner**  
**Downstream Applications**: Infrared Sensor Arrays, Thermal Imaging Modules, Gesture Recognition Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key benefits of using this mounting frame for infrared emitter arrays?
**A**: This mounting frame provides precise mechanical alignment for optimal emitter performance, efficient thermal dissipation to prevent overheating, and robust protection against environmental factors in electronic assemblies.

### Q: Which material option is best for high-temperature applications?
**A**: Stainless steel offers the best high-temperature performance and corrosion resistance, while aluminum alloy provides excellent thermal conductivity at lower weight. Thermally conductive plastics are ideal for weight-sensitive applications with moderate thermal loads.

### Q: How does this housing ensure proper alignment of infrared emitters?
**A**: The frame features precision-machined mounting plates and brackets with tight tolerances (±0.1mm typical) that maintain exact emitter positioning, critical for consistent infrared array performance in optical and electronic systems.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Mounting Frame/Housing](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-framehousing)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MOUNTING_FRAMEHOUSING | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 59b8d378
