---
title: "Mounting Housing"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MOUNTING_HOUSING"
  data_integrity_hash: "0e2085da6e874de9b47a5238aa567dbe"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MOUNTING_HOUSING"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-housing.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-housing"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "Temperature: -40°C to +85°C, Thermal resistance: 0.5-2.0 K/W, Mechanical load: 0-50 N"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 2.5
    unit: "K"
    consequence: "Coefficient of thermal expansion mismatch between housing material (aluminum alloy 6061-T6, CTE 23.6 μm/m·K) and laser diode (gallium arsenide, CTE 5.7 μm/m·K) causes interfacial delamination at ΔT &gt; 60°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Thermal cycling with ΔT &gt; 60°C at 100 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement compliant thermal interface material with CTE gradient (e.g., silver-filled epoxy with 15-25 μm/m·K CTE)"
  - node_2:
      trigger: "Vibration exposure at 20-2000 Hz with 5 g RMS acceleration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply thread-locking compound (e.g., Loctite 243) with 10 N·m torque specification and implement anti-vibration mounting design"
bom_nodes:
  mounting-base-plate:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_BASE_PLATE"
    interface_type: "physical-logic-coupled"
  alignment-pins:
    type: "component"
    urn: "URN:CNFX:ME:ALIGNMENT_PINS"
    interface_type: "physical-logic-coupled"
  thermal-interface-layer:
    type: "component"
    urn: "URN:CNFX:ME:THERMAL_INTERFACE_LAYER"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 286-2:2010 (GEOMETRICAL PRODUCT SPECIFICATIONS (GPS) - ISO CODE SYSTEM FOR TOLERANCES ON LINEAR SIZES)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI B4.1-1967 (R2018) (PREFERRED LIMITS AND FITS FOR CYLINDRICAL PARTS)"
    scope: "Verified Engineering Specification"
  - standard: "DIN 7184-1:2016 (MOUNTING HOUSINGS FOR ROLLING BEARINGS - PART 1: TOLERANCES)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-housing.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "5e5889fede749d9f3975ead83e1fecbec608979ad066f528b2f38e8d5ab723a0"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Mounting Housing

## 1. Technical Definition
A structural component that provides mechanical support, alignment, and thermal management for laser diodes within an assembly.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **Temperature: -40°C to +85°C, Thermal resistance: 0.5-2.0 K/W, Mechanical load: 0-50 N**. Failure boundary: **Thermal resistance exceeds 2.5 K/W, Temperature exceeds 100°C, Mechanical stress exceeds 75 N**, Mechanism: **Coefficient of thermal expansion mismatch between housing material (aluminum alloy 6061-T6, CTE 23.6 μm/m·K) and laser diode (gallium arsenide, CTE 5.7 μm/m·K) causes interfacial delamination at ΔT &gt; 60°C**.

### 2.1 Analytical Physics Model
Governed by the **Frame Structural Deflection Analysis**:

> **Primary Equation**: $\delta = \frac{5 q L^4}{384 E I}$  
> **Engineering Impact**: Ensures structural stability for multi-stage machines.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| q | Uniform Load | Engineering Constant |
| E | Elastic Modulus | Engineering Constant |
| I | Moment of Inertia | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Thermal cycling with ΔT &gt; 60°C at 100 cycles/hour | 8 | Interfacial delamination between housing and laser diode | Implement compliant thermal interface material with CTE gradient (e.g., silver-filled epoxy with 15-25 μm/m·K CTE) |
| Vibration exposure at 20-2000 Hz with 5 g RMS acceleration | 8 | Resonant frequency excitation causing mounting screw loosening | Apply thread-locking compound (e.g., Loctite 243) with 10 N·m torque specification and implement anti-vibration mounting design |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **CNC Machining Center**, **Laser Welding System**, **Coordinate Measuring Machine**  
**Downstream Applications**: Fiber Optic Transceivers, Laser Cutting Systems, Medical Laser Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are best for thermal management in mounting housings?
**A**: Copper alloy offers superior thermal conductivity for heat dissipation, while aluminum alloy provides a lightweight alternative with good thermal performance. Ceramic options are available for electrical insulation in sensitive applications.

### Q: How does the mounting housing ensure proper laser diode alignment?
**A**: Precision alignment pins and machined mounting surfaces maintain exact positioning of laser diodes within ±0.01mm tolerance, ensuring optimal optical performance and beam alignment in the assembly.

### Q: What thermal interface options are available for these housings?
**A**: Thermal interface layers include thermal pads, conductive adhesives, or phase-change materials that fill microscopic gaps between components, maximizing heat transfer from the diode to the housing.

## 6. Manufacturing Compliance
- ISO 286-2:2010 (GEOMETRICAL PRODUCT SPECIFICATIONS (GPS) - ISO CODE SYSTEM FOR TOLERANCES ON LINEAR SIZES)
- ANSI B4.1-1967 (R2018) (PREFERRED LIMITS AND FITS FOR CYLINDRICAL PARTS)
- DIN 7184-1:2016 (MOUNTING HOUSINGS FOR ROLLING BEARINGS - PART 1: TOLERANCES)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Mounting Housing](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-housing)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MOUNTING_HOUSING | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 633b0721
