---
title: "Mounting Plate/PCB"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:MOUNTING_PLATEPCB"
  data_integrity_hash: "4c5a16334c19797499166b0868be81e5"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:MOUNTING_PLATEPCB"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-platepcb.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-platepcb"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-150°C, 0-100% relative humidity, 0-50g vibration (5-2000Hz), 0-500N compressive load"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 180
    unit: "°C"
    consequence: "Coefficient of thermal expansion mismatch (FR4: 14-18 ppm/°C vs aluminum: 23 ppm/°C) causing interfacial delamination, electrochemical migration at &gt;85% RH with &gt;5V bias, fatigue crack propagation at &gt;10^7 cycles under &gt;200MPa alternating stress"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrochemical migration due to ionic contamination (Na+, K+, Cl- &gt;10μg/cm²) with &gt;85% RH"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Conformal coating application (25-75μm parylene-C) with ionic purity &lt;1μg/cm² and hermetic sealing (IP67 rating)"
  - node_2:
      trigger: "Thermal cycling (-40°C to +125°C, ΔT=165°C) at &gt;1000 cycles"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "CTE-matched material pairing (AlSiC: 6.5 ppm/°C with ceramic PCB: 7.2 ppm/°C) and epoxy underfill with Tg&gt;150°C"
bom_nodes:
  base-plate:
    type: "component"
    urn: "URN:CNFX:ME:BASE_PLATE"
    interface_type: "physical-logic-coupled"
  pcb-layer-if-applicable:
    type: "component"
    urn: "URN:CNFX:ME:PCB_LAYER_IF_APPLICABLE"
    interface_type: "physical-logic-coupled"
  mounting-holesinserts:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_HOLESINSERTS"
    interface_type: "physical-logic-coupled"
  alignment-pinsguides:
    type: "component"
    urn: "URN:CNFX:ME:ALIGNMENT_PINSGUIDES"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-platepcb.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "d9021d73ce0466e1ef6119310efce6f45978208e5e0b561faa45b5c822b38538"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Mounting Plate/PCB

## 1. Technical Definition
A structural and electrical interface component that provides mechanical support and electrical connectivity for test probes within a test probe assembly.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-150°C, 0-100% relative humidity, 0-50g vibration (5-2000Hz), 0-500N compressive load**. Failure boundary: **Thermal expansion mismatch exceeding 15μm differential displacement at 180°C, dielectric breakdown at &gt;500V/mm, plastic deformation at &gt;600MPa stress**, Mechanism: **Coefficient of thermal expansion mismatch (FR4: 14-18 ppm/°C vs aluminum: 23 ppm/°C) causing interfacial delamination, electrochemical migration at &gt;85% RH with &gt;5V bias, fatigue crack propagation at &gt;10^7 cycles under &gt;200MPa alternating stress**.

### 2.1 Analytical Physics Model
Governed by the **Frame Structural Deflection Analysis**:

> **Primary Equation**: $\delta = \frac{5 q L^4}{384 E I}$  
> **Engineering Impact**: Ensures structural stability for multi-stage machines.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| q | Uniform Load | Engineering Constant |
| E | Elastic Modulus | Engineering Constant |
| I | Moment of Inertia | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrochemical migration due to ionic contamination (Na+, K+, Cl- &gt;10μg/cm²) with &gt;85% RH | 8 | Short circuit between adjacent probe contact pads (resistance &lt;1Ω) | Conformal coating application (25-75μm parylene-C) with ionic purity &lt;1μg/cm² and hermetic sealing (IP67 rating) |
| Thermal cycling (-40°C to +125°C, ΔT=165°C) at &gt;1000 cycles | 8 | Interfacial delamination (bond strength &lt;5MPa) between PCB and mounting plate | CTE-matched material pairing (AlSiC: 6.5 ppm/°C with ceramic PCB: 7.2 ppm/°C) and epoxy underfill with Tg&gt;150°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Semiconductor Test Handlers, Printed Circuit Board Test Fixtures, Electronic Component Test Systems  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary functions of this mounting plate/PCB in test probe assemblies?
**A**: This component serves dual functions: providing mechanical stability and alignment for test probes through its base plate and guides, while also enabling electrical connectivity via its PCB layer when applicable, ensuring precise contact in electronic testing applications.

### Q: Why are FR-4, aluminum alloy, and stainless steel used in this mounting plate?
**A**: FR-4 epoxy laminate offers excellent electrical insulation and flame resistance for the PCB layer, aluminum alloy provides lightweight structural support, and stainless steel components (like inserts) ensure durability and corrosion resistance in industrial environments.

### Q: How does the BOM structure support test probe assembly requirements?
**A**: The BOM includes alignment pins/guides for probe positioning accuracy, a base plate for structural integrity, mounting holes/inserts for secure installation, and an optional PCB layer for electrical routing - all working together to create a reliable interface for testing electronic components.

## 6. Manufacturing Compliance
- ISO 9001:2015 - QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Mounting Plate/PCB](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/mounting-platepcb)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: MOUNTING_PLATEPCB | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: c273e1ac
