---
title: "Network Interface Card (NIC)"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:NETWORK_INTERFACE_CARD_NIC"
  data_integrity_hash: "ad93ab518e8560e85778f1d629975776"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:NETWORK_INTERFACE_CARD_NIC"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card-nic.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card-nic"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-85°C ambient temperature, 0-95% relative humidity non-condensing, 3.3V ±5% supply voltage"
    unit: "Gbps"
engineering_limits:
  max_safe_operating_point:
    value: 125
    unit: "°C"
    consequence: "Electromigration in copper traces at current densities &gt;10^6 A/cm², thermal expansion mismatch between silicon die (2.6 ppm/°C) and FR4 substrate (16 ppm/°C), dielectric polarization loss at frequencies &gt;1 GHz"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 8kV human body model"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "TVS diodes with &lt;1ns response time and IEC 61000-4-2 Level 4 compliance"
  - node_2:
      trigger: "Sustained data transfer at 10 Gbps with 70% link utilization"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper heat spreader with 5 W/m·K thermal conductivity and forced air cooling at 2 m/s velocity"
bom_nodes:
  pcb-printed-circuit-board:
    type: "component"
    urn: "URN:CNFX:ME:PCB_PRINTED_CIRCUIT_BOARD"
    interface_type: "physical-logic-coupled"
  controller-chip:
    type: "component"
    urn: "URN:CNFX:ME:CONTROLLER_CHIP"
    interface_type: "physical-logic-coupled"
  phy-physical-layer-chip:
    type: "part"
    urn: "URN:CNFX:ME:PHY_PHYSICAL_LAYER_CHIP"
    interface_type: "physical-logic-coupled"
  connector-e-g-rj45-port:
    type: "component"
    urn: "URN:CNFX:ME:CONNECTOR_E_G_RJ45_PORT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "CE MARKING: COMPLIANCE WITH EU EMC DIRECTIVE 2014/30/EU AND LOW VOLTAGE DIRECTIVE 2014/35/EU"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card-nic.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "8b20f7ad5101718184a97dcc1818a38927b6a74d038a0d6723f539e53dd862a0"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Network Interface Card (NIC)

## 1. Technical Definition
A hardware component that enables a database server to connect to a network and communicate with other devices.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-85°C ambient temperature, 0-95% relative humidity non-condensing, 3.3V ±5% supply voltage**. Failure boundary: **Semiconductor junction temperature exceeding 125°C, dielectric breakdown at &gt;500V differential voltage, signal integrity loss at &gt;-40dB crosstalk**, Mechanism: **Electromigration in copper traces at current densities &gt;10^6 A/cm², thermal expansion mismatch between silicon die (2.6 ppm/°C) and FR4 substrate (16 ppm/°C), dielectric polarization loss at frequencies &gt;1 GHz**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 8kV human body model | 8 | Gate oxide breakdown in PHY transceiver IC | TVS diodes with &lt;1ns response time and IEC 61000-4-2 Level 4 compliance |
| Sustained data transfer at 10 Gbps with 70% link utilization | 8 | Thermal throttling reducing throughput to 1 Gbps | Copper heat spreader with 5 W/m·K thermal conductivity and forced air cooling at 2 m/s velocity |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | Gbps | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [PHY (Physical Layer) Chip](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/phy-physical-layer-chip.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Network Switch**, **Server Rack**, **Power Distribution Unit**  
**Downstream Applications**: Database Server, Cloud Computing Infrastructure, Enterprise Network System  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What makes this NIC suitable for database server applications?
**A**: This NIC features a dedicated controller chip optimized for high-throughput data transfer, low-latency communication, and reliable connectivity essential for database server operations in industrial environments.

### Q: How does the fiberglass PCB substrate enhance performance?
**A**: The fiberglass PCB provides superior thermal stability, electrical insulation, and mechanical durability, ensuring consistent signal integrity and long-term reliability in demanding manufacturing settings.

### Q: What network standards does this NIC support?
**A**: This NIC supports industry-standard protocols including Gigabit Ethernet (1000BASE-T), with compatibility for various network configurations commonly used in computer and optical product manufacturing facilities.

## 6. Manufacturing Compliance
- CE MARKING: COMPLIANCE WITH EU EMC DIRECTIVE 2014/30/EU AND LOW VOLTAGE DIRECTIVE 2014/35/EU

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Network Interface Card (NIC)](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card-nic)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: NETWORK_INTERFACE_CARD_NIC | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: dc6e32c4
