---
title: "Network Interface Card"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:NETWORK_INTERFACE_CARD"
  data_integrity_hash: "befb310f9e1db7b330fe757b8351adad"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:NETWORK_INTERFACE_CARD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0-70°C ambient temperature, 0-95% relative humidity (non-condensing), 4.75-5.25V DC power input"
    unit: "Gbps"
engineering_limits:
  max_safe_operating_point:
    value: 85
    unit: "°C"
    consequence: "Electromigration in copper traces at current densities exceeding 10^6 A/cm², dielectric breakdown at electric fields &gt;10 MV/m in SiO₂ insulation, thermal expansion mismatch between silicon (2.6 ppm/°C) and FR-4 substrate (14 ppm/°C)"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 1000V HBM (Human Body Model)"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 5ns response time, chassis grounding at &lt;1Ω resistance"
  - node_2:
      trigger: "Sustained current draw exceeding 1.5A through 24AWG copper traces"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Current limiting circuitry with 100ms response, 2oz copper plating (70μm thickness) on PCB"
bom_nodes:
  controller-chip:
    type: "part"
    urn: "URN:CNFX:ME:CONTROLLER_CHIP"
    interface_type: "physical-logic-coupled"
  phy-physical-layer-transceiver:
    type: "part"
    urn: "URN:CNFX:ME:PHY_PHYSICAL_LAYER_TRANSCEIVER"
    interface_type: "physical-logic-coupled"
  boot-rom-socket:
    type: "component"
    urn: "URN:CNFX:ME:BOOT_ROM_SOCKET"
    interface_type: "physical-logic-coupled"
  led-indicators:
    type: "component"
    urn: "URN:CNFX:ME:LED_INDICATORS"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "CE MARKING (EU DIRECTIVE 2014/35/EU) FOR LOW VOLTAGE EQUIPMENT"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "c8a220d7a09ddbdefd429e4bf36b399e95db797325b04ccb31dc1bacf809b163"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Network Interface Card

## 1. Technical Definition
A hardware component that enables a computer to connect to a network and communicate with other devices.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0-70°C ambient temperature, 0-95% relative humidity (non-condensing), 4.75-5.25V DC power input**. Failure boundary: **85°C junction temperature for silicon components, 1000V electrostatic discharge threshold, 150°C solder reflow temperature limit**, Mechanism: **Electromigration in copper traces at current densities exceeding 10^6 A/cm², dielectric breakdown at electric fields &gt;10 MV/m in SiO₂ insulation, thermal expansion mismatch between silicon (2.6 ppm/°C) and FR-4 substrate (14 ppm/°C)**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 1000V HBM (Human Body Model) | 8 | Gate oxide breakdown in PHY transceiver IC, creating permanent short circuit | Integrated ESD protection diodes with 5ns response time, chassis grounding at &lt;1Ω resistance |
| Sustained current draw exceeding 1.5A through 24AWG copper traces | 8 | Copper trace delamination from FR-4 substrate due to 150°C localized heating | Current limiting circuitry with 100ms response, 2oz copper plating (70μm thickness) on PCB |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | Gbps | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Controller Chip](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/controller-chip.md) `(Standalone System)`
- [PHY (Physical Layer) Transceiver](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/phy-physical-layer-transceiver.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Automated Test Equipment (ATE)**, **Pick-and-Place Machine**, **Reflow Soldering Oven**  
**Downstream Applications**: Desktop Computers, Server Racks, Network Switches  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of a Network Interface Card?
**A**: A Network Interface Card (NIC) enables a computer to connect to a network, facilitating communication with other devices by converting data into signals suitable for network transmission.

### Q: What materials are commonly used in manufacturing Network Interface Cards?
**A**: Network Interface Cards are typically constructed using Printed Circuit Boards (PCBs), Integrated Circuits (ICs/chips) like controller chips and PHY transceivers, and connectors such as RJ-45 for Ethernet connections.

### Q: What are the key components in a Network Interface Card's Bill of Materials?
**A**: Essential components include a controller chip for data processing, a PHY transceiver for signal conversion, a boot ROM socket for firmware storage, and LED indicators for network status monitoring.

## 6. Manufacturing Compliance
- CE MARKING (EU DIRECTIVE 2014/35/EU) FOR LOW VOLTAGE EQUIPMENT

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Network Interface Card](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/network-interface-card)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: NETWORK_INTERFACE_CARD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2c9e90b7
