---
title: "Optical Sensor"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:OPTICAL_SENSOR"
  data_integrity_hash: "317ef8c458b939f16b09d254328f94b8"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:OPTICAL_SENSOR"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/optical-sensor.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/optical-sensor"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "400-700 nm wavelength, 0-100 klux illuminance, -40°C to +85°C temperature"
    unit: "nm"
engineering_limits:
  max_safe_operating_point:
    value: 5
    unit: "V"
    consequence: "Avalanche breakdown in PN junction under reverse bias exceeding 5 V, carrier recombination saturation at photon flux &gt;10^18 photons/cm²·s, thermal generation of electron-hole pairs exceeding photocurrent at &gt;125°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 15 kV HBM"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrated ESD protection diodes with 0.5 Ω series resistance and 8 kV clamping voltage"
  - node_2:
      trigger: "Condensation forming on optical window at 85% RH with 10°C temperature differential"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Hermetic sealing with 1.0×10^-6 mbar·L/s leak rate and desiccant maintaining &lt;10% internal RH"
bom_nodes:
  photosensitive-element:
    type: "component"
    urn: "URN:CNFX:ME:PHOTOSENSITIVE_ELEMENT"
    interface_type: "physical-logic-coupled"
  optical-lens:
    type: "component"
    urn: "URN:CNFX:ME:OPTICAL_LENS"
    interface_type: "physical-logic-coupled"
  signal-conditioning-circuit:
    type: "device"
    urn: "URN:CNFX:ME:SIGNAL_CONDITIONING_CIRCUIT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 10110-7:2017 (OPTICS AND PHOTONICS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS - SURFACE IMPERFECTION TOLERANCES)"
    scope: "Verified Engineering Specification"
  - standard: "ANSI/ASME B46.1-2019 (SURFACE TEXTURE, SURFACE ROUGHNESS, WAVINESS, AND LAY)"
    scope: "Verified Engineering Specification"
  - standard: "DIN 58196-1:2018 (OPTICAL COMPONENTS - QUALITY CRITERIA AND TESTING METHODS - PART 1: GENERAL)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/optical-sensor.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "6a59c379a9b0c677501832e196d5bf31b0fdd6f8b86fdaab8a1d3f0800d58f85"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Optical Sensor

## 1. Technical Definition
A device that detects light or other electromagnetic radiation and converts it into an electrical signal.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **400-700 nm wavelength, 0-100 klux illuminance, -40°C to +85°C temperature**. Failure boundary: **Photodiode junction breakdown at 5 V reverse bias, 125°C semiconductor thermal limit, 200 klux sensor saturation threshold**, Mechanism: **Avalanche breakdown in PN junction under reverse bias exceeding 5 V, carrier recombination saturation at photon flux &gt;10^18 photons/cm²·s, thermal generation of electron-hole pairs exceeding photocurrent at &gt;125°C**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 15 kV HBM | 8 | Gate oxide rupture in CMOS photodiode readout circuit | Integrated ESD protection diodes with 0.5 Ω series resistance and 8 kV clamping voltage |
| Condensation forming on optical window at 85% RH with 10°C temperature differential | 8 | Light scattering and absorption reducing signal-to-noise ratio below 20 dB | Hermetic sealing with 1.0×10^-6 mbar·L/s leak rate and desiccant maintaining &lt;10% internal RH |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | nm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Signal Conditioning Circuit](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/signal-conditioning-circuit.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Cleanroom Assembly Station**, **Precision Calibration Equipment**, **Automated Test Handler**  
**Downstream Applications**: Smartphone Cameras, Automotive LiDAR Systems, Medical Imaging Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the primary applications of this optical sensor in manufacturing?
**A**: This optical sensor is used in computer, electronic, and optical product manufacturing for applications like position detection, quality control, light measurement, and automated inspection systems.

### Q: How does the semiconductor material affect sensor performance?
**A**: The semiconductor material (Silicon or GaAs) determines the sensor's spectral response range, sensitivity, and speed. Silicon is common for visible light, while GaAs extends into infrared for specialized applications.

### Q: What maintenance is required for optical sensors with quartz lenses?
**A**: Quartz lenses require periodic cleaning to maintain optical clarity and prevent signal degradation. The plastic housing protects internal components, but lens surfaces should be kept free of dust and contaminants.

## 6. Manufacturing Compliance
- ISO 10110-7:2017 (OPTICS AND PHOTONICS - PREPARATION OF DRAWINGS FOR OPTICAL ELEMENTS AND SYSTEMS - SURFACE IMPERFECTION TOLERANCES)
- ANSI/ASME B46.1-2019 (SURFACE TEXTURE, SURFACE ROUGHNESS, WAVINESS, AND LAY)
- DIN 58196-1:2018 (OPTICAL COMPONENTS - QUALITY CRITERIA AND TESTING METHODS - PART 1: GENERAL)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Optical Sensor](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/optical-sensor)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: OPTICAL_SENSOR | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 2e9101c6
