---
title: "Photodetector"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:PHOTODETECTOR"
  data_integrity_hash: "f3739ae3e10e86bd4ee86be56d08cb8a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PHOTODETECTOR"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/photodetector.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/photodetector"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "400-1100 nm wavelength, 1 nW-10 mW optical power, -40°C to 85°C ambient temperature"
    unit: "nm"
engineering_limits:
  max_safe_operating_point:
    value: 15
    unit: "mW"
    consequence: "Avalanche breakdown at reverse bias &gt; 200 V in APDs, photodiode junction heating beyond 150°C causing permanent lattice damage, surface recombination velocity exceeding 10^4 cm/s at silicon-silicon dioxide interface"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electrostatic discharge exceeding 500 V during handling"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Shunt diode protection with 5.6 V Zener rating, antistatic packaging with surface resistivity &lt; 10^11 Ω/sq"
  - node_2:
      trigger: "Continuous optical overload at 20 mW for 100 ms duration"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Integrating optical limiter with 10 mW threshold, copper heat sink with 2.5 K/W thermal resistance"
bom_nodes:
  photosensitive-element:
    type: "component"
    urn: "URN:CNFX:ME:PHOTOSENSITIVE_ELEMENT"
    interface_type: "physical-logic-coupled"
  electrodes:
    type: "component"
    urn: "URN:CNFX:ME:ELECTRODES"
    interface_type: "physical-logic-coupled"
  packagingwindow:
    type: "component"
    urn: "URN:CNFX:ME:PACKAGINGWINDOW"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9022-3:2015 (ENVIRONMENTAL TEST METHODS FOR OPTICAL COMPONENTS)"
    scope: "Verified Engineering Specification"
  - standard: "DIN 58141-6:2016-12 (FIBER OPTIC COMPONENTS - PART 6: PHOTODETECTORS)"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/photodetector.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "5ad67177fa3a65fa84f29eb88ab80453c7d48fd4bf66d3d3559565ff783a87e3"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Photodetector

## 1. Technical Definition
A device that converts light signals into electrical signals for detection and measurement.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **400-1100 nm wavelength, 1 nW-10 mW optical power, -40°C to 85°C ambient temperature**. Failure boundary: **Saturation at 15 mW optical power causing thermal damage, dark current exceeding 100 nA at 25°C, quantum efficiency dropping below 10% at 300 nm wavelength**, Mechanism: **Avalanche breakdown at reverse bias &gt; 200 V in APDs, photodiode junction heating beyond 150°C causing permanent lattice damage, surface recombination velocity exceeding 10^4 cm/s at silicon-silicon dioxide interface**.

### 2.1 Analytical Physics Model
Governed by the **Rayleigh Resolution Criterion**:

> **Primary Equation**: $d = \frac{0.61 \lambda}{NA}$  
> **Engineering Impact**: Defines the theoretical limit of machine vision systems.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| \lambda | Wavelength | Engineering Constant |
| NA | Numerical Aperture | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electrostatic discharge exceeding 500 V during handling | 8 | Gate oxide breakdown in phototransistor, creating permanent short circuit | Shunt diode protection with 5.6 V Zener rating, antistatic packaging with surface resistivity &lt; 10^11 Ω/sq |
| Continuous optical overload at 20 mW for 100 ms duration | 8 | Thermal runaway in PIN photodiode, increasing dark current by 3 orders of magnitude | Integrating optical limiter with 10 mW threshold, copper heat sink with 2.5 K/W thermal resistance |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | nm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Optical Alignment System**, **Signal Amplifier**, **Temperature Control Unit**  
**Downstream Applications**: Fiber Optic Communication Systems, Medical Imaging Devices, Industrial Automation Sensors  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What are the key materials used in photodetectors for industrial applications?
**A**: Industrial photodetectors primarily use semiconductor materials like Silicon, Germanium, and InGaAs (Indium Gallium Arsenide), chosen for their specific wavelength sensitivity and efficiency in converting light to electrical signals.

### Q: How does a photodetector function in computer and optical product manufacturing?
**A**: In manufacturing, photodetectors detect and measure light signals, enabling quality control, automation, and precise sensing in processes such as optical alignment, laser measurement, and electronic component testing.

### Q: What components are essential in a photodetector's bill of materials (BOM)?
**A**: The essential BOM components include a photosensitive element (semiconductor material), electrodes for electrical connection, and packaging/window to protect the element while allowing light transmission.

## 6. Manufacturing Compliance
- ISO 9022-3:2015 (ENVIRONMENTAL TEST METHODS FOR OPTICAL COMPONENTS)
- DIN 58141-6:2016-12 (FIBER OPTIC COMPONENTS - PART 6: PHOTODETECTORS)

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Photodetector](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/photodetector)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **3** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PHOTODETECTOR | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 646c713c
