---
title: "Pickup Head"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:PICKUP_HEAD"
  data_integrity_hash: "e42765be81a62d835de8f65df0091389"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PICKUP_HEAD"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pickup-head.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/pickup-head"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.5-2.0 N pickup force, 0.1-0.5 mm vertical travel, 0.01-0.05 mm lateral positioning accuracy"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 2.5
    unit: "N"
    consequence: "Die fracture occurs when tensile stress exceeds silicon's fracture toughness of 0.7-1.1 MPa·m^0.5; die drop results from insufficient vacuum adhesion force overcoming surface tension; misalignment stems from servo motor backlash exceeding 5 μm or thermal expansion mismatch between ceramic tip and steel shaft at ΔT&gt;15°C"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Vacuum line contamination with particles &gt;5 μm diameter"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Install 3 μm absolute filter with differential pressure sensor triggering maintenance at 10 kPa drop"
  - node_2:
      trigger: "Ceramic tip thermal expansion mismatch with die material at ΔT&gt;20°C"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement active tip temperature control maintaining 25±1°C via Peltier element with PID regulation"
bom_nodes:
  nozzle-tip:
    type: "component"
    urn: "URN:CNFX:ME:NOZZLE_TIP"
    interface_type: "physical-logic-coupled"
  vacuum-chamber:
    type: "device"
    urn: "URN:CNFX:ME:VACUUM_CHAMBER"
    interface_type: "physical-logic-coupled"
  mounting-flange:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_FLANGE"
    interface_type: "physical-logic-coupled"
  vacuum-valve:
    type: "part"
    urn: "URN:CNFX:ME:VACUUM_VALVE"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
  - standard: "ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS"
    scope: "Verified Engineering Specification"
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pickup-head.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "bd4c4a9d2b845b6abc5ae736d3ebf1dee658b5e4a139af876520e9a8210fa2d7"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Pickup Head

## 1. Technical Definition
A precision component in automated die attach machines that picks up semiconductor dies from wafer tape and places them onto substrates.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.5-2.0 N pickup force, 0.1-0.5 mm vertical travel, 0.01-0.05 mm lateral positioning accuracy**. Failure boundary: **Pickup force exceeds 2.5 N causing die fracture, or drops below 0.3 N causing die drop; positioning error exceeds 0.1 mm causing misalignment; vacuum pressure drops below 40 kPa causing loss of grip**, Mechanism: **Die fracture occurs when tensile stress exceeds silicon's fracture toughness of 0.7-1.1 MPa·m^0.5; die drop results from insufficient vacuum adhesion force overcoming surface tension; misalignment stems from servo motor backlash exceeding 5 μm or thermal expansion mismatch between ceramic tip and steel shaft at ΔT&gt;15°C**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Vacuum line contamination with particles &gt;5 μm diameter | 8 | Partial vacuum blockage reducing pickup force below 0.3 N | Install 3 μm absolute filter with differential pressure sensor triggering maintenance at 10 kPa drop |
| Ceramic tip thermal expansion mismatch with die material at ΔT&gt;20°C | 8 | Die cracking during placement due to differential CTE (7 ppm/°C vs 2.6 ppm/°C) | Implement active tip temperature control maintaining 25±1°C via Peltier element with PID regulation |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [Vacuum Chamber](https://cnfx.com/llms/industry/basic-metal-manufacturing/product/vacuum-chamber.md) `(Standalone System)`
- [Vacuum Valve](https://cnfx.com/llms/industry/machinery-and-equipment-manufacturing/product/vacuum-valve.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Wafer Frame Expander**, **Die Ejector System**, **Vision Alignment System**  
**Downstream Applications**: Microprocessors, Memory Chips, LED Packages  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in the pickup head construction?
**A**: Our pickup heads are constructed from tungsten carbide for durability, stainless steel for structural integrity, and ceramic components for thermal stability and precision.

### Q: How does the pickup head handle different semiconductor die sizes?
**A**: The pickup head features interchangeable nozzle tips and adjustable vacuum settings to accommodate various die sizes from micro to standard semiconductor components.

### Q: What maintenance is required for the pickup head?
**A**: Regular cleaning of the vacuum chamber and nozzle tip, inspection of the vacuum valve seals, and periodic calibration of the mounting flange alignment are recommended for optimal performance.

## 6. Manufacturing Compliance
- ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS

---
### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Pickup Head](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/pickup-head)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PICKUP_HEAD | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 3e389e5b
