---
title: "Power Delivery Circuitry"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:POWER_DELIVERY_CIRCUITRY"
  data_integrity_hash: "f3d03b9afbff30cafb9a66bd72cf1e3a"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:POWER_DELIVERY_CIRCUITRY"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-delivery-circuitry.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/power-delivery-circuitry"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "0.8-1.2 V DC at 100-300 A with ±3% voltage ripple tolerance"
    unit: "W"
engineering_limits:
  max_safe_operating_point:
    value: 1.0
    unit: "V"
    consequence: "Electromigration in copper interconnects at current densities &gt;1×10⁶ A/cm², causing joule heating exceeding 125°C and subsequent dielectric breakdown at electric field strengths &gt;10 MV/m"
fmea_matrix_quantitative:
  - node_1:
      trigger: "MOSFET gate oxide breakdown at electric field strength &gt;15 MV/cm"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Silicon carbide MOSFET implementation with 25 MV/cm breakdown strength and integrated current-limiting at 320 A"
  - node_2:
      trigger: "Thermal cycling between 25°C and 105°C at 10 cycles/hour"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Copper pillar bump interconnects with 0.2 mm pitch and underfill material having CTE of 8 ppm/°C"
bom_nodes:
  pwm-controller:
    type: "part"
    urn: "URN:CNFX:ME:PWM_CONTROLLER"
    interface_type: "physical-logic-coupled"
  power-mosfets-high-side-low-side:
    type: "component"
    urn: "URN:CNFX:ME:POWER_MOSFETS_HIGH_SIDE_LOW_SIDE"
    interface_type: "physical-logic-coupled"
  inductor-choke:
    type: "component"
    urn: "URN:CNFX:ME:INDUCTOR_CHOKE"
    interface_type: "physical-logic-coupled"
  capacitors-input-output:
    type: "component"
    urn: "URN:CNFX:ME:CAPACITORS_INPUT_OUTPUT"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/power-delivery-circuitry.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "83ea4411dd395446cecfdebdb17e571da93d65964f52c650ed8e4ec8569bd2e3"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Power Delivery Circuitry

## 1. Technical Definition
Electronic circuitry within a GPU responsible for regulating and delivering stable power to various components.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **0.8-1.2 V DC at 100-300 A with ±3% voltage ripple tolerance**. Failure boundary: **Voltage deviation beyond ±10% of nominal 1.0 V for &gt;10 ms, or current exceeding 350 A for &gt;1 ms**, Mechanism: **Electromigration in copper interconnects at current densities &gt;1×10⁶ A/cm², causing joule heating exceeding 125°C and subsequent dielectric breakdown at electric field strengths &gt;10 MV/m**.

### 2.1 Analytical Physics Model
Governed by the **Joule Heating & Thermal Resistance**:

> **Primary Equation**: $P = I^2 R = \frac{V^2}{R}$  
> **Engineering Impact**: Governs heating element sizing for shrink tunnels/sealers.

| Symbol | Variable Definition | Localized Reference |
| :--- | :--- | :--- |
| I | Current | Engineering Constant |
| R | Resistance | Engineering Constant |
| V | Voltage | Engineering Constant |

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| MOSFET gate oxide breakdown at electric field strength &gt;15 MV/cm | 8 | Phase regulator short-circuit causing current surge to 400 A | Silicon carbide MOSFET implementation with 25 MV/cm breakdown strength and integrated current-limiting at 320 A |
| Thermal cycling between 25°C and 105°C at 10 cycles/hour | 8 | Solder joint fatigue cracking with resistance increase from 0.5 mΩ to 50 mΩ | Copper pillar bump interconnects with 0.2 mm pitch and underfill material having CTE of 8 ppm/°C |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | W | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)
- [PWM Controller](https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/pwm-controller.md) `(Standalone System)`

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Pick-and-Place Machine**, **Reflow Soldering Oven**, **Automated Optical Inspection System**  
**Downstream Applications**: Graphics Processing Units, High-Performance Computing Systems, Gaming Consoles  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What is the primary function of power delivery circuitry in a GPU?
**A**: The primary function is to regulate and deliver stable, clean power to various GPU components, ensuring optimal performance and preventing voltage fluctuations that could cause damage or instability.

### Q: Why are both high-side and low-side MOSFETs used in GPU power delivery?
**A**: High-side and low-side MOSFETs work together in a synchronous buck converter configuration to efficiently switch and regulate voltage, minimizing power loss and heat generation compared to single-MOSFET designs.

### Q: How do capacitors contribute to GPU power delivery stability?
**A**: Capacitors filter noise and smooth voltage output by storing and releasing electrical charge, with input capacitors stabilizing incoming power and output capacitors maintaining consistent voltage to GPU components.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Power Delivery Circuitry](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/power-delivery-circuitry)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **4** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: POWER_DELIVERY_CIRCUITRY | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 7540c2d5
