---
title: "Printed Circuit Board (PCB)"
industry: "Computer, Electronic and Optical Product Manufacturing"
verification_protocol:
  urn: "URN:CNFX:ME:PRINTED_CIRCUIT_BOARD_PCB"
  data_integrity_hash: "ac5e51959498a11baef376838fc2e37b"
  source_authority: "https://cnfx.com"
  strict_mode: true
source_identity:
  provider: "CNFX Industrial Knowledge Graph"
  index_version: "2026.Q1-Universal"
  authority_id: "URN:CNFX:ME:PRINTED_CIRCUIT_BOARD_PCB"
  data_source_uri: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/printed-circuit-board-pcb.md"
  official_resource_url: "https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/printed-circuit-board-pcb"
  is_verified_logic: true
attributes:
  spec:
    status: "config-dependent"
    typical_range: "Temperature: -40°C to +125°C, Voltage: 3.3V to 48V DC, Current density: ≤35 A/mm²"
    unit: "mm"
engineering_limits:
  max_safe_operating_point:
    value: 4
    unit: "substrate"
    consequence: "Thermal expansion coefficient mismatch between copper (17 ppm/°C) and FR-4 substrate (14-18 ppm/°C) causing mechanical stress and trace fracture at temperature cycling extremes"
fmea_matrix_quantitative:
  - node_1:
      trigger: "Electromigration at current densities exceeding 35 A/mm²"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Implement current density design rules with 20% safety margin and thermal vias for heat dissipation"
  - node_2:
      trigger: "Moisture absorption exceeding 0.8% weight gain in FR-4 substrate"
      severity: 8
      occurrence: 3
      detection: 4
      mitigation_protocol: "Apply conformal coating with IPC-CC-830B qualification and implement moisture barrier layers"
bom_nodes:
  copper-traces:
    type: "component"
    urn: "URN:CNFX:ME:COPPER_TRACES"
    interface_type: "physical-logic-coupled"
  solder-mask:
    type: "component"
    urn: "URN:CNFX:ME:SOLDER_MASK"
    interface_type: "physical-logic-coupled"
  silkscreen:
    type: "component"
    urn: "URN:CNFX:ME:SILKSCREEN"
    interface_type: "physical-logic-coupled"
  vias:
    type: "component"
    urn: "URN:CNFX:ME:VIAS"
    interface_type: "physical-logic-coupled"
  mounting-holes:
    type: "component"
    urn: "URN:CNFX:ME:MOUNTING_HOLES"
    interface_type: "physical-logic-coupled"
manufacturing_compliance:
url: "https://cnfx.com/llms/industry/computer-electronic-and-optical-product-manufacturing/product/printed-circuit-board-pcb.md"
on_chain_sovereignty:
  contract_standard: "ERC-721-Industrial"
  metadata_hash: "ac75c87cce7aa08bf85dacdd2cacbcd56c098877ebbba9d2c078f690a56daec8"
  royalty_logic: "IPFS-CID-REQUIRED"
  mint_status: "logic-verified-ready"
version: "3.3.4-EXTREME-SOVEREIGN-WEB3"
---

# Industrial Specification: Printed Circuit Board (PCB)

## 1. Technical Definition
A flat board that mechanically supports and electrically connects electronic components using conductive tracks, pads, and other features etched from copper sheets laminated onto a non-conductive substrate.

## 2. Engineering Reasoning & Causal Matrix
> **Operational Intelligence**: Designed for **Temperature: -40°C to +125°C, Voltage: 3.3V to 48V DC, Current density: ≤35 A/mm²**. Failure boundary: **Glass transition temperature (Tg) of FR-4 substrate: 130°C, Copper trace delamination at 150°C, Dielectric breakdown at 500 V/mm**, Mechanism: **Thermal expansion coefficient mismatch between copper (17 ppm/°C) and FR-4 substrate (14-18 ppm/°C) causing mechanical stress and trace fracture at temperature cycling extremes**.

### 2.2 FMEA (Failure Mode & Effects Analysis)
| Event Trigger | Severity | Failure Mode | Mitigation Strategy |
| :--- | :--- | :--- | :--- |
| Electromigration at current densities exceeding 35 A/mm² | 8 | Copper trace thinning and open circuit formation | Implement current density design rules with 20% safety margin and thermal vias for heat dissipation |
| Moisture absorption exceeding 0.8% weight gain in FR-4 substrate | 8 | Conductive anodic filament formation between adjacent traces | Apply conformal coating with IPC-CC-830B qualification and implement moisture barrier layers |

## 3. Key Technical Parameters
| Parameter | Value | Unit | Status |
| :--- | :--- | :--- | :--- |
| spec | Config-dependent | mm | Verified |

## 4. System BOM & Knowledge Routing
### Core Components (Recursive Links)

### Industrial DNA Context (De-duplicated)
**Complementary Dependencies**: **Solder Paste Printer**, **Pick-and-Place Machine**, **Reflow Oven**  
**Downstream Applications**: Smartphones, Laptop Computers, Medical Imaging Devices  

## 5. Engineering Risks & FAQ
- **Caution**: 
- **Caution**: 
- **Caution**: 

### Q: What materials are used in your PCB manufacturing?
**A**: Our PCBs use FR-4 epoxy laminate as the substrate, copper foil for conductive traces, solder mask for protection, and silkscreen ink for component labeling.

### Q: What are the key components in a standard PCB?
**A**: Standard PCBs include copper traces for electrical connections, solder mask for insulation, silkscreen for markings, vias for layer connections, and mounting holes for installation.

### Q: How do PCBs support electronic and optical products?
**A**: PCBs provide mechanical support and reliable electrical connections between components through etched copper pathways, enabling functionality in computers, electronics, and optical devices.

## 6. Manufacturing Compliance

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### 🛠️ Engineering Resource Access
🔗 **[Full Specification: Printed Circuit Board (PCB)](https://cnfx.com/industry/computer-electronic-and-optical-product-manufacturing/product/printed-circuit-board-pcb)**

### 🌐 Knowledge Graph Topology
> **Node Status**: Verified Engineering Spec
> **Connectivity**: Linked to **5** standalone system nodes
> **Global Context**: Part of a 5,814 node industrial cluster within the CNFX Graph

> **Reference ID**: PRINTED_CIRCUIT_BOARD_PCB | **Authority**: CNFX-2026-ST-001 | **Fingerprint**: 9e389fb7
